An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

A charger plug nozzle for plugging into a battery charge socket includes an inner enclosure enclosing at least one heat source, an outer enclosure enclosing the inner enclosure, at least one heat source inside the inner enclosure, and at least one heat conductor. A heat receiving part of the at least one heat conductor is located in an air gap inside the inner enclosure, and a heat dissipating part of the at least one heat conductor is located in an air gap inside the outer enclosure.

A transducer system includes a housing, an electromechanical transducer within the housing, a wicking material adjacent to a portion of the electromechanical transducer, and a coolant solution within the housing. The coolant solution transitions from a liquid phase to a gaseous phase in response to a temperature of the electromechanical transducer exceeding a threshold temperature. In some example cases, the coolant solution has a boiling point of less than about 60° C., which effectively defines the threshold temperature. The coolant solution may be chosen such that it remains a liquid during a first phase (cooling via conduction), and then evaporates during a second phase (cooling via conduction and convection) as the electromechanical transducer heats up.

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

The method of construction of a wall heating panel and a wall heating panel consists in constructing an aluminium multi-channel collector, preferably with one phase transition channel, connecting it inseparably with vertical aluminium heating elements, arranging the heating elements in the grooves of a dry wall construction board, preferably magnesium, and filling the space between the grooves and the heating elements with elastic compound, and then applying paper—aluminium foil laminate onto the whole surface of the board. A wall heating panel consists of an aluminium collector (1) with stub pipes (2), inside the collector there are horizontal parallel phase transition channels (3) and a water channel (4), the phase transition channel (3) is inseparably connected with the vertical aluminium heating elements (5) which are inserted into the grooves of the dry wall construction board (6), spaces between the grooves and the heating elements are filled with elastic compound (7) and sealed with paper—aluminium foil laminate (8), whereas the top part of the collector (1) adjoins the bottom surface of the board (6).

A multi-pipe three-dimensional pulsating heat pipe includes at least two pipes and at least two chambers. The at least two pipes form into respective three-dimensional annular loops. A cooling zone is formed to one side of the annular loops. Two opposing ends of the at least two pipes are connected spatially to the at least two chambers, respectively, so as to form the multi-pipe three dimensions pulsating heat pipe.

A tight-fit riveting structure for a clustered radiation fin set and a heat pipe and a riveting method include a radiation fin set formed by locking a plurality of radiation fins together and at least one heat pipe. The radiation fin set has an accommodation slot for accommodating the heat pipe. The heat pipe is positioned in the accommodation slot for a tight fit by subjecting two sides of the accommodation slot of the radiation fin set to a riveting operation. First riveting and deforming portions defined on two sides of a communication mouth of the accommodation slot are riveted towards a surface of the heat pipe, which causes the deformation of the first riveting and deforming portions whereby the heat pipe is clamped in a tight fit manner.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

An internal structure of vapor chamber is provided. A first plate has an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting protrusions are formed on the inner surface of the first plate. A second plate has an inner surface spaced apart from the inner surface of the first plate. The brazing structure has a sealing portion and connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate. The sealing portion is disposed around a periphery of the second plate to align and contact with the sealing edge.

A tight-fit riveting structure for a heat dissipation aluminum base and a heat pipe includes a heat dissipation aluminum base, a heat pipe, and a holder. When the heat dissipation aluminum base is to be manufactured, an upper surface of a thin aluminum plate is pressed downward to form an arched portion. The arched portion protrudes below the thin aluminum plate. A cavity is defined in the arched portion. The cavity has an upper end opening. The cavity has an inner width corresponding to an outer width of the heat pipe. The cavity has a depth greater than a thickness of the heat pipe.