A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.

An evaporative cooler which includes a sealed loop of conduit with a first portion in a space to be cooled and a second portion in a space where heat is rejected, a volume of working fluid, and a fan inside the conduit loop. The fan forces air over the working fluid to accelerate its evaporation, which requires heat. Evaporation creates vapor-enriched air which carries heat and is forced by the fan to the second portion. Within the second portion, the vapor-enriched air rejects the absorbed heat before being forced back to the first portion. In certain cases, a portion of the working fluid in the vapor-enriched air condenses out and drains or is pumped back to the first portion. In certain uses, the cooler provides cooling to an area. In other uses, the cooler captures vaporized water, producing an impurity-free condensate for removal or use.

A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.

A temperature control apparatus is disposed in a first environment and a second environment. The temperature control apparatus includes a heat exchanging unit and a working fluid. The heat exchanging unit is independently disposed and divided into a first heat exchanging portion and a second heat exchanging portion. The heat exchanging unit includes a pipe and a plurality of heat-dissipating fins for cooling the pipe. Two ends of the pipe are connected to from a closed pipe. The pipe runs in the first and the second heat exchanging portions alternately. The heat-dissipating fins are not continuously disposed in the first heat exchanging portion and the second heat exchanging portion. The first heat exchanging portion is correspondingly disposed at the first environment. The second heat exchanging portion is correspondingly disposed at the second environment. The working fluid flows in the pipe.

A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.

A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.

A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

A liquid-vapor composite heat dissipation system includes a heat exchange device filled with a working fluid, a number of liquid-vapor composite heat dissipation units that are positioned higher than the heat exchange device, each of the liquid-vapor composite heat sink units having a housing with an internal capillary occupying the interior of the housing and partially separating a spatially disconnected inlet chamber and an outlet chamber. The bottom of the housing is attached to a heat source. A liquid supply tube is connected to the heat exchange device at one end, and at the other end to a liquid inlet of each of the liquid-vapor composite heat sink units through each of the liquid supply pipes. A liquid return tube is connected to the heat exchange device at one end, and to each of the liquid-vapor composite heat sink units at the other end through each of the return pipes.

A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

A loop heat pipe includes a reservoir, an evaporator adjacent to the reservoir, and a condenser including a condenser inlet and a condenser outlet. The loop heat pipe further includes a vapor transport line connecting the evaporator to the condenser inlet, a liquid transport line connecting the condenser outlet to the evaporator, and a vapor bypass joining the vapor transport line near the condenser inlet and joining the liquid transport line near the condenser outlet. The vapor bypass includes a vapor bypass housing. The vapor bypass housing includes a temperature. The loop heat pipe also includes a thermally-controlled connection between the vapor bypass housing and the condenser, and a thermal controller connected to the thermally-controlled connection and regulating the temperature of the vapor bypass housing via the thermally-controlled connection.