A composite VC heat sink containing a copper/diamond composite wick structure and a method for preparing the same are provided. The VC heat sink includes a lower shell plate. The lower shell plate is provided with a recess at a center position of an inner surface and provided with a boss with a same plane size as the recess at a center position of an outer surface, and a surface of the boss or a surface of the recess is provided with a copper/diamond composite plate. The copper/diamond composite wick structure has a three-dimensional porous structure and uses a copper/diamond sintered body as a matrix, a surface of the matrix is provided with a diamond layer, and a surface of the diamond layer is provided with a metal hydrophilic layer. The heat dissipation performance of the composite VC heat sink is maximized under the cooperation of structure and materials.

The present invention provides a phase change cold storage device having vortex coiled tubes, which falls within the technical field of low temperatures and comprises an inlet tube, an outlet tube, a tube plate, a baffle plate, vortex coiled tubes, a cylinder body, a central tube, a support frame, a seal head and a saddle, wherein the tube plate is fixedly connected to the cylinder body, a lower end position and a central position of the tube plate are respectively perforated, the inlet tube and the outlet tube are respectively connected to a lower end position and a central position of the tube plate, the baffle plate and the vortex coiled tubes are mounted on the central tube, one end of the central tube is fixed on the tube plate, and the other end is inserted through the support frame connected to the cylinder body, the head is connected to the cylinder, provided on the opposite side of the inlet and outlet tubes, and the saddle is provided below the cylinder. The present invention has a compact structure, is easy to manufacture, and easily enhances heat transfer with vortex coiled tubes, and at the same time, has a good cold storage effect and a wide application range.

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm.sup.3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.

The present invention discloses a heat dissipation table made of an alloy material and with a special waterway design, comprising a sample placing table, a graphene heating structure abutted against the sample placing table, a heat dissipation structure abutted against the graphene heating structure and a protective cover for wrapping the heat dissipation structure. The heat dissipation structure comprises a heat dissipation table abutted against the graphene heating structure and a heat dissipation pipeline communicated with the heat dissipation table; a water pipe through groove is formed in the middle part of the heat dissipation table; and the heat dissipation pipeline is embedded into the water pipe through groove. A plurality of waterway annular grooves are formed in the heat dissipation table and communicated with the water pipe through groove. According to the present invention, the demand of diamonds on heat dissipation with high power can be met, and the cost is low.

An additively manufactured heat exchanger configured to transfer heat between a first fluid and a second fluid includes a first channel with a first wall configured to port flow of a first fluid and a second channel with a second wall configured to port flow of a second fluid. The heat exchanger also includes a barrier channel containing unprocessed build powder provided by the additive manufacturing process and is located between the first wall and the second wall. The barrier channel is configured to prevent mixing of the first fluid and the second fluid when one of the first wall and the second wall ruptures.

graphite composite laminated heat-dissipating structure and a manufacturing method thereof are disclosed. The structure includes a metal substrate and a graphite heat-dissipating layer. The metal substrate has a first surface having a roughness ranging between 0.01 and 10 μm. The graphite heat-dissipating layer is composed of pure graphite and is directly formed on the first surface by means of physical vapor deposition using a carbon sputtering target. The graphite heat-dissipating layer has a thickness ranging between 0.05 and 2 μm. The manufacturing method includes S1: directly forming a graphite heat-dissipating layer on a first surface of a metal substrate by means of physical vapor deposition using a carbon sputtering target after the metal substrate has received plasma treatment or infrared heating; and S2: stopping the physical vapor deposition when the graphite heat-dissipating layer has a thickness ranging between 0.05 and 2 μm.

A composite thermal dissipator and a method for fabricating the same is disclosed. The composite thermal dissipator includes a molded polydimethylsiloxane (PDMS) composite material composed of a powdered metal mixed with PDMS. The method for fabricating a composite thermal dissipator includes mixing a powdered copper into liquid PDMS to form a liquid mixture, and pouring the liquid mixture into a sacrificial wax mold. The sacrificial wax mold includes wax shaped to be complementary to the composite thermal dissipator. The method also includes curing the liquid mixture within the sacrificial wax mold, and removing the composite thermal dissipator from the sacrificial wax mold by melting away the wax.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.