An aftercooler device with ribs for aligning cooling tubes in a twelve-pass configuration provides a heat exchanger that transfers optimal amount of heat from combustion air through use of a tortuous, back-and-forth arrangement of twelve rows of tubes carrying a coolant fluid, and creating agitation therein for efficient cooling. The cooling tubes are organized into separate rows through heat exchanger body. A top cover fastens to the top end of heat exchanger body. The top cover includes six top ribs that segregate cooling tubes into six rows at top end of the heat exchanger. Four of the top ribs are linear, and two of the top ribs have angled configurations. A bottom cover fastens to the bottom end of the heat exchanger. The top cover includes five bottom ribs that segregate the cooling tubes into six rows at bottom end of heat exchanger. The bottom ribs have a linear configuration.

A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.

A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.

A transfer tube for a thermal transfer device can include at least one wall having an inner surface and an outer surface, where the inner surface forms a cavity, where the at least one wall further has a first end and a second end. The first end can be configured to couple to a terminus of a heat exchanger of the thermal transfer device. The second end can be configured to couple to a collector box of the thermal transfer device. At least a portion of the at least one wall can be disposed in a vestibule of the thermal transfer device. The cavity can be configured to simultaneously receive a first fluid that flows from the first end to the second end and a second fluid that flows from the second end to the first end.

A plate heat exchanger comprising a top head, a bottom head, four side panels and four corner girders. The side panels and the corner girders extend along a longitudinal direction from the bottom head to the top head, and each side panel is associated with two corner girders. The top head, the bottom head, the four side panels and the four corner girders are joined together to form a sealed enclosure for housing a plate pack of stacked heat-exchanging plates. A continuous gasket assembly is arranged in a contact region between at least one side panel and two corner girders, the top head and the bottom head. The gasket assembly is located in a groove. Moreover, the gasket assembly is a segmented gasket assembly composed of plural gasket segments, and each gasket segment is made of graphite material. Also disclosed is a method for assembling such a plate heat exchanger.

A transfer tube for a thermal transfer device can include at least one wall having an inner surface and an outer surface, where the inner surface forms a cavity, where the at least one wall further has a first end and a second end. The first end can be configured to couple to a terminus of a heat exchanger of the thermal transfer device. The second end can be configured to couple to a collector box of the thermal transfer device. At least a portion of the at least one wall can be disposed in a vestibule of the thermal transfer device. The cavity can be configured to simultaneously receive a first fluid that flows from the first end to the second end and a second fluid that flows from the second end to the first end.

A heat exchange device may include a first pipe including a first inlet, a first outlet, and a first sidewall extending therebetween; a second pipe including a second inlet, a second outlet, and a second sidewall extending therebetween; and a plurality of dimples extending between the first sidewall and the second sidewall. The second sidewall may surround and extend about the first sidewall, the first sidewall may define a first fluid passage configured to permit flow of a first fluid, and the second sidewall and the first sidewall may define a second fluid passage configured to permit flow of a second fluid.

A processor can be damaged by a heat sink. If the heat sink is improperly installed, the heat sink may damage the processor and/or the motherboard. Sequential tightening of mechanical fasteners is thus recommended, but the sequential tightening is challenging to implement. Sequential tightening of fasteners helps reduce damage to a processor. When a heat sink is fastened over the processor to a motherboard, mechanical fasteners are tightened in a sequence to reduce damage to the processor. To ensure sequential tightening of the mechanical fasteners, the heat sink is first secured with only two of the mechanical fasteners preinstalled in two of four holes in the heat sink and sequentially tightened into a bolster plate on a bottom side of the motherboard. A cover is then installed over the heat sink, and the cover has two mechanical fasteners that align with a remaining two of the four holes in the heat sink. A remaining two of the mechanical fasteners may then be sequentially tightened into the bolster plate.

A heat exchanger system may have a base, a mounting apparatus for attaching the base to a device, a gasket shelf for placing a gasket, a dissipation member for dissipating heat, and heat generator attachment sites for absorbing heat. A mounting apparatus may have finger-like extensions which flex and draw the base into contact with an underlying electronic device from which the system conducts heat. A base may also have an integrated heat pipe clamp attachment forming an aperture in the base into which a heat pipe may extend and may be clamped in thermal communication. The dissipation device may be a series of fins and troughs and a fan may direct air over the dissipation device to cool the apparatus.

A heat pipe assembly adapted to an electronic device is provided. The heat pipe assembly includes at least one heat pipe, a bracket, and at least one fixing member. The heat pipe is disposed in a body of the electronic device. The bracket is assembled to a portion of the heat pipe, and positions and suspends the heat pipe in the housing. The fixing member is fixed to the bracket by penetrating the housing from an exterior of the housing, such that the bracket and the housing are fixed to each other. A heat pipe structure is also provided.