A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.

A heat dissipation device with forced coolant flow is provided which includes a base, coolant conduits, and a driving module. The conduit includes an inlet port, an extension segment, and an outlet port. The extension segment is connected to the base. The driving module includes a housing, a separating member, and two magnetic driving members. The separating member, being a thin magnetic plate, is positioned in the housing and defines a first chamber and a second chamber for coolant. The first chamber and the second chamber are connected to the inlet port and the outlet port and a flow of coolant can be initiated by alternating an electrical current feed to the two magnetic driving members on each side of the separating member.

Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

The present disclosure provides a water-cooling heat dissipation device, including a liquid guide assembly, a heat exchanger, a heat sink, and a water-cooling pump. The liquid guide assembly includes a first liquid guide pipe, a second liquid guide pipe, and a third liquid guide pipe; two ends of the first liquid guide pipe respectively communicate with the heat exchanger and the heat sink; two ends of the second liquid guide pipe respectively communicate with the heat exchanger and the water-cooling pump; two ends of the third liquid guide pipe respectively communicate with the water-cooling pump and the heat sink; and the water-cooling pump is fixed on the liquid guide assembly.

A heat dissipation device with forced coolant flow is provided which includes a base, coolant conduits, and a driving module. The conduit includes an inlet port, an extension segment, and an outlet port. The extension segment is connected to the base. The driving module includes a housing, a separating member, and two magnetic driving members. The separating member, being a thin magnetic plate, is positioned in the housing and defines a first chamber and a second chamber for coolant. The first chamber and the second chamber are connected to the inlet port and the outlet port and a flow of coolant can be initiated by alternating an electrical current feed to the two magnetic driving members on each side of the separating member.

Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

A device for coupling to a heat source, the device includes thermoelectric elements and a coupling magnet. The thermoelectric elements harvest heat to generate electric current. The coupling magnet provides a coupling force between the thermoelectric elements and the heat source. The coupling magnet regulates thermal flow between the thermoelectric elements and the heat source as a function of temperature of the coupling magnet. The device acts to protect the thermoelectric elements and other associated components from heat damage that might otherwise occur if the heat source generates too much heat.

Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

A wind turbine with a tower; a nacelle supported by said tower; at least one unit to be cooled and arranged in the tower or the nacelle; a tower mounted heat exchange structure arranged outside the nacelle and tower; and a circuit facilitating a flow of a fluid medium between the at least one unit and the heat exchange structure. To improve thermal convection with the ambient space, the heat exchange structure comprises a set of panels mutually angled and extending outwards from the tower such that a flow of ambient air can pass transversely trough the panels and thereby cool the unit.

Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.