Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

A frame (100) for a heat exchanger (1), wherein the frame (100) comprises a first arm (110) and a second arm (120) connectable together in a first connection (141) and in a second connection (142), so that the arms (110, 120) form a loop for encircling the heat exchanger (1), wherein at least one of the arms (110, 120) is adapted to restrict the movement of the heat exchanger (1) with respect to the frame (100) in at least one direction after assembly, characterized in that the first connection (141) is detachable and the second connection (142) enables movement of the first arm (110) with respect to the second arm (120) when the first connection (141) is detached.

The present disclosure relates to a thermal emissivity control system. The system may have a segmented array that makes use of a thermally conductive base layer configured to be connectable to an external heat generating subsystem, with the base layer including a thermally emissive surface. The array may also have a plurality of actuation elements at least one of positioned on or adjacent to the thermally emissive surface. A plurality of movable shutter elements is disposed adjacent one another in a grid pattern, and controlled in movement by the actuation elements to create gaps of controllably varying dimension therebetween. The shutter elements control at least one of a magnitude of, or direction of, thermal radiation through the gaps.

A bolted hinge assembly is provided for a waterbox cover (a “waterbox hinge assembly”). The waterbox hinge assembly generally does not require welding on the waterbox cover or the heat exchanger in an HVAC system (“HVAC unit” hereinafter). Further, the waterbox hinge assembly may be installable to the HVAC unit without removing the heat exchange fluids (e.g., water, refrigerant, etc.) from the HVAC unit. In some cases, the waterbox hinge assembly can be installed on an HVAC unit without removing any bolts from the waterbox cover. Once installed, the waterbox hinge assembly can be left in place so that it can be reused anytime the HVAC unit is serviced.

A two-phase immersion cooling device includes a tank, heating elements, a first condenser, and a lid. An accommodating cavity of the tank bottom accommodates a coolant. The heating elements are disposed in the accommodating cavity and immersed in the coolant. The first condenser is received in the accommodating cavity, located above the coolant and the heating elements, and disposed along sidewalls of the tank. At least one movable second condenser is fixed on the lid or a rear door and disposed in a cavity surrounded by the first condenser. The two-phase immersion cooling device increases the capacity of condensation heat transfer, and the condensation rate and the evaporation rate of the coolant in the tank are balanced, a pressure difference between an inside and an outside of the tank is reduced, a loss of coolant vapor is decreased, and a volume of the two-phase immersion cooling device is reduced.

A hetero-material floating heat pipe structure includes a main body and a multi-segment floating adjustment unit. The main body has a front end, a rear end and a flexible section disposed between the front end and the rear end. The flexible section has flexibility, whereby the main body is flexible. The multi-segment floating adjustment unit is disposed on an outer surface of the flexible section for restricting and protecting the flexible section. The multi-segment floating adjustment unit includes multiple adjustment members, which are pivotally connected with each other and stringed to form the multi-segment floating adjustment unit. Each of two ends of each adjustment member has a pivoted section. By means of the pivoted sections, the adjustment members are pivotally connected with each other and can be swung and bent by the same angle or by different angles to adjust the arrangement of the multi-segment floating adjustment unit.

A fan casing assembly, connection assembly and method for moving a fan casing cooler. The fan casing assembly for the turbine engine can include an annular fan casing with a peripheral wall having a flow path defined through the casing. A fan casing cooler can mount along the peripheral wall in order to confront a cooling fluid flow within the flow path in order to cool a fluid through the fan casing cooler.

A removable heatsink assembly adapted to removably receive a pipe. The removable heatsink assembly includes a first plurality of fins and a second plurality of fins having collar flanges sized to receive a pipe. The fins are received on first and second spacer rods, respectively and are hingedly connected by a hinge rod such that the first and second plurality of fins are pivotally movable about the hinge rod between an open position and a closed position. In the open position, the first and second plurality of fins are positionable over the pipe. In the closed position, the collar flanges of the first and second plurality of fins substantially surround the pipe. A fin clamp secures the first and second plurality of fins together in the closed position about the pipe.

A method of induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) includes inductively heating a weld interface area between the first TPC and the second TPC, and cooling a surface of the first TPC opposite the weld interface area while inductively heating the weld interface area.

Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.