A thermal device includes a plate defining a plurality of convex curves and a plurality of concave curves. Each convex curve is positioned between a pair of adjacent concave curves of the plurality of concave curves. Each concave curve is positioned between a pair of adjacent convex curves of the plurality of convex curves. Each concave curve defines a vertex. The thermal device also includes a plurality of pins. Each pin of the plurality of pins extends from the vertex of a different concave curve of the plurality of concave curves and extends away from the plate.

Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

A system and method of forming integrated power electronic packages includes 3D-printing a cold plate having a hollow interior recess and a plurality of fins. The method includes printing, using a 3D printer, an electrical insulation layer and a conductor substrate onto a top surface of the cold plate, such that the electrical insulation layer and conductor substrate are embedded within the top surface of the cold plate. The method further includes embedding power devices in the conductor substrate, printing, using a 3D printer, a circuit board on and around the power devices, and mounting electronic components on the circuit board.

A curved cross-flow heat exchanger including a first flow path for a first fluid stream which is arranged substantially at right angles to a second flow path for a second fluid stream, wherein: the first flow path is confined within one or more heat exchanger sections that bridge between opposite sides of the heat exchanger, the one or more heat exchanger sections having a leading edge positioned in the second flow path, wherein each of the one or more heat exchanger sections is a curved laminated heat exchanger section and comprises a leading edge that is curved in a direction normal to the second flow path.

An embodiment relates to a heat transfer device including a heat generating device configured to generate heat having predetermined intensity by a user, a cover in contact with a body of the user while covering the heat generating device, and a heat transfer medium provided between the heat generating device and the cover to transfer the heat generated by the heat generating device, wherein the heat transfer medium is a structure that is formed by entangling a single wire having a predetermined length and has a predetermined width and a predetermined height, and is a structure that is compressed in an axial direction when being in contact with the body of the user and thus has a Poisson's ratio of 0.5 or higher. Thus, a structural change in the heat generating device is not required and only a material in contact with the heat generating device is changed, so that generated heat may more rapidly reach the body of the user.

According to various aspects, exemplary embodiments are provided of heat exchangers and applications. In an exemplary embodiment, a heat exchanger can include at least a first feature array and a second feature array, a channel in an interior of the heat exchanger, through which a fluid can flov, an inlet for the fluid to enter the channel, an outlet for the fluid to exit the channel. The channel may include at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel, the fluid configured to flow from said inlet, through said channel to said outlet, and the first and second feature arrays have different densities.

A liquid-cooled-type cooling device includes a casing having a top wall, a bottom wall, and a cooling-liquid passage, and a radiating member disposed in the cooling-liquid passage. The radiating member has a substrate and a plurality of pin-shaped fins. Longitudinally intermediate portions of the pin-shaped fins are brazed to the substrate. The substrate has a plurality of fin insertion holes, and the pin-shaped fins are inserted into the fin insertion holes of the substrate. A plurality of convex portions are integrally formed on the longitudinally intermediate portion of each pin-shaped fin. The substrate and the pin-shaped fins are provisionally fixed together by plastically deforming the convex portions such that they are crushed. In this state, the substrate and the pin-shaped fins are brazed together. The upper and lower end portions of the pin-shaped fins are brazed to the top wall and bottom wall, respectively, of the casing.

A heat exchanger has a plurality of outer walls and at least one inner wall. A first fluid port communicates a first fluid into a chamber on one side of the at least one inner wall and a second port communicates a second fluid into a second chamber on an opposed side of the at least one inner wall. A plurality of pins extends from the inner wall in at least one of the chambers. The plurality of pins has a generally frusto-conical outer surface. A method is also disclosed and claimed.

A pin fin cooling system may include at least one first surface defining at least a base portion of the cooling system, and at least one pin fin array of a plurality of pin fins and at least one coolant fluid flow detector extending from the first surface. The coolant fluid flow deflector may be configured to split a coolant fluid flow from a primary flow into at least two secondary flows that follow a predetermined path over local heat sources, and may have a maximum wall thickness that is equal to a diameter of a cross-section of one of the pin fins. The cooling system may further include at least one boundary fin extending from the first surface that is in the shape of a spline, at least a portion of which may correspond and match at least a portion of a pattern of the pin fin array.

In a method for the production of a cooling plate from a material having thermal conductivity, a workpiece in the form of a flat material blank with uniform material thickness is placed into a tool. The workpiece is pressed in a first stage by an inner punch of the tool to form in cooperation with pin forming openings of the tool pins upon an effective surface swept by the coolant, as the workpiece is held down by an outer punch of the tool, such that the pins protrude approximately perpendicular over a base area of the workpiece. In a second stage, the workpiece is pressed by the outer punch such as to form an essentially radially extending, flat peripheral edge of reduced material thickness in surrounding relation to the pins, as the workpiece with the formed pins is held down by the inner punch of the tool.