A cooling system for a wind tunnel is disclosed. The heat exchanger of the present disclosure is formed as a turning vane in an airflow duct of a re-circulating wind tunnels. The individual vanes are formed from extruded aluminum with coolant fluid channels running continually down the length of the vane. One or more channels can be used, depending on the application of vane and the cooling capacity needed. The exterior of the vanes are formed in an airfoil shape to efficiently turn the air flow the desired amount in a manner well known in the art. The turning vanes are connected to a fluid supply with single piece connectors that removably attach to the turning vanes. In the depicted embodiment the connectors are attached with screws. In the depicted embodiment the connectors are formed as a single piece in a two-piece injection mold.

A modular system for heat exchange between fluids includes a plurality of open elements that, by means of two end plates, are connected together. An open element is constituted of a folded and sealed sheet material that is arranged in a frame.

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

A heat dissipation device includes a heat sink, a centrifugal fan, and a fixing member. The centrifugal fan is enclosed and attached to a heat sink by a fixing member. Air sucked into the centrifugal fan takes away from the heat sink the accumulated heat from an electrical component of an electronic device.

A heat exchange pipe joint includes a first pipe and a second pipe that are separately formed and in communication with each other. The first pipe is detachably connected to a second side of the installation plate, and the second pipe is detachably connected to a first side of the installation plate. When the heat exchange pipe joint is applied to the battery pack, the heat exchange pipe joint in a split-structure requires a small operation space for detachment and installation. In this case, a process of taking out the entire heat exchange pipe joint from the case can be avoided. In this way, the detachment and installation of the heat exchange pipe joint can be easy and convenient, thereby facilitating the reparation process thereof.

The present disclosure provides a heat exchange pipe joint and a battery pack. The heat exchange pipe joint is fixedly installed to an installation plate. The heat exchange pipe joint includes a first pipe and a second pipe that are separately formed and in communication with each other. The first pipe is detachably connected to a second side of the installation plate, and the second pipe is detachably connected to a first side of the installation plate. When the heat exchange pipe joint of the present disclosure is applied to the battery pack, the heat exchange pipe joint in a split-structure requires a small operation space for detachment and installation. In this case, a process of taking out the entire heat exchange pipe joint from the case can be avoided, so that the battery module and other components inside the case do not interfere with the detachment and installation of the heat exchange pipe joint. In this way, the detachment and installation of the heat exchange pipe joint can be easy and convenient, thereby facilitating the reparation process thereof.

A heat exchanger assembly includes a frame; first and second heat exchanger panels configured for exchanging heat with air pulled into the heat exchanger assembly and disposed in a V-configuration; a fan for pulling air into an enclosed space of the heat exchanger assembly; a plurality of lateral enclosing panels and at least one middle enclosing panel. The at least one middle enclosing panel extends perpendicular to the lateral enclosing panels and is disposed between the heat exchanger panels. A U-shaped lower end of the at least one middle enclosing panel includes first and second wall portions opposite one another. The lower ends of the heat exchanger panels abut the wall portions such that the wall portions are deflected relative to one another by forces exerted thereon by the lower ends causing a first and second seals to form between the wall portions and the heat exchanger panels.

A mount for connecting a heat sink to a PCB may include a threaded post extending along an axis, a first barrel adjacent to the post along an axis and having a larger axial cross-section than the post, and a threaded second barrel defining an opposite end of the mount from the post and having a larger axial cross-section than the first barrel.

A heat exchanger assembly has a frame including: a plurality of legs; first and second lower transversal members extending perpendicular to and interconnecting the legs; a plurality of upstanding members extending upwardly from respective ones of the legs, a lower end of each upstanding member being connected to a corresponding leg at a junction therebetween; an upper transversal member interconnecting upper ends of the upstanding members; and an upper frame assembly. The frame components are weldlessly connected to one another. First and second heat exchanger panels exchange heat with air pulled into the heat exchanger assembly and are disposed in a V-configuration. An upper end of each heat exchanger panel is connected to upper retaining members of the upper frame assembly. A fan pulls air into the enclosed space of the heat exchanger assembly via at least one of the heat exchanger panels.

A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.