Patent classifications
G01B11/06
NON-INVASIVE QUANTITATIVE MULTILAYER ASSESSMENT METHOD AND RESULTING MULTILAYER COMPONENT
An automated system is provided. The system includes: a manipulator coupled to: an opening forming device configured to create an opening having a predefined geometry partially into a multilayer component at a selected location on a surface of the multilayer component, where the multilayer component includes a plurality of material layers including at least a substrate and a bond coat, and where the opening exposes each of the plurality of material layers; and an imaging device configured to create an image of the exposed plurality of material layers in the opening; and a processor configured to calculate at least a thickness of the bond coat of the exposed plurality of material layers from the image and based on the predefined geometry of the opening. Methods of using the system to analyze layer thickness of a multilayer component and repair a multilayer component are also provided.
Measuring thin films on grating and bandgap on grating
Methods and systems disclosed herein can measure thin film stacks, such as film on grating and bandgap on grating in semiconductors. For example, the thin film stack may be a 1D film stack, a 2D film on grating, or a 3D film on grating. One or more effective medium dispersion models are created for the film stack. Each effective medium dispersion model can substitute for one or more layers. A thickness of one or more layers can be determined using the effective medium dispersion based scatterometry model. In an instance, three effective medium dispersion based scatterometry models are developed and used to determine thickness of three layers in a film stack.
Measuring thin films on grating and bandgap on grating
Methods and systems disclosed herein can measure thin film stacks, such as film on grating and bandgap on grating in semiconductors. For example, the thin film stack may be a 1D film stack, a 2D film on grating, or a 3D film on grating. One or more effective medium dispersion models are created for the film stack. Each effective medium dispersion model can substitute for one or more layers. A thickness of one or more layers can be determined using the effective medium dispersion based scatterometry model. In an instance, three effective medium dispersion based scatterometry models are developed and used to determine thickness of three layers in a film stack.
FILM THICKNESS MEASUREMENT METHOD, FILM THICKNESS MEASUREMENT DEVICE, AND FILM FORMATION SYSTEM
There is provided a film thickness measurement method which measures a film thickness of a specific film to be measured in a multilayer film in situ in a film formation system that forms the multilayer film on a substrate, the method comprising: regarding a plurality of films located under the film to be measured as one underlayer film, measuring a film thickness of the underlayer film, and deriving an optical constant of the underlayer film by spectroscopic interferometry; and after the film to be measured is formed, deriving a film thickness of the film to be measured by spectroscopic interferometry using the film thickness and the optical constant of the underlayer film.
Sensor device for examining the coating of a disc
The invention relates to a sensor device for examining the coating of a disc as part of a coating process. The sensor device comprises a first optical sensor system for determining the layer thickness of the coating applied to the disc, and comprises a rotation apparatus. The invention is characterized in that the first optical sensor system is designed to simultaneously identify at least one first position-based measured value and one second position-based measured value, the first and the second position-based measured value describing the distance between the sensor systems and the surface of the disc. As a result of this, the sensor system is configured such that the first position-based measured value of a coated region of the disc and the second position-based measured value of an uncoated region of the disc are identified. Furthermore, the first optical sensor system comprises at least one linear guide, which extends from the central region to the edge. In addition, a control and analysis apparatus is provided for calculating the layer thickness of the disc at the position of the first position-based measured value with the aid of the first and the second position-based measured value. Furthermore, the invention relates to a coating for a disc, comprising inspecting the coating for determining the layer thickness of the coating applied to the disc.
TEST SYSTEM AND METHOD FOR EXAMINING A HOLLOW BODY
A test system for examining a hollow body, in particular a cylinder bore in an engine block, comprises a measuring apparatus comprising an elongate body and a plurality of sensors which are connected to the body and are set up to carry out a distance measurement. The test system also comprises electronic control means which are set up to move the measuring apparatus into a hollow body to be examined and to determine an internal diameter of the hollow body on the basis of distance measurement data from the sensors. In order to examine hollow bodies of different diameters, at least some of the sensors are in the form of movable sensors which can be moved relative to the elongate body of the measuring apparatus. The electronic control means are also set up to select a measuring position of the movable sensors relative to the elongate body on the basis of a hollow body to be examined. A calibration station is provided and the electronic control means are set up to carry out a calibration process for the movable sensors. A corresponding method is also disclosed.
WAFER TRANSFER DEVICE
An embodiment comprises: a guide moving in the vertical direction or the horizontal direction; a transfer arm provided on the guide and loading spaced apart wafers; a laser emission unit disposed on the guide and emitting first laser beams at the spaced apart wafers loaded on the transfer arm; and a laser detection unit disposed below the transfer arm and collecting, from among the first laser beams, second laser beams having passed through gaps between the spaced apart wafers.
LIQUID SURFACE INSPECTION DEVICE, AUTOMATED ANALYSIS DEVICE, AND PROCESSING DEVICE
Provided are a liquid surface inspection device, an automated analysis device, and a liquid surface inspection method with which instances of contamination can be minimized and the accuracy of the manner in which the surface conditions, such as bubbles or the like, of a liquid substance are detected can be enhanced. The device has: a light illumination unit for illuminating a container holding a liquid substance, as well as the surface of the liquid substance, with light; an image capture unit for acquiring a video image having at least color information and brightness information of light from the container and the liquid substance which are illuminated by the light illumination unit; and a detection unit for using the color information and brightness information in the video image captured by the image capture unit to detect the condition of the liquid surface.
METHOD AND COATING SYSTEM FOR COATING CAVITY WALLS
The invention relates to a method for coating cavity walls, in particular cylinder bores of engine blocks, In the method, a coating is applied to a cavity wall using a coating lance. In addition, a cavity diameter is measured using a measuring apparatus. According to the invention, the method is characterized in that at least a plurality of diameter values of a first cavity are measured at different heights of the first cavity using the measuring apparatus, and in that a coating of variable thickness is applied to a wall of the first or a second cavity using the coaling lance, the thickness of said coating of variable thickness being dependent on the determined diameter values. The invention additionally describes a corresponding coating system.
Light interference system and substrate processing apparatus
A light interference system is provided. The light interference system includes a light source configured to generate a measurement light; a fiber configured to propagate therethrough the measurement light; and a measurement device. The fiber includes a single-mode fiber, a multimode fiber and a connector connecting the single-mode fiber and the multimode fiber. A tip end of the fiber is formed of the multimode fiber, and an end surface of the tip end of the fiber is configured to emit the measurement light to a measurement target object and receive a reflection light from the measurement target object. The measurement device is configured to measure physical property of the measurement target object based on the reflection light.