A system comprises a faceted structure imaging assembly and a faceted structure image analyzer. The system is configured to determine carat weight of a gemstone while in a mounted setting. In a first mode, the imaging assembly obtains a first image of a top gemstone surface. The image analyzer uses the first image to obtain at least one gemstone dimension, such as table and diameter dimensions. In a second mode, the imaging assembly obtains a second image of the top gemstone surface while a colored light pattern is reflected onto the gemstone. The image analyzer uses the second image to obtain at least one other gemstone dimension, such as crown and pavilion angles. The image analyzer uses the dimensions obtained from the first and second images to determine weight information of the gemstone. The system quickly determines gemstone weight reliably and consistently without skilled gemologists or removal from the setting.

A system comprises a faceted structure imaging assembly and a faceted structure image analyzer. The system is configured to determine carat weight of a gemstone while in a mounted setting. In a first mode, the imaging assembly obtains a first image of a top gemstone surface. The image analyzer uses the first image to obtain at least one gemstone dimension, such as table and diameter dimensions. In a second mode, the imaging assembly obtains a second image of the top gemstone surface while a colored light pattern is reflected onto the gemstone. The image analyzer uses the second image to obtain at least one other gemstone dimension, such as crown and pavilion angles. The image analyzer uses the dimensions obtained from the first and second images to determine weight information of the gemstone. The system quickly determines gemstone weight reliably and consistently without skilled gemologists or removal from the setting.

Dynamic thin film interferometry is a technique used to non-invasively characterize the thickness of thin liquid films that are evolving in both space and time. Recovering the underlying thickness from the captured interferograms, unconditionally and automatically is still an open problem. A compact setup is provided employing a snapshot hyperspectral camera and the related algorithms for the automated determination of thickness profiles of dynamic thin liquid films. The technique is shown to recover film thickness profiles to within 100 nm of accuracy as compared to those profiles reconstructed through the manual color matching process. Characteristics and advantages of hyperspectral interferometry are discussed including the increased robustness against imaging noise as well as the ability to perform thickness reconstruction without considering the absolute light intensity information.

A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.

One example of an inspection system includes a laser, a magnification changer, and a first camera. The laser projects a line onto a wafer to be inspected. The magnification changer includes a plurality of selectable lenses of different magnification. The first camera images the line projected onto the wafer and outputs three-dimensional line data indicating the height of features of the wafer. Each lens of the magnification changer provides the same nominal focal plane position of the first camera with respect to the wafer.

Systems and methods provide for detection and controlled interaction with one or more objects. The system can include an imaging subsystem (20), a tool subsystem (26) containing one or more tools, a stage subsystem (16) and a control system (40). The control system (40) can integrate controls for each of the other subsystems, which controls can be implement desired functions over a variety of process parameters to perform the controlled interaction.

The present disclosure relates to a test paper counting technology, in particular to a portable test paper counting device and method based on a single photon detector. A portable test paper counting device based on a single photon detector is provided, which includes a box-shaped housing, two guide rail pairs, two hanger rods, a laser, a reflecting mirror, a single photon detector, a power supply, and a PC computer. A rectangular operating hole penetrating from left to right is formed in a lower edge of a right side wall of the box-shaped housing. A right part of a bottom wall of the box-shaped housing is provided with an assembly hole penetrating from up to down. A left side wall of the box-shaped housing is provided with a threading hole penetrating from left to right. Sliders of the two guide rail pairs both face downwards.

The present disclosure relates to a test paper counting technology, in particular to a portable test paper counting device and method based on a single photon detector. A portable test paper counting device based on a single photon detector is provided, which includes a box-shaped housing, two guide rail pairs, two hanger rods, a laser, a reflecting mirror, a single photon detector, a power supply, and a PC computer. A rectangular operating hole penetrating from left to right is formed in a lower edge of a right side wall of the box-shaped housing. A right part of a bottom wall of the box-shaped housing is provided with an assembly hole penetrating from up to down. A left side wall of the box-shaped housing is provided with a threading hole penetrating from left to right. Sliders of the two guide rail pairs both face downwards.

The present disclosure relates to an apparatus and a method for a thickness and a profile of a multilayer thin film using a vibration insensitive interference method are provided, which allow measuring the phase of a measurement object by acquiring a plurality of different phase-shifted interference signal images at a time through interference signals between a reference flat and the measurement object by a polarizing beam splitter, a quarter-wave plate, a shutter and a pixelated polarizing camera, and which also allow measuring reflectance of the measurement object by acquiring a plurality of reflected signal images obtained at a time through respective reflected lights for each of a reference surface and the measurement object by a plurality of different polarizers.

The present disclosure relates to an apparatus and a method for a thickness and a profile of a multilayer thin film using a vibration insensitive interference method are provided, which allow measuring the phase of a measurement object by acquiring a plurality of different phase-shifted interference signal images at a time through interference signals between a reference flat and the measurement object by a polarizing beam splitter, a quarter-wave plate, a shutter and a pixelated polarizing camera, and which also allow measuring reflectance of the measurement object by acquiring a plurality of reflected signal images obtained at a time through respective reflected lights for each of a reference surface and the measurement object by a plurality of different polarizers.