Embodiments described herein provide for metrology tools and methods of obtaining a full-field optical field of an optical device to determine multiple metrology metrics of the optical device. A metrology tool is utilized to split a light beam into a first light path and a second light path. The first light path and the second light path are combined into a combined light beam and delivered to the detector. The detector measures the intensity of the combined light beam. A first equation and second equation are utilized in combination with the intensity measurements to determine an amplitude and phase Ψ at a reference point directly adjacent to a second surface of the at least one optical device.

The present disclosure relates to an apparatus and a method for a thickness and a profile of a multilayer thin film using a vibration insensitive interference method are provided, which allow measuring the phase of a measurement object by acquiring a plurality of different phase-shifted interference signal images at a time through interference signals between a reference flat and the measurement object by a polarizing beam splitter, a quarter-wave plate, a shutter and a pixelated polarizing camera, and which also allow measuring reflectance of the measurement object by acquiring a plurality of reflected signal images obtained at a time through respective reflected lights for each of a reference surface and the measurement object by a plurality of different polarizers.

A method of measuring a surface of an optical element and an interferometric measuring device for measuring a surface or profile of the optical element. The optical element having a first surface and a second surface opposite the first surface. The method includes defining at least a first measurement point, a second measurement point and a third measurement point on a measurement surface of the optical element being one of the first surface and the second surface, measuring a first position of the first measurement point by directing a measurement beam from a measurement head onto the first measurement point and by detecting a measurement beam portion reflected at the first measurement point, subsequently measuring at least a second position of the second measurement point and a third position of the third measurement point by directing the measurement beam onto the second measurement point and onto the third measurement point and by detecting a measurement beam portion reflected at the second measurement point and the third measurement point, respectively, and determining at least one of a decenter and a tilt of the measurement surface relative to a reference axis on the basis of at least the first position, the second position and the third position.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.

The invention relates to a device (100) for an additive manufacture. The device (100) comprises a laser device (110) for machining material using a laser beam (112), said laser device (110) being designed to deflect the laser beam (112) onto a machining region of a workpiece (10); at least one supply device (130) for a supply material, said supply device being designed to supply the supply material to the machining region; and an interferometer (140) which is designed to measure a distance to the workpiece (10) by means of an optical measuring beam (142).

A method for determining geometrical parameters of a soft contact lens comprises the steps of providing an OCT imaging device comprising an OCT light source; providing a soft contact lens arranging the soft contact lens relative to the OCT imaging device so light coming from the OCT light source impinges on the back surface of the soft contact lens; generating a three-dimensional OCT image of the soft contact lens; from the three-dimensional OCT image determining a plurality of edge points located on the edge of the soft contact lens, connecting adjacent ones of the edge points by individual straight lines; summing up the lengths of all individual straight lines to a length U of the approximated circumference of the soft contact lens; from the length U determining a diameter D of the lens according to D=U/π.

An apparatus for oral imaging has a light source energizable to generate a light frequency signal ranging from a minimum to a maximum frequency. An image acquisition apparatus scans the generated light frequency signal to successive positions on a sample surface and to combine a returned signal from each successive position with the generated light frequency signal. The image acquisition apparatus has a detector that obtains a beat frequency signal from the combined returned signal and the generated light frequency signal. A processor that is in signal communication with the detector generates a processed beat signal from the combined signals, wherein the processed beat signal is indicative of the distance from the tunable laser source to the sample surface at the corresponding position. A display is in signal communication with the processor and is energizable to display distance data according to the processed beat signal for each scanned position.

An analysis apparatus includes an acquisition part that acquires a plurality of interference images of the object to be measured from the interference measurement apparatus, a calculation part that calculates a sine wave component and a cosine wave component of an interference signal for each pixel in the plurality of interference images, respectively, an error detection part that detects an error between a first Lissajous figure constructed on the basis of the sine wave component and the cosine wave component for each pixel and an ideal second Lissajous figure, a correction part that corrects the sine wave component and the cosine wave component for each pixel on the basis of the error, and a geometry calculation part that calculates surface geometry of the object to be measured on the basis of the corrected sine wave component and cosine wave component.

A method for coating a part having a surface that has cooling fluid openings that adjoin cooling fluid ducts inside the part. A device analyzes the surface of a part having a surface that has cooling fluid openings which adjoin cooling fluid ducts inside the part, the device being usable in the aforementioned method. The disclosed device and/or the disclosed method is used during the manufacturing and/or overhauling of parts of a turbomachine.