A method for measuring distorted illumination patterns and correcting image artifacts in structured illumination microscopy. The method includes the steps of generating an illumination pattern by interfering multiple beams, modulating a scanning speed or an intensity of a scanning laser, or projecting a mask onto an object; taking multiple exposures of the object with the illumination pattern shifting in phase; and applying Fourier transform to the multiple exposures to produce multiple raw images. Thereafter, the multiple raw images are used to form and then solve a linear equation set to obtain multiple portions of a Fourier space image of the object. A circular 2-D low pass filter and a Fourier Transform are then applied to the portions. A pattern distortion phase map is calculated and then corrected by making a coefficient matrix of the linear equation set varying in phase, which is solved in the spatial domain.

A method for measuring distorted illumination patterns and correcting image artifacts in structured illumination microscopy. The method includes the steps of generating an illumination pattern by interfering multiple beams, modulating a scanning speed or an intensity of a scanning laser, or projecting a mask onto an object; taking multiple exposures of the object with the illumination pattern shifting in phase; and applying Fourier transform to the multiple exposures to produce multiple raw images. Thereafter, the multiple raw images are used to form and then solve a linear equation set to obtain multiple portions of a Fourier space image of the object. A circular 2-D low pass filter and a Fourier Transform are then applied to the portions. A pattern distortion phase map is calculated and then corrected by making a coefficient matrix of the linear equation set varying in phase, which is solved in the spatial domain.

A system for monitored additive manufacturing of an object, comprising a manufacturing unit], designed for additive manufacturing of the object based on metal-containing manufacturing material in a manufacturing volume, wherein the object is built up by repeated layer-by-layer provision of the manufacturing material in defined quantity and accurately-positioned forming of the provided manufacturing material. The system moreover comprises an optical checking unit having at least one projector and two cameras and a control and processing unit. The manufacturing volume comprises an optical transmission region, the projector and cameras—are arranged outside the manufacturing volume in a fixed position relationship and are aligned in such a way that respective optical axes extend through a respective transmission region, by means of the projector, a projection can be generated on a manufacturing area and at least a common part of the manufacturing area on which the projection can be overlaid can be captured.

A system for monitored additive manufacturing of an object, comprising a manufacturing unit], designed for additive manufacturing of the object based on metal-containing manufacturing material in a manufacturing volume, wherein the object is built up by repeated layer-by-layer provision of the manufacturing material in defined quantity and accurately-positioned forming of the provided manufacturing material. The system moreover comprises an optical checking unit having at least one projector and two cameras and a control and processing unit. The manufacturing volume comprises an optical transmission region, the projector and cameras—are arranged outside the manufacturing volume in a fixed position relationship and are aligned in such a way that respective optical axes extend through a respective transmission region, by means of the projector, a projection can be generated on a manufacturing area and at least a common part of the manufacturing area on which the projection can be overlaid can be captured.

One example of an inspection system includes a laser, a magnification changer, and a first camera. The laser projects a line onto a wafer to be inspected. The magnification changer includes a plurality of selectable lenses of different magnification. The first camera images the line projected onto the wafer and outputs three-dimensional line data indicating the height of features of the wafer. Each lens of the magnification changer provides the same nominal focal plane position of the first camera with respect to the wafer.

A measurement device is configured to: calculate first contour data of a container in an empty state at a first time; calculate second contour data indicating a surface contour of an object at a second time in execution of a scooping operation by the container; rotate the second contour data, based on differential information indicating a difference between second posture data of a working gear 4 at the second time and first posture data of the working gear 4 at the first time; specify a region defined by supplemental contour data for supplementing the surface contour of the object contained in the container in the execution of the scooping operation, the rotated second contour data, and the first contour data; and calculate, based on the specified region, a first volume indicating a volume of the object contained in the container.

A 3D image-capturing device that includes at least one camera that acquires a 2D image and distance information of an object, a monitor that displays the 2D image acquired by the camera, and at least one processor including hardware. The processor acquires a first area for which the distance information is not required in the 2D image displayed on the monitor, and sets an image-capturing condition so that the amount of distance information acquired by the camera in the acquired first area is less than or equal to a prescribed first threshold and the amount of distance information acquired by the camera in a second area, which is at least part of an area other than the first area, is greater than a prescribed second threshold that is larger than the first threshold.

A 3D image-capturing device that includes at least one camera that acquires a 2D image and distance information of an object, a monitor that displays the 2D image acquired by the camera, and at least one processor including hardware. The processor acquires a first area for which the distance information is not required in the 2D image displayed on the monitor, and sets an image-capturing condition so that the amount of distance information acquired by the camera in the acquired first area is less than or equal to a prescribed first threshold and the amount of distance information acquired by the camera in a second area, which is at least part of an area other than the first area, is greater than a prescribed second threshold that is larger than the first threshold.

A handheld laser distance measuring device for a contactless distance measurement between the laser distance measuring device and a remote object uses a laser beam that is emitted by the laser distance measuring device. The laser distance measuring device includes a device-side coupling device paired with the device housing. The coupling device is configured for reversibly arranging at least one attachment device on the laser distance measuring device. By arranging the at least one attachment device on the laser distance measuring device, at least one additional functionality can be provided.

A system of generating a three-dimensional (3D) scan of an environment includes multiple 3D scanners including a first 3D scanner at respective first and second positions. The system further includes a controller coupled to the 3D scanners via a common communications network. The first scanner and second scanner transmit a subset of data to the controller while acquiring a set of 3D coordinates. The controller registers the subsets of data to each other while the sets of 3D coordinates is being acquired.