The present invention is a corrosion environment diagnosis system including: an environment measuring device that includes a temperature sensor that measures temperature in an electronic part serving as a diagnosis target or an indoor space in which an electronic device including the electronic part is installed, a humidity sensor that measures relative humidity in the indoor space or the electronic device, a corrosion sensor that measures a corrosion thickness of the diagnosis target, and a database in which indoor environment data including the temperature and the relative humidity measured by the temperature sensor and the humidity sensor and corrosion thickness data including the corrosion thickness measured by the corrosion sensor are accumulated; an outside air environment database in which outside air environment data including previous temperature and humidity of outside air is recorded; and a diagnostic processing device capable of receiving data of the outside air environment database and the environment measuring device, wherein the diagnostic processing device decides a corrosion mechanism corresponding to a relation between the corrosion thickness and the relative humidity on the basis of the indoor environment data, the corrosion thickness data, and the outside air environment data, and estimates a future corrosion thickness of the diagnosis target. Accordingly, it is possible to accurately estimate a future corrosion thickness on the basis of a mechanism of corrosion by atmospheric air including corrosive gas.

A measuring assembly and method for layer thickness measurement of a layer applied to a substrate by means of a vapor deposition method includes a measuring head which is provided with at least one vibration plate, an extraction line which can be coupled in a gas-conducting or vapor-conducting manner with a first end having a vacuum chamber for the vapor deposition method and which can be coupled in a gas-conducting or vapor-conducting manner with an opposite second end having the measuring head, wherein the extraction line includes at least one heating section or at least one cooling section.

A crystal oscillation probe structure and an evaporation device are provided. The crystal oscillation probe structure includes a guide cover, a crystal oscillation probe and a mesh screen structure, the guide cover includes a chamber with a guide opening, the crystal oscillation probe is fixed in the chamber, the crystal oscillation probe includes at least one crystal oscillation sheet, the mesh screen structure includes a plurality of openings, and the mesh screen structure is located on a traveling path of a material traveling toward the at least one crystal oscillation sheet and disposed on a side of the at least one crystal oscillation sheet facing the guide opening.

A system for monitoring thin film deposition is described. The system includes a quartz crystal and a synthesizer to generate a modulated signal. The modulated signal is to be grounded through the quartz crystal. The system also includes a phase detector to determine a phase of the modulated signal from the quartz crystal in order to monitor thin film deposition. A modulation index can be selected so that, at resonance, high frequency of the signal matches the crystal frequency.

A measuring assembly and method for layer thickness measurement of a layer applied to a substrate by means of a vapor deposition method includes a measuring head which is provided with at least one vibration plate, an extraction line which can be coupled in a gas-conducting or vapor-conducting manner with a first end having a vacuum chamber for the vapor deposition method and which can be coupled in a gas-conducting or vapor-conducting manner with an opposite second end having the measuring head, wherein the extraction line includes at least one heating section or at least one cooling section.

A crystal oscillation probe structure and an evaporation device are provided. The crystal oscillation probe structure includes a guide cover, a crystal oscillation probe and a mesh screen structure, the guide cover includes a chamber with a guide opening, the crystal oscillation probe is fixed in the chamber, the crystal oscillation probe includes at least one crystal oscillation sheet, the mesh screen structure includes a plurality of openings, and the mesh screen structure is located on a traveling path of a material traveling toward the at least one crystal oscillation sheet and disposed on a side of the at least one crystal oscillation sheet facing the guide opening.

Systems and methods are provided for implementing a crystal oscillator to monitor and control semiconductor fabrication processes. More specifically, a method is provided for that includes performing at least one semiconductor fabrication process on a material of an integrated circuit (IC) disposed within a processing chamber. The method further includes monitoring by at least one electronic oscillator disposed within the processing chamber for the presence or absence of a predetermined substance generated by the at least one semiconductor fabrication process. The method further includes controlling the at least one semiconductor fabrication process based on the presence or absence of the predetermined substance detected by the at least one electronic oscillator.

The present invention is a corrosion environment diagnosis system including: an environment measuring device that includes a temperature sensor that measures temperature in an electronic part serving as a diagnosis target or an indoor space in which an electronic device including the electronic part is installed, a humidity sensor that measures relative humidity in the indoor space or the electronic device, a corrosion sensor that measures a corrosion thickness of the diagnosis target, and a database in which indoor environment data including the temperature and the relative humidity measured by the temperature sensor and the humidity sensor and corrosion thickness data including the corrosion thickness measured by the corrosion sensor are accumulated; an outside air environment database in which outside air environment data including previous temperature and humidity of outside air is recorded; and a diagnostic processing device capable of receiving data of the outside air environment database and the environment measuring device, wherein the diagnostic processing device decides a corrosion mechanism corresponding to a relation between the corrosion thickness and the relative humidity on the basis of the indoor environment data, the corrosion thickness data, and the outside air environment data, and estimates a future corrosion thickness of the diagnosis target. Accordingly, it is possible to accurately estimate a future corrosion thickness on the basis of a mechanism of corrosion by atmospheric air including corrosive gas.

Embodiments of the present invention disclose a detection device for detecting a thickness of a vacuum-evaporated film and a vacuum evaporation apparatus, thereby solving, for example, a problem that a conventional detection device results in excessively high production cost due to frequent replacement of a crystal plate. The detection device includes: a crystal plate, a detection structure provided with an opening corresponding to the crystal plate such that evaporated molecules or atoms are deposited on the crystal plate through the opening; and a filter disposed between the opening and the crystal plate.

A system and method for determining the changes in resonance frequency in crystal microbalance (CM) sensors and the resulting changes in the determination of incremental mass on the CM sensors caused by temperature. Dual mode resonances and coefficients are used in a deconvolution process to determine and extract the frequency shift caused by temperature to provide the temperature compensated incremental mass (?M). In one embodiment, dual mode analysis is provided using a mass mode (e.g., the c-mode fundamental frequency (f.sup.c.sub.100)) and a temperature mode (e.g., the anharmonic frequency (f.sup.c.sub.102)) and associated coefficients. In other embodiments that are more sensitive to temperature changes, dual mode analysis is provided using the b-mode fundamental frequency (f.sup.b.sub.100) as the temperature-mode and associated coefficients.