Patent classifications
G01B7/085
ELECTRICAL TEST OF OPTICAL COMPONENTS VIA METAL-INSULATOR-SEMICONDUCTOR CAPACITOR STRUCTURES
Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.
Method and device for controlling fountain solution thickness on an imaging surface using a capacitive proximity sensor
An ultra-high resolution capacitive sensor affixed above an imaging member surface measures the thickness of fountain solution on the imaging member surface in real-time during a printing operation. The sensor is considered ultra-high resolution with a resolution high enough to detect nanometer scale thicknesses. The capacitive sensor would initially be zeroed to the imaging member surface. As fluid is added, the capacitive sensor detects the increase and can measure and communicate with the image forming device to adjust fountain solution flow rate to the imaging member surface and correct for any anomalies in thickness. This fountain solution monitoring system may be fully automated. The capacitive sensor may have a resolution (e.g., as low as about 1 nm resolution) of about 0.001% of the distance/gap that the capacitive sensor is mounted away from the imaging member surface.
Electrical test of optical components via metal-insulator-semiconductor capacitor structures
Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.
CAPACITANCE-BASED QUALITY MONITORING AND CONTROL IN BATTERY MANUFACTURING
A quality control system in a battery manufacturing process includes two or more capacitive measurement apparatuses to obtain a capacitance measurement from two or more intermediate products generated during the battery manufacturing process. The system also includes processing circuitry to obtain the capacitive measurement from the two or more capacitive measurement apparatuses, to determine a characteristic of the corresponding intermediate product, and to control at least one process of the battery manufacturing process that produced at least one of the two or more intermediate products based on the characteristic.
APPROACH TO MEASURE THIN FILM LAYERS, NANOMETER SCALE, ON SURFACES THROUGH NON-CONTACT CAPACITIVE PROXIMITY SENSOR
An ultra-high resolution capacitive sensor affixed above an imaging member surface measures the thickness of fountain solution on the imaging member surface in real-time during a printing operation. The sensor is considered ultra-high resolution with a resolution high enough to detect nanometer scale thicknesses. The capacitive sensor would initially be zeroed to the imaging member surface. As fluid is added, the capacitive sensor detects the increase and can measure and communicate with the image forming device to adjust fountain solution flow rate to the imaging member surface and correct for any anomalies in thickness. This fountain solution monitoring system may be fully automated. The capacitive sensor may have a resolution (e.g., as low as about 1 nm resolution) of about 0.001% of the distance/gap that the capacitive sensor is mounted away from the imaging member surface.
MEASURING DEVICE AND METHOD OF OBTAINING THICKNESS OF SHEATH
A measuring device includes a substrate disposed on a substrate support of a plasma processing apparatus, a transmission circuit, a transmitting antenna, a receiving antenna, a reception demodulation circuit, and a calculator which are provided in the substrate. The transmission circuit generates a microwave. The transmitting antenna transmits the microwave generated by the transmission circuit as a transmission wave. The receiving antenna receives a reflected wave of the transmission wave by plasma above the substrate support as at least one reception wave. The reception demodulation circuit generates a signal that reflects a thickness of a sheath between the substrate and the plasma, from the reception wave. The calculator obtains the thickness of the sheath from the signal generated by the reception demodulation circuit.
METHOD FOR CALCULATING CAPACITANCE AND METHOD FOR CALCULATING THICKNESS OF SUBSTRATE
A method comprising: measuring a plurality of measurement capacitances using a capacitance measurement device; calculating a plurality of deposition coefficients for the deposition parameter corresponding to each of the plurality of the measurement capacitances, a plurality of exposure coefficients for the exposure parameter corresponding to each of the plurality of the measurement capacitances, and a plurality of etching coefficients for the etching parameter corresponding to each of the plurality of the measurement capacitances; calculating a corrected deposition coefficient for the plurality of the deposition coefficients, a corrected exposure coefficient for the plurality of the exposure coefficients, and a corrected etching coefficient for the plurality of the etching coefficients; and calculating the capacitance based on a capacitance calculation equation including the deposition parameter, the corrected deposition coefficient, the exposure parameter, the corrected exposure coefficient, the etching parameter, and the corrected etching coefficient.
DETERMINING PLASTIC OR CELLULOSE LEVELS IN COMPOSITES
In accordance with some aspects of the present disclosure, a system is disclosed. The system provides a non-destructive and non-contact test to quantify the cellulose and/or plastic content in a given composite material board sample by the use of capacitive sensors. The system includes a ground plate and a capacitive sensor probe system with programmed instructions to calibrate to a predetermined dielectric, determine, in a composite board placed in between the capacitive sensor and the ground plate, an equivalent thickness of material emitting the predetermined dielectric, and convert the equivalent thickness into a weight percentage of the material in the board.
ELECTRICAL TEST OF OPTICAL COMPONENTS VIA METAL-INSULATOR-SEMICONDUCTOR CAPACITOR STRUCTURES
Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.
METHOD AND SYSTEM FOR MONITORING THE FILM THICKNESS OF A LUBRICANT WITHIN A LUBRICATED BEARING
Disclosed is a monitoring method for monitoring the film thickness of a lubricant within a lubricated bearing, the bearing having an inner ring, an outer ring and rolling elements being arranged between the inner ring and the outer ring/ The monitoring method comprises a capacitance measuring step for measuring the total capacitance of the bearing; a first calculation step for determining a film thickness of the lubricant based on the measured capacitance of the bearing and for determining whether the lubrication condition is fully flooded or starved, and when the lubrication condition is fully flooded, a second calculation step for correcting the film thickness determined in the first calculation step.