A device for detecting a layer thickness of a coated component, particularly a brake disc for a disc brake of a motor vehicle, includes at least one holding device and a guiding device. The holding device has a bearing surface for the component. The guiding device is configured to hold and guide a sensor in order to measure the layer thickness. The sensor is configured to be moved by the guiding device along a vertical axis and pivot about a first axis of rotation that is oriented horizontally. The sensor is further configured to be moved by the guiding device along a horizontal axis.

A method can include identifying an inspected object with an inspection device; viewing the inspected object through an augmented reality device to identify points; and measuring a thickness of a layer at the inspection points. In response to detecting a region of interest on the surface of the inspected object, an image of the region of interest can be taken. By operation of communication circuits, at least the thickness measurements and images can be transmitted to a server system. A value of the inspected object can be adjusted based on at least the thickness measurements and images from the at least one inspection device. Corresponding devices and systems are also disclosed.

An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

There is provided a detection signal processing circuit and a detection signal processing method for an eddy current sensor that are less easily influenced by a change in ambient environment than conventional technologies. A detection signal processing apparatus includes a converter configured to convert a first analog signal output by a detection coil into a first digital signal, a converter configured to convert a second analog signal output by a dummy coil into a second digital signal, and a detector which is a digital signal processing circuit configured to detect the first digital signal and the second digital signal.

A method may include positioning an eddy current probe proximate to a coated portion of an article. The coated portion of the article includes a conductive substrate and a ceramic coating overlying the conductive substrate. The method includes generating, using the eddy current probe, a first primary magnetic field to induce eddy currents in the coated portion of the article and measuring, using the eddy current probe, a strength of a first secondary magnetic field created by the eddy currents in the coated portion of the article to obtain a first secondary magnetic field measurement. The method includes determining, by a computing device, one or more properties or one or more changes in properties of the article based on the first secondary magnetic field measurement.

An inspection robot, and methods and a controller thereof are disclosed. An inspection robot may include an inspection chassis including a plurality of inspection sensors and coupled to at least one drive module to drive the robot over an inspection surface. The inspection robot may also include a controller including an inspection data circuit to interpret inspection base data, an inspection processing circuit to determine refined inspection data, and an inspection configuration circuit to determine an inspection response value in response to the refined inspection data. The controller may further include an inspection response circuit to, in response to the inspection response value, provide an inspection command value while the inspection robot is interrogating the inspection surface.

According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.

Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process.

A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

Systems, methods, and apparatus for tracking location of an inspection robot are disclosed. An example apparatus for tracking inspection data may include an inspection chassis having a plurality of inspection sensors configured to interrogate an inspection surface, a first drive module and a second drive module, both coupled to the inspection chassis. The first and second drive module may each include a passive encoder wheel and a non-contact sensor positioned in proximity to the passive encoder wheel, wherein the non-contact sensor provides a movement value corresponding to the first passive encoder wheel. An inspection position circuit may determine a relative position of the inspection chassis in response to the movement values from the first and second drive modules.