A method for estimating an offset between a first group and a second group of contacts with respect to a longitudinal direction. Each group of contacts includes a plurality of electrodes arranged along a surface of a body of a lead. The method includes the steps of: (a) Selecting a number of electrode pairs, each electrode pair including an electrode of the first contact group and an electrode of the second contact group, and measuring the impedances between the electrodes of each selected electrode pair; (b) pre-conditioning the measured impedances for attenuating unwanted noise to generate pre-conditioned impedances, and (c) determining the lead offset using the pre-conditioned impedances.

A method for estimating an offset between a first group and a second group of contacts with respect to a longitudinal direction. Each group of contacts includes a plurality of electrodes arranged along a surface of a body of a lead. The method includes the steps of: (a) Selecting a number of electrode pairs, each electrode pair including an electrode of the first contact group and an electrode of the second contact group, and measuring the impedances between the electrodes of each selected electrode pair; (b) pre-conditioning the measured impedances for attenuating unwanted noise to generate pre-conditioned impedances, and (c) determining the lead offset using the pre-conditioned impedances.

The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes, wherein the one or more first electrodes and the one or more second electrodes form at least a portion of a bridge structure that exhibits an electrical property that varies as a function of misalignment of the first conductive layer and the second conductive layer in an in-plane direction.

The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes, wherein the one or more first electrodes and the one or more second electrodes form at least a portion of a bridge structure that exhibits an electrical property that varies as a function of misalignment of the first conductive layer and the second conductive layer in an in-plane direction.

A training system comprises a training stand, a width, a length, a spacing measurement assembly, a training assembly, and a controller. each among a plurality of blade disks comprise a blade disk having a body portion, a center aperture, a diameter, a plurality of punched teeth, a sharpened edge, a center point, an outer edge and a center aperture diameter. portions of the plurality of blade disks comprises one or more misaligned disks and one or more nominal disks. The plurality of blade disks comprise at least a first disk and a last disk. each among the plurality of blade disks are attached to a mandrel along a center axis.

A training system comprises a training stand, a width, a length, a spacing measurement assembly, a training assembly, and a controller. each among a plurality of blade disks comprise a blade disk having a body portion, a center aperture, a diameter, a plurality of punched teeth, a sharpened edge, a center point, an outer edge and a center aperture diameter. portions of the plurality of blade disks comprises one or more misaligned disks and one or more nominal disks. The plurality of blade disks comprise at least a first disk and a last disk. each among the plurality of blade disks are attached to a mandrel along a center axis.

A positioning support (1) for positioning components to be inspected during their inspection by means of an optical control apparatus, comprising a chasing base (3) acting as interface to the optical control apparatus, a sliding base (5) able to slide along an axis “Y” in a plane of the chasing base perpendicular to the optical axis; a plate (7) able to slide along an axis “X” perpendicular to the axis “Y” in a plane parallel to said sliding base; jigs or bars (15) for positioning a plurality of components to be measured on said plate.

A positioning support (1) for positioning components to be inspected during their inspection by means of an optical control apparatus, comprising a chasing base (3) acting as interface to the optical control apparatus, a sliding base (5) able to slide along an axis “Y” in a plane of the chasing base perpendicular to the optical axis; a plate (7) able to slide along an axis “X” perpendicular to the axis “Y” in a plane parallel to said sliding base; jigs or bars (15) for positioning a plurality of components to be measured on said plate.

Systems and methods are provided for detecting an enclosure alignment anomaly. Pressure data of a set period can be obtained from one or more piezoelectric sensors. The one or more piezoelectric sensors are installed in between an enclosure and a fixture of an autonomous vehicle. The pressure data of the set period can be processed over a period of time. One or more trends can be identified based on the processed pressure data.

Systems and methods are provided for detecting an enclosure alignment anomaly. Pressure data of a set period can be obtained from one or more piezoelectric sensors. The one or more piezoelectric sensors are installed in between an enclosure and a fixture of an autonomous vehicle. The pressure data of the set period can be processed over a period of time. One or more trends can be identified based on the processed pressure data.