Disclosed is an optical probe system that is capable of high speed, high precision, and high resolution 3D digitalization of engineered objects. The 3D dimensional data of the engineered object is measured using a swept source optical coherence tomography system with improved speed, spatial resolutions, and depth range. Also disclosed is a type of coordinate measurement machine (CMM) that is capable of performing high speed, high resolution, and non-contact measurement of engineered objects. The mechanic stylus in the touch-trigger probe of a conventional CMM is replaced with an optical stylus with reconfigurable diameter and length. The distance from the center of the optical stylus to the measurement probe is optically adjusted to match the height of the object to be measured quickly, which eliminates one dimensional movement of the probe and greatly improves the productivity.

Disclosed is an optical probe system that is capable of high speed, high precision, and high resolution 3D digitalization of engineered objects. The 3D dimensional data of the engineered object is measured using a swept source optical coherence tomography system with improved speed, spatial resolutions, and depth range. Also disclosed is a type of coordinate measurement machine (CMM) that is capable of performing high speed, high resolution, and non-contact measurement of engineered objects. The mechanic stylus in the touch-trigger probe of a conventional CMM is replaced with an optical stylus with reconfigurable diameter and length. The distance from the center of the optical stylus to the measurement probe is optically adjusted to match the height of the object to be measured quickly, which eliminates one dimensional movement of the probe and greatly improves the productivity.

Disclosed is an optical probe system that is capable of high speed, high precision, and high resolution 3D digitalization of engineered objects. The 3D dimensional data of the engineered object is measured using a swept source optical coherence tomography system with improved speed, spatial resolutions, and depth range. Also disclosed is a type of coordinate measurement machine (CMM) that is capable of performing high speed, high resolution, and non-contact measurement of engineered objects. The mechanic stylus in the touch-trigger probe of a conventional CMM is replaced with an optical stylus with reconfigurable diameter and length. The distance from the center of the optical stylus to the measurement probe is optically adjusted to match the height of the object to be measured quickly, which eliminates one dimensional movement of the probe and greatly improves the productivity.

Disclosed is an optical probe system that is capable of high speed, high precision, and high resolution 3D digitalization of engineered objects. The 3D dimensional data of the engineered object is measured using a swept source optical coherence tomography system with improved speed, spatial resolutions, and depth range. Also disclosed is a type of coordinate measurement machine (CMM) that is capable of performing high speed, high resolution, and non-contact measurement of engineered objects. The mechanic stylus in the touch-trigger probe of a conventional CMM is replaced with an optical stylus with reconfigurable diameter and length. The distance from the center of the optical stylus to the measurement probe is optically adjusted to match the height of the object to be measured quickly, which eliminates one dimensional movement of the probe and greatly improves the productivity.

Disclosed is an optical probe system that is capable of high speed, high precision, and high resolution 3D digitalization of engineered objects. The 3D dimensional data of the engineered object is measured using a swept source optical coherence tomography system with improved speed, spatial resolutions, and depth range. Also disclosed is a type of coordinate measurement machine (CMM) that is capable of performing high speed, high resolution, and non-contact measurement of engineered objects. The mechanic stylus in the touch-trigger probe of a conventional CMM is replaced with an optical stylus with reconfigurable diameter and length. The distance from the center of the optical stylus to the measurement probe is optically adjusted to match the height of the object to be measured quickly, which eliminates one dimensional movement of the probe and greatly improves the productivity.

Disclosed is an optical probe system that is capable of high speed, high precision, and high resolution 3D digitalization of engineered objects. The 3D dimensional data of the engineered object is measured using a swept source optical coherence tomography system with improved speed, spatial resolutions, and depth range. Also disclosed is a type of coordinate measurement machine (CMM) that is capable of performing high speed, high resolution, and non-contact measurement of engineered objects. The mechanic stylus in the touch-trigger probe of a conventional CMM is replaced with an optical stylus with reconfigurable diameter and length. The distance from the center of the optical stylus to the measurement probe is optically adjusted to match the height of the object to be measured quickly, which eliminates one dimensional movement of the probe and greatly improves the productivity.

The tomographic image capturing device of the present invention is configured to: split light from a light source (11) into measurement light and reference light; cause the measurement light and the reference light to be incident to an object (E) and a reference object (49), respectively; and capture tomographic images of the object (E) on the basis of interference light generated by superposition of the measurement light reflected from the object (E) and the reference light reflected from the reference object (49). The tomographic image capturing device has a first image capturing mode and a second image capturing mode. The first and second image capturing modes are each a mode in which the measurement light is two-dimensionally scanned to be incident to the object (E) and the tomographic images of the object (E) are captured. The two-dimensional scans in the second image capturing mode require a shorter time than that required for the two-dimensional scans in the first image capturing mode. The capturing of the tomographic images in the first image capturing mode is performed after performing adjustment of an image capturing condition necessary for capturing the tomographic images in the first image capturing mode. The adjustment is based on the tomographic images captured in the second image capturing mode.

The present invention discloses a high-fidelity entangled link generation method based on quantum time-space, the method comprising: directing, by a communication provider, a laser beam to a nonlinear crystal, thereby enabling probabilistically bursting out of a photon beam, and polarizing the photon beam to be in an entangled state; at an entanglement distribution stage, enabling entangled photons to traverse through quantum trajectories, and generating a distributed entangled photon state between a first communication node and a second communication node to construct an elementary entangled link; the first communication node or the second communication node is required to select the same measurement basis for m control qubits when m copies of entangled photon pairs from entanglement source are assumed to be distributed through quantum trajectories to communication nodes with the time interval ?, such that 2 m memory qubits of two adjacent nodes may store m exactly the same distributed entangled states.

An interferometric method for profiling the topography of a sample surface comprises: (i) a first interferometric profiling step at a first magnification M1 to produce a map comprising pixels with planar (X,Y)-coordinates corresponding to the area of the sample surface, (ii) identifying pixel(s) which meet or exceed a Cut-Off Threshold, and meet or exceed a parameter N.sub.NAP; (iii) identifying pixel(s) for which no z-coordinate has been recorded; (iv) generating a Low Magnification Frame File (LMFF) which comprises the (X,Y) coordinates of the pixels derived from steps (ii) and (iii); (v) a second interferometric profiling step at a second magnification M2, wherein M2>M1, wherein only selected regions of the sample surface are analysed, said selected regions comprising the features associated with the (X,Y)-coordinates of the pixels in the Low Magnification Frame File; and further comprising a step selected from: (vi) analysing the output of the second interferometric profiling step to differentiate between an intrinsic defect and an extrinsic defect; (vii) assessing whether said sample surface meets one or more quality control standard(s) and/or one or more target property or properties; and (viii) assessing whether said sample surface is suitable as a surface for subsequent coating.

In an inner layer measurement method, first irradiation light and second irradiation light having a peak wavelength longer than that of the first irradiation light are formed by changing at least one of a position where light emitted from a lamp is transmitted through a short pass filter and a position where light emitted from a lamp is transmitted through a long pass filter. Then, a first XY sectional surface of a semitransparent body is measured by irradiating the first XY sectional surface with the first irradiation light. A second XY sectional surface positioned on a layer deeper than the first XY sectional surface is measured by irradiating the second XY sectional surface with the second irradiation light. Each of the short pass filter and the long pass filter can transmit the light and has properties of changing a cutoff wavelength according to the position where the light is transmitted.