A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

An electrical safety device is described which includes a socket arranged to receive an electrical plug of an electrical appliance to connect a current supply to the electrical appliance, a thermal sensor arranged to detect the surface temperature of an electrical plug when received in the socket and a processor in communication with the thermal sensor, the processor configured to determine when the sensed surface temperature exceeds a predetermined threshold. The invention also includes an electrical safety system comprising the electrical safety device configured to communicate with a remote device. The device and system provide early detection of electrical faults and hazards to reduce the risk of fires.

A communication apparatus that includes a first antenna array having a first plurality of antenna elements, and a first plurality of thermoelectric devices that are arranged on the first plurality of antenna elements of the first antenna array. The communication apparatus further includes a processor that obtains traffic information of a geographical area surrounding a deployed location of the communication apparatus. The processor further controls each of the first plurality of thermoelectric devices to increase or decrease cooling from each of the first plurality of thermoelectric devices based on the obtained traffic information that indicates a number of user equipment (UEs) to be served in the geographical area.

A detector of electromagnetic radiation (RL) is described. The detector comprises: an oriented polycrystalline layer (2) of thermoelectric material, a substrate (1) superimposed on the top surface of the oriented polycrystalline layer so that the back surface (10) is in contact with the oriented polycrystalline layer, first and second electrodes spaced the one from the other and in electrical contact with the oriented polycrystalline layer. The substrate comprises at least one ceramic layer and the oriented polycrystalline layer has a crystal orientation at an angle comprised between 30 degrees and 55 degrees relative to a normal to the top surface of the substrate.

There is provided a far infrared (FIR) sensor device including a substrate, a thermopile structure and a heat absorption layer. The thermopile structure is arranged on the substrate. The heat absorption layer covers upon the thermopile structure, wherein the heat absorption layer has a hollow space which is formed by etching a metal layer in the heat absorption layer.

A luminescent diode surface within the cold shield of an infrared camera to allow for continuous non-uniformity correction with uniform irradiance across an infrared IR detector array. Further provided by the inclusion of a luminescent diode surface within the cold shield paneling is the ability to change the diode bias providing a negative luminescent effect while utilizing reverse bias and an electro-luminescent effect while utilizing a forward bias. This may then further allow for multiple set points to provide continuous offset and gain correction and to correct non-linear response effects.

Integrated thermal sensor having a housing delimiting an internal space. A support region extends through the internal space; a plurality of thermocouple elements are carried by the support region and are electrically coupled to each other. Each thermocouple element is formed by a first and a second thermoelectrically active region of a first and, respectively, a second thermoelectrically active material, the first thermoelectrically active material having a first Seeback coefficient, the second thermoelectrically active material having a second Seeback coefficient, other than the first Seeback coefficient. At least one of the first and second thermoelectrically active regions is a silicon-based material. The first and second thermoelectrically active regions of each thermocouple element are formed by respective elongated regions extending at a mutual distance into the internal space of the housing, from and transversely to the support region.

An infrared sensor is provided with an infrared light receiver, a signal pathway, and a first member. The infrared light receiver has a structure in which at least two materials having different coefficients of thermal expansion are layered. The signal pathway includes a first signal pathway allowing passage of a driving signal to be applied to the infrared light receiver. The driving signal has a current value equal to or greater than a prescribed magnitude, and the infrared light receiver deforms in response to the application of the driving signal to the infrared light receiver, thereby at least a portion of the infrared light receiver contacting the first member.

A communication apparatus includes an antenna array having a plurality of antenna elements, and a plurality of thermoelectric devices that are arranged on the plurality of antenna elements of the antenna array. The communication apparatus further includes a processor that determines which subset of the antenna elements of the plurality of antenna elements are in an activated state and which are in a deactivated state, and further control each of the plurality of thermoelectric devices to execute an activation or a deactivation of each of the plurality of thermoelectric devices in synchronization with the activated state or the deactivated state of different subsets of antenna elements of the plurality of antenna elements.

An analog-to-digital converter and a thermopile array. The analog-to-digital converter comprises: a reference voltage generation circuit comprising a voltage generation unit; a chopping modulation unit used to perform chopping modulation on a voltage signal generated by the voltage generation unit, and to modulate low frequency noise of the voltage signal into high frequency noise; and a low-pass filter used to eliminate the high frequency noise to obtain a reference voltage. The invention employs a simple structure to obtain a low noise reference voltage at low costs.