Techniques for facilitating temperature compensation are provided. In one example, an infrared imaging system includes a focal plane array configured to capture radiation from a scene and generate image data based on the radiation. The focal plane array further captures radiation from an element associated with the infrared imaging system during capture of the radiation from the scene. The infrared imaging system further includes a temperature sensor configured to determine a temperature of the focal plane array. The infrared imaging system further includes a processing circuit configured to determine a temperature associated with the element based on the temperature of the focal plane array. The processing circuit is further configured to determine a temperature associated with an object in the scene based on the infrared image data, the temperature associated with the element, and the temperature of the focal plane array. Related devices and methods are also provided.

A diode (11) is provided on a substrate (1) and thermally insulated from the substrate (1). A positive feedback circuit (18) provides a positive feedback loop so that when a current of the diode (11) decreases due to a change in temperature of the diode (11), the positive feedback circuit (18) further decreases the current of the diode (11), and when the current of the diode (11) increases, the positive feedback circuit (18) further increases the current of the diode (11).

A long wavelength infrared sensor includes a first magnetoresistive unit; a second magnetoresistive unit; and a light absorption layer that absorbs light and emits heat, wherein the first magnetoresistive unit includes a first magnetoresistive element and a second magnetoresistive element electrically connected to each other, the second magnetoresistive unit includes a third magnetoresistive element and a fourth magnetoresistive element electrically connected to each other, the first and third magnetoresistive elements each have an antiparallel state of magnetization direction, the second and fourth magnetoresistive elements each have a parallel state of magnetization direction, and the first magnetoresistive element is electrically connected to the third magnetoresistive element by way of the second magnetoresistive element.

Devices, systems, and methods for calibrating for an electron beam additive manufacturing system. The electron beam manufacturing system includes electron beam guns. A calibration system includes an optical pyrometer. The optical pyrometer captures thermal radiation emitted from raw material. An analysis component is communicatively coupled to the optical pyrometer. The analysis component is programmed to determine calibration parameters from information from the optical pyrometer and a phase transition temperature.

Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include the use of an electrically conductive alloy material or intermetallic material of at least two or more elements to promote scattering of phonons. These materials are selected to scatter heat carriers while allowing electrons to pass through the material.

Systems and methods include an infrared camera configured to capture an infrared image of a scene, a visible-light camera configured to capture a visible-light image of the scene, and a logic device configured to simultaneously capture a pair of images of the scene comprising the infrared image of the scene and the visible image of the scene, align the pair of images so that a pixel location in one of the pair of images has a corresponding pixel location in the other image, classify the visible image, annotate the infrared image based, at least in part, on the classification of the visible image, and add the annotated infrared image to a neural network training dataset for use in training a neural network for infrared image classification. A beamsplitter is arranged to reflect a first image of the scene towards the infrared camera and pass through a second image of the scene to the visible-light camera, and a first blackbody is attached thereto and positioned in a field of view of the infrared camera.

A trigger sense circuit includes a pseudo-differential comparator circuit in signal communication with a pixel array. The pseudo-differential comparator circuit includes a first input in signal communication with a reference pixel group included in the pixel array to receive a pixel reference voltage, and a second input in signal communication with a target pixel group included in the pixel array to receive a pixel target voltage. The pseudo-differential comparator circuit is configured to selectively operate in a calibration mode to remove false trigger events and a comparison mode to detect at least one overheated pixel included in the target pixel group.

A resistive element array circuit includes word lines, bit lines, resistive elements, a selector, a differential amplifier, and a ground terminal. The word lines are coupled to a power supply. The resistive elements are each disposed at an intersection of corresponding one of the word lines and corresponding one of the bit lines. The selector is configured to select one word line and one bit line. The differential amplifier includes a positive input terminal configured to be coupled to the selected one of the bit lines which is selected by the selector, a negative input terminal configured to be coupled to non-selected one of the bit lines which is not selected by the selector and to non-selected one of the word lines which is not selected by the selector, an output terminal being coupled to the negative input terminal. The ground terminal is coupled to the positive input terminal.

An example object of the present invention is to provide a bolometer-type detector capable of reducing heat transfer between pixels. A bolometer-type detector according to an example aspect of the present invention includes a plurality of pixels, and at least includes: a substrate, a heat insulating layer provided on the substrate, bolometer films provided on individual pixels on the heat insulating layer, and a wiring for signal output connected to contact electrodes provided in contact with the bolometer films, wherein the wiring for signal output is disposed in a layer different from the bolometer films, and the heat insulating layer between adjacent pixels is removed at least partially in the depth direction and in a region of a length of 50% or longer and a width of 100 nm or wider of a closed curve that surrounds each bolometer film.

An imaging system includes a focal plane array, readout electronics, and a computing system in which the number of active pixels is either set at a low-fraction of the total pixels thereby reducing the effect of radiation damage, or radiation damage over time is detected and automatically compensated. Machine learning is used to identify radiation damaged pixels and damaged regions which are subsequently eliminated and replaced by the computational system. The machine learning is used to identify changes in the fixed pattern signal/noise and/or noise of the system, and is then computationally corrected.