G01J5/0245

Method for determining a temperature without contact, and infrared measuring system

A method and an infrared measuring system for determining a temperature distribution of a surface without contact includes an infrared detector array with a detector array substrate and respective pluralities of measuring pixels and reference pixels. The measuring pixels are each connected to the detector array substrate with a first thermal conductivity, are sensitive to infrared radiation, and each provide a measurement signal for determining a temperature measurement value that depends on the intensity of the incident infrared radiation. The reference pixels are each connected to the detector array substrate with a second thermal conductivity and each provide a measurement signal for determining a temperature measurement value. The reference pixels are implemented as blind pixels that are substantially insensitive to infrared radiation. The temperature measurement values of the measuring pixels are corrected by a pixel-associated temperature drift component determined with reference to the temperature measurement values of the reference pixels.

Suspended-membrane thermal detector comprising a deformable part for thermal short-circuit

A thermal detector including a substrate, an absorbent membrane including a fixed part and a deformable part, the latter including a shape-memory alloy, and being arranged with respect to the substrate in such a way that its free end is in contact with the substrate at the contact temperature T.sub.c above the austenite start temperature A.sub.s.

Low cost and high performance bolometer circuitry and methods
11015979 · 2021-05-25 · ·

A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation. The bolometer circuit may be configured to reduce power consumption at high temperatures. In particular, the bolometer circuit may include additional resistors provided in the resistive loads for bolometer conduction paths to limit power at high temperatures. In some embodiments, the bias (e.g., a voltage level) to the gates of transistors in the resistive loads for the bolometer conduction paths may be adjusted based on temperature to limit power and/or current at high temperatures. In bolometer circuits with a feedback resistor provided across an amplifier to configure a feedback amplifier, a circuit with adjustable amplifier power may be provided to save power. In some embodiments, a bolometer circuits may be provided with reduced gains to allow for very hot scenes to be imaged without railing the output.

Method for determining a temperature without contact, and infrared measuring system

A method for contactlessly establishing a temperature of a surface includes determining the temperature measurement values of the plurality of blind pixels and determining temperature measurement values of the plurality of measurement pixels. The method further includes determining a temperature measurement value and a temperature measurement values by subtracting the temperature measurement value of the first blind pixel of the plurality of blind pixels from a temperature measurement value of a second blind pixel of the plurality of blind. The method further includes correcting the temperature measurement values by pixel-associated temperature drift components in each case, wherein the temperature drift components are determined using the temperature measurement value and/or the temperature measurement value.

Devices and methods for infrared reference pixels

A device is disclosed including a substrate and a floating blinded infrared detector and/or a shunted blinded infrared detector. The floating blinded infrared detector may include an infrared detector coupled to and thermally isolated from the substrate; and a blocking structure disposed above the infrared detector to block external thermal radiation from being received by the infrared detector; and wherein the blocking structure comprises a plurality of openings. The shunted blinded infrared detector may include an additional infrared detector coupled to the substrate; an additional blocking structure disposed above the infrared detector to block external thermal radiation from being received by the additional infrared detector; and a material that thermally couples the additional infrared detector to the substrate and the additional blocking structure. Methods for using and forming the device are also disclosed.

SUSPENDED-MEMBRANE THERMAL DETECTOR COMPRISING A DEFORMABLE PART FOR THERMAL SHORT-CIRCUIT

A thermal detector including a substrate, an absorbent membrane including a fixed part and a deformable part, the latter including a shape-memory alloy, and being arranged with respect to the substrate in such a way that its free end is in contact with the substrate at the contact temperature T.sub.c above the austenite start temperature A.sub.s.

SUSPENDED-MEMBRANE THERMAL DETECTOR COMPRISING A DEFORMABLE ABSORBER

A thermal detector including a three-dimensional structure adapted for detecting electromagnetic radiation, suspended above and thermally insulated from a substrate, including a membrane and an absorber, the latter being formed on the basis of a shape-memory alloy and being adapted to have a flat detection configuration when its temperature is less than or equal to T.sub.1 and a cooling curve configuration when its temperature is above an austenite start temperature A.sub.s.

Thermal protection mechanisms for uncooled microbolometers
10520364 · 2019-12-31 · ·

Methods and apparatus for preventing solar damage, and other heat-related damage, to uncooled microbolometer pixels. In certain examples, a thermochroic membrane that becomes highly reflective at temperatures above a certain threshold is applied over at least some of the microbolometer pixels to prevent the pixels from being damaged by excessive heat.

LOW COST AND HIGH PERFORMANCE BOLOMETER CIRCUITRY AND METHODS
20190368941 · 2019-12-05 ·

A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation. The bolometer circuit may be configured to reduce power consumption at high temperatures. In particular, the bolometer circuit may include additional resistors provided in the resistive loads for bolometer conduction paths to limit power at high temperatures. In some embodiments, the bias (e.g., a voltage level) to the gates of transistors in the resistive loads for the bolometer conduction paths may be adjusted based on temperature to limit power and/or current at high temperatures. In bolometer circuits with a feedback resistor provided across an amplifier to configure a feedback amplifier, a circuit with adjustable amplifier power may be provided to save power. In some embodiments, a bolometer circuits may be provided with reduced gains to allow for very hot scenes to be imaged without railing the output.

Method for Determining a Temperature without Contact, and Infrared Measuring System

A method for contactlessly establishing a temperature of a surface includes determining the temperature measurement values of the plurality of blind pixels and determining temperature measurement values of the plurality of measurement pixels. The method further includes determining a temperature measurement value and a temperature measurement values by subtracting the temperature measurement value of the first blind pixel of the plurality of blind pixels from a temperature measurement value of a second blind pixel of the plurality of blind. The method further includes correcting the temperature measurement values by pixel-associated temperature drift components in each case, wherein the temperature drift components are determined using the temperature measurement value and/or the temperature measurement value.