G01J5/064

METHOD, APPARATUS FOR TEMPERATURE DETECTION AND WEARABLE DEVICE
20230048877 · 2023-02-16 ·

Embodiments of the present disclosure provide a method for temperature detection. The method comprises obtaining a sensed temperature from a sensor, the sensor being in a mounted mode where the sensor is thermally radiated by a variable heat source and a fixed heat source; determining a temperature change rate of the sensor and at least one affecting factor that affects temperature sensing of the sensor; and determining a temperature of the variable heat source based on the sensed temperature, the temperature change rate, and the affecting factor. According to the method of the present disclosure, the temperature of the variable heat source such as an ambient temperature can be obtained or determined without a dedicated sensor and cables. With this method, the ambient temperature can be determined by a sensor for sensing a temperature of a heating element such as a battery, a control unit or the like. In this way, extra spaces and product designs for mounting a dedicated sensor for the ambient temperature are no longer needed, which reduces costs of the product. Furthermore, user experience can be improved without increasing costs.

Wearable Device, and Body Temperature Presentation System
20230046325 · 2023-02-16 ·

A wearable device includes: a base to be worn on a head of a user; a first sensor that is provided to the base to be at a distance from a surface of the user's head and measures a first signal relating to a temperature of the surface of the user's head; an estimation circuit that estimates a body temperature of the user based on the first signal; and a display that presents the body temperature of the user estimated by the estimation circuit.

TEMPERATURE COMPENSATION IN INFRARED IMAGING SYSTEMS AND METHODS
20230048503 · 2023-02-16 ·

Techniques for facilitating temperature compensation are provided. In one example, an infrared imaging system includes a focal plane array configured to capture radiation from a scene and generate image data based on the radiation. The focal plane array further captures radiation from an element associated with the infrared imaging system during capture of the radiation from the scene. The infrared imaging system further includes a temperature sensor configured to determine a temperature of the focal plane array. The infrared imaging system further includes a processing circuit configured to determine a temperature associated with the element based on the temperature of the focal plane array. The processing circuit is further configured to determine a temperature associated with an object in the scene based on the infrared image data, the temperature associated with the element, and the temperature of the focal plane array. Related devices and methods are also provided.

INFRARED THERMOPILE SENSOR

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Optical detection device having adhesive member

A light detection device includes a Fabry-Perot interference filter, a light detector, a spacer that has a placement surface on which a portion outside a light transmission region in a bottom surface of the interference filter is placed, and an adhesive member that adheres the interference filter and the spacer to each other. Elastic modulus of the adhesive member is smaller than elastic modulus of the spacer. At least a part of a lateral surface of the interference filter is located on the placement surface such that a part of the placement surface of the spacer is disposed outside the lateral surface. The adhesive member is disposed in a corner portion formed by the lateral surface of the interference filter and the part of the placement surface of the spacer and contacts each of the lateral surface and the part of the placement surface.

Systems and methods for thermal radiation detection

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

Temperature Measurement by Infrared Analysis
20230014408 · 2023-01-19 · ·

A device for detecting infrared radiation emanating from a subject while not in physical contact with the subject. The device includes a body, an infrared sensor located in the body oriented to receive the infrared radiation and to generate at least one output that corresponds to the received infrared radiation, a rangefinder located in the body to generate at least one output that corresponds to a distance between the device and the subject, an ambient sensor to determine ambient temperature and to generate at least one output that corresponds to the ambient temperature, an analog to digital converter in communication with the infrared sensor, the rangefinder, and/or the ambient sensor, to receive the at least one output, a processor in communication with the analog to digital converter, the infrared sensor, the rangefinder, and/or the ambient sensor to process an output of the analog to digital converter, the at least one output of the infrared sensor, the at least one output of the rangefinder, and/or the at least one output of the ambient sensor, into a computed temperature of the subject. The processor adjusts the computed temperature based on the ambient temperature and the distance between the device and the subject corresponding to a maximum computed temperature of the subject. The device includes a display to show the temperature of the subject that is based at least in part on the computed temperature.

SEMICONDUTOR PACKAGE, WEARABLE DEVICE, AND TEMPERATURE DETECTION METHOD

A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.

Body Temperature Measurement Method, Electronic Device, and Computer-Readable Storage Medium
20220386878 · 2022-12-08 ·

A body temperature measurement method applied to a wrist wearable device includes, when a body temperature of a user is measured, measuring a first temperature at a forehead of the user using a temperature sensor, and measuring a second temperature at a wrist of the user is using a second temperature sensor at a relatively close time. Through calculation, a third temperature associated with the first temperature is displayed on a display. A fourth temperature at the wrist is then measured using the second temperature sensor. When the fourth temperature is the same as the second temperature, the third temperature is displayed on the display according to the foregoing relationship.