Patent classifications
G01J5/064
METHOD OF COLLECTING SIGNALS SENSED FROM SENSING TRANSISTORS, CORRESPONDING SENSOR DEVICE AND IMAGING CAMERA
Current signals indicative of sensed physical quantities are collected from sensing transistors in an array of sensing transistors. The sensing transistors have respective control nodes and current channel paths therethrough between respective first nodes and a second node common to the sensing transistors. A bias voltage level is applied to the respective first nodes of the sensing transistors in the array and one sensing transistor in the array of sensing transistors is selected. The selected sensing transistor is decoupled from the bias voltage level, while the remaining sensing transistors in the array of sensing transistors maintain coupling to the bias voltage level. The respective first node of the selected sensing transistor in the array of sensing transistors is coupled to an output node, and an output current signal is collected from the output node.
Ear thermometer with a probe cover ejection device
The application provides an ear thermometer with a probe cover ejection device. The ear thermometer comprises a holding body and a measuring assembly disposed at one end of the holding body, which comprises a probe, a rotating member, and a socket. The rotating member includes a ring cover with an opening formed in a middle of the ring cover, at least one first abutting portion axially extended from a lateral side of the ring cover, and a lever portion radially extended from the lateral side of the ring cover. The socket includes a circular bottom surface and a closed section and an open section defined on a periphery of the circular bottom surface, a side wall surface vertically provided on the closed section, an accommodating space sandwiched between the side wall surface and the circular bottom surface, and at least one second abutting portion formed on the circular bottom surface. In this way, the dual motions of the radial and axial directions can be used to ensure that the probe cover can be reliably ejected and removed from the probe.
ELECTRONIC DEVICE INCLUDING PROXIMITY SENSOR HAVING A PLURALITY OF LIGHT RECEIVING ELEMENTS AND METHOD OF CONTROLLING THE SAME
An electronic device may include: a display having at least one hole disposed in at least a part thereof such that light from the outside can be transmitted therethrough; a light-emitting element disposed under the display and configured to output a first infrared ray to the outside; a first light-receiving element disposed under the display at a position corresponding to the at least one hole, and configured to receive a second infrared ray transmitted from the outside; a second light-receiving element disposed under the display at a position where light from the outside is shielded; and at least one processor configured to, based on that a first sensing value according to the second infrared ray, output from the first light-receiving element, satisfies a first specified condition, while the first infrared ray is output: based on that a second sensing value output from the second light-receiving element does not satisfy a second specified condition, identify that a proximate object exists, and based on that the second sensing value satisfies the second specified condition, identify that the proximate object does not exist.
HEALTHCARE DEVICE FOR PERSONS SUFFERING FROM CHRONIC RESPIRATORY DISEASES
A healthcare device for asthmatic patients that can help in reducing and avoiding risk factors that can trigger one or more symptoms of asthma. The healthcare device includes an infrared sensor, a pulse oximeter sensor, a UV sensor, an atmospheric sensor, and an air quality sensor for measuring values of different risk factors including ambient temperature, body temperature, blood oxygen saturation level, heart rate, intensity of ultraviolet radiations, humidity level, altitude, CO2 levels, and total volatile organic compounds (TVOCs).
Display controller for detecting the presence of a user
An apparatus to detect the presence of a user includes, in one embodiment, an infrared sensor that passively detects infrared light radiated from an observation target, a heat source arranged proximate the infrared sensor, and a determinator that determines whether the observation target is present in response to information changing along with an operational situation of the heat source and infrared data detected by the infrared sensor. A method and a computer program product also perform functions of the apparatus.
Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter material
The invention relates to a method for fabricating a thermal detector (1), comprising the following steps: forming a first stack (10), comprising a thermal detector (20), a mineral sacrificial layer (15) and a thin encapsulation layer (16) having a lateral vent (17.1); forming a second stack (30), comprising a thin sealing layer (33) and a getter portion (34); eliminating the mineral sacrificial layer (15); assembling by direct bonding the thin sealing layer (33), brought into contact with the thin encapsulation layer (16) and blocking the lateral vent (17.1), the getter portion (34) being located in the lateral vent (17.1).
THERMOMETER STRUCTURE WITH HIGH STABILITY AND SYSTEM USING THE SAME
There is provided a thermometer structure including a circuit board, an infrared thermometer, a heat sink and a metal block. The infrared thermometer is arranged on the circuit board and electrically connected thereto. The heat sink is arranged on the circuit board and covers the infrared thermometer. The metal block is in contact with at least one of the circuit board and the heat sink to stabilize a local temperature of the thermometer structure.
INFRARED THERMOPILE SENSOR
An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.
Device and method for parasitic heat compensation in an infrared camera
A method of calibrating an infrared (IR) camera including a pixel array housed in a housing, the pixel array having an image sensor and one or more parasitic heat sensing pixels arranged to receive infrared light from different portions of an interior surface of the housing, the method including: receiving, by a processing device, one or more readings from each of the parasitic heat sensing pixels and from each pixel of the pixel array; and generating, by the processing device based on the one or more readings, one or more conversion matrices for converting readings from the parasitic heat sensing pixels into pixel correction values for performing 2D signal correction of the image.
Temperature measuring device and method using thermal imaging camera, and computer-readable recording medium
A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.