Disclosed herein is a sensor system including four interconnected resistors, where two of the resistors are photoconductive detectors, where the photoconductive detectors are illuminated with light at least at two different wavelengths, where two of the resistors does not change their resistance due to the illumination, where an external voltage is applicable to the sensor system, where a differential voltage is measurable, which depends on the resistance changes of the illuminated photoconductive detectors, where the differential voltage gives a mathematical ratio of the four respective resistances.

A temperature sensor module with an integrated lid structure for spurious IR-cancellation is disclosed. An improved temperature sensor module that allows detection of a maximum of the relevant IR-radiation from an object's surface of interest as well as generation of additional information about parasitic or spurious IR-radiation that distort the relevant thermal signal in order to enable a cancellation of interfering thermal signal portions is presented. The temperature sensor module includes a temperature sensing element, a sensor-interface control integrated circuit, whereas the temperature sensing element is coupled to the sensor-interface control IC, and a lid structure and a sensor packaging both defining a field of view of the temperature sensor module, wherein the lid structure is formed by a substrate comprising a second integrated temperature sensor connected to the sensor-interface control IC or an external connected processing unit.

A temperature sensor module with an integrated lid structure for spurious IR-cancellation is disclosed. An improved temperature sensor module that allows detection of a maximum of the relevant IR-radiation from an object's surface of interest as well as generation of additional information about parasitic or spurious IR-radiation that distort the relevant thermal signal in order to enable a cancellation of interfering thermal signal portions is presented. The temperature sensor module includes a temperature sensing element, a sensor-interface control integrated circuit, whereas the temperature sensing element is coupled to the sensor-interface control IC, and a lid structure and a sensor packaging both defining a field of view of the temperature sensor module, wherein the lid structure is formed by a substrate comprising a second integrated temperature sensor connected to the sensor-interface control IC or an external connected processing unit.

A spectral radiometer system, measures incoming light intensity and spectral distribution in different wavelength-bands. An additional data storage device allows recording of the measured data. The inclusive sensor system yields very high sensitivity to incoming light. Furthermore, outstanding linearity of the detector response over several orders of magnitude of incoming light is achieved. Additional benefits are ultra low power consumption and minimum size. The sensor system can be used in remote solar radiation monitoring applications like mobile solar power units as well as in long-term environmental monitoring systems where high precision and low power consumption is a necessity.

A spectral radiometer system, measures incoming light intensity and spectral distribution in different wavelength-bands. An additional data storage device allows recording of the measured data. The inclusive sensor system yields very high sensitivity to incoming light. Furthermore, outstanding linearity of the detector response over several orders of magnitude of incoming light is achieved. Additional benefits are ultra low power consumption and minimum size. The sensor system can be used in remote solar radiation monitoring applications like mobile solar power units as well as in long-term environmental monitoring systems where high precision and low power consumption is a necessity.

An embodiment of a device is disclosed. The device includes a lens, operative in the infrared, configured to receive an image of a field of view of the lens, a microlens array, operative in the infrared, optically coupled to the lens and configured to create an array of light field images based on the image, a photodetector array comprising a plurality of non-silicon photodetectors, photosensitive in at least part of the thermal spectrum from 3 microns to 14 microns, the photodetector array being optically coupled to the microlens array and configured to generate output signals from the non-silicon photodetectors based on the array of light field images, and a read-out integrated circuit (ROIC) communicatively coupled to the photodetector array and configured to receive the signals from the photodetector array, convert them to digital signals and to output digital data.

An embodiment of a device is disclosed. The device includes a lens, operative in the infrared, configured to receive an image of a field of view of the lens, a microlens array, operative in the infrared, optically coupled to the lens and configured to create an array of light field images based on the image, a photodetector array comprising a plurality of non-silicon photodetectors, photosensitive in at least part of the thermal spectrum from 3 microns to 14 microns, the photodetector array being optically coupled to the microlens array and configured to generate output signals from the non-silicon photodetectors based on the array of light field images, and a read-out integrated circuit (ROIC) communicatively coupled to the photodetector array and configured to receive the signals from the photodetector array, convert them to digital signals and to output digital data.

An apparatus that senses temperature from a digital infrared sensor is described. A digital signal representing a temperature without conversion from analog is transmitted from the digital infrared sensor received by a microprocessor and converted to body core temperature by the microprocessor.

An apparatus that senses temperature from a digital infrared sensor is described. A digital signal representing a temperature without conversion from analog is transmitted from the digital infrared sensor received by a microprocessor and converted to body core temperature by the microprocessor.

A temperature sensor module with an integrated lid structure for spurious IR-cancellation is disclosed. An improved temperature sensor module that allows detection of a maximum of the relevant IR-radiation from an object's surface of interest as well as generation of additional information about parasitic or spurious IR-radiation that distort the relevant thermal signal in order to enable a cancellation of interfering thermal signal portions is presented. The temperature sensor module includes a temperature sensing element, a sensor-interface control integrated circuit, whereas the temperature sensing element is coupled to the sensor-interface control IC, and a lid structure and a sensor packaging both defining a field of view of the temperature sensor module, wherein the lid structure is formed by a substrate comprising a second integrated temperature sensor connected to the sensor-interface control IC or an external connected processing unit.