A radiation temperature measuring device includes: an infrared sensor that detects a wavelength including an absorption band by atmosphere; an absorption rate calculation unit that calculates an absorption rate by the atmosphere when measuring a surface temperature of an object from output of the infrared sensor; an output storage unit that stores conversion information for converting the output of the infrared sensor into the surface temperature of the object; a surface temperature calculation correction unit that calculates the surface temperature of the object from the output of the infrared sensor, the absorption rate calculated by the absorption rate calculation unit, and the conversion information; and an absorption rate storage unit that stores in advance the absorption rate by the atmosphere when the conversion information is set, in which the calculated surface temperature of the object is corrected with the absorption rate stored in the absorption rate storage unit.

A radiation temperature measuring device includes: an infrared sensor that detects a wavelength including an absorption band by atmosphere; an absorption rate calculation unit that calculates an absorption rate by the atmosphere when measuring a surface temperature of an object from output of the infrared sensor; an output storage unit that stores conversion information for converting the output of the infrared sensor into the surface temperature of the object; a surface temperature calculation correction unit that calculates the surface temperature of the object from the output of the infrared sensor, the absorption rate calculated by the absorption rate calculation unit, and the conversion information; and an absorption rate storage unit that stores in advance the absorption rate by the atmosphere when the conversion information is set, in which the calculated surface temperature of the object is corrected with the absorption rate stored in the absorption rate storage unit.

A detection component is provided for detecting electromagnetic radiation, the detection component comprising a mask arranged to block the electromagnetic radiation for at least one detector. The opaque mask comprises a successive stack of a first metal layer, a second metal layer, a third transparent layer having a low optical index, and an assembly of metal components. The second metal layer, the transparent layer, and the assembly of components form MIM structures in the wavelength range. The invention further relates to a method for manufacturing such a detection component.

A detection component is provided for detecting electromagnetic radiation, the detection component comprising a mask arranged to block the electromagnetic radiation for at least one detector. The opaque mask comprises a successive stack of a first metal layer, a second metal layer, a third transparent layer having a low optical index, and an assembly of metal components. The second metal layer, the transparent layer, and the assembly of components form MIM structures in the wavelength range. The invention further relates to a method for manufacturing such a detection component.

Provided is a system for measuring gas temperature and component concentrations in a combustion field based on optical comb. The system includes two pulse laser devices, two continuous laser devices, a beam splitting device, a measurement path, an interference signal detecting device, an optical processing and electrical processing device and a signal acquisition and analysis device. The measurement path refers to the combustion field to be measured. The interference signal detecting device outputs an interference signal. The optical processing and electrical processing device includes several optic elements and electrical elements, and outputs an adaptive compensation signal and an asynchronous sampling clock signal after a series of processing on output of the two pulse laser devices and two continuous laser devices. The signal acquisition and analysis device outputs the measurement result based on the adaptive compensation signal, the asynchronous sampling clock signal and a stable interference signal.

Provided is a system for measuring gas temperature and component concentrations in a combustion field based on optical comb. The system includes two pulse laser devices, two continuous laser devices, a beam splitting device, a measurement path, an interference signal detecting device, an optical processing and electrical processing device and a signal acquisition and analysis device. The measurement path refers to the combustion field to be measured. The interference signal detecting device outputs an interference signal. The optical processing and electrical processing device includes several optic elements and electrical elements, and outputs an adaptive compensation signal and an asynchronous sampling clock signal after a series of processing on output of the two pulse laser devices and two continuous laser devices. The signal acquisition and analysis device outputs the measurement result based on the adaptive compensation signal, the asynchronous sampling clock signal and a stable interference signal.

The present disclosure provides an infrared sensing device having a simple structure and being capable of detecting an infrared ray. A device 300 includes a variable resistance portion 13 whose electrical resistance varies in response to an infrared ray and a detection portion that detects the variation of the electrical resistance of the variable resistance portion. The variable resistance portion satisfies at least one of i) inclusion of a material potentially absorbing an infrared ray by localized surface plasmon resonance, and ii) reception of a carrier from a carrier supply portion 23 including the above material and being in contact with the variable resistance portion, the carrier being an electron and/or a hole, the carrier being generated by irradiation of the carrier supply portion with an infrared ray.

The present disclosure provides an infrared sensing device having a simple structure and being capable of detecting an infrared ray. A device 300 includes a variable resistance portion 13 whose electrical resistance varies in response to an infrared ray and a detection portion that detects the variation of the electrical resistance of the variable resistance portion. The variable resistance portion satisfies at least one of i) inclusion of a material potentially absorbing an infrared ray by localized surface plasmon resonance, and ii) reception of a carrier from a carrier supply portion 23 including the above material and being in contact with the variable resistance portion, the carrier being an electron and/or a hole, the carrier being generated by irradiation of the carrier supply portion with an infrared ray.

The high-pixel-count uncooled thermal imaging arrays disclosed herein have liquid crystal (LC) microcavity transducers separate from the read-out integrated circuit (ROIC). The transducer converts incident infrared (IR) radiation in birefringence changes that can be measured with visible light. In other words, the system uses the temperature sensitivity of the LC birefringence to convert the IR scene to a visible image. Measurements on sample arrays indicate that the LC material quality is similar to that of bulk samples and has good noise performance. Additionally, high-fill-factor arrays on fused-silica substrates may be processed to enable optimization of conditions for greatly improved temperature sensitivity. An additional IR absorber layer may be integrated into the process to tune the structure for the infrared.

The high-pixel-count uncooled thermal imaging arrays disclosed herein have liquid crystal (LC) microcavity transducers separate from the read-out integrated circuit (ROIC). The transducer converts incident infrared (IR) radiation in birefringence changes that can be measured with visible light. In other words, the system uses the temperature sensitivity of the LC birefringence to convert the IR scene to a visible image. Measurements on sample arrays indicate that the LC material quality is similar to that of bulk samples and has good noise performance. Additionally, high-fill-factor arrays on fused-silica substrates may be processed to enable optimization of conditions for greatly improved temperature sensitivity. An additional IR absorber layer may be integrated into the process to tune the structure for the infrared.