Embodiments disclosed herein include a method for determining a temperature error of a pyrometer. In an embodiment, the method comprises measuring a first signal with a first sensor of the pyrometer and measuring a second signal with a second sensor of the pyrometer. In an embodiment, the method further comprises determining a reflectivity of a reflector plate from the first signal and the second signal, and determining the temperature error using the reflectivity.

Remote temperature measurement of cookware through a ceramic glass plate using an infrared sensor, taking into account the emissivity of the cookware which is continuously evaluated, and taking into account the temperature of the ceramic glass plate.

A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.

An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.

A system simulates hyperspectral imaging data or multispectral imaging data for a simulated sensor. Blackbody radiance of real-world thermal imagery data is computed using a Planck function, which generates a simulated spectral hypercube. Spectral emissivity data for background materials are multiplied by a per-pixel weighting function, which generates weighted spectral emissivity data. The simulated spectral hypercube is multiplied by the weighted spectral emissivity data, which generates background data in the simulated spectral hypercube. Simulated targets are inserted the background data using the Planck function. The simulated spectral hypercube is modified, and then it is used to estimate a mission measure of effectiveness of the simulated sensor.

An upper radiation thermometer is provided obliquely above a semiconductor wafer to be measured. The upper radiation thermometer includes a photovoltaic detector that produces an electromotive force when receiving light. The photovoltaic detector has both high-speed responsivity and good noise properties in a low-frequency range. The upper radiation thermometer does not require a mechanism for cooling because the photovoltaic detector is capable of obtaining sufficient sensitivity at room temperature without being cooled. There is no need to provide a light chopper and a differentiating circuit in the upper radiation thermometer. This allows the upper radiation thermometer to measure the front surface temperature of the semiconductor wafer with a simple configuration both during preheating by means of halogen lamps and during flash irradiation.

An optical sensing system includes at least one electro-optical sensor having an adjustable field of view and at least one reflective member including a diffuse reflector surface positioned within the field of view of the at least one electro-optical sensor. The system also includes at least one controller configured to generate calibration parameters for the at least one electro-optical sensor based on data for at least one exposure detected by the electro-optical sensor when the diffuse reflector surface is within the field of view of the at least one electro-optical sensor. Methods for calculating the calibration parameters and for directly measuring reflectivity of objects in a scene with at least one electro-optical sensor are also disclosed herein.

Apparatus and methods are disclosed utilizing selected infrared waveband observations to determine selected profiles of interest. A correlative system is constructed and installed at a processor. Thermal and refractivity profiles and structure in a waveband of interest are extracted from observed infrared spectrum single waveband observations received for processing at the processor by the correlative system. The output provides the selected profiles of interest in the waveband of interest. The apparatus includes an infrared receiver and means for measuring angular displacement of received emissions relative to a horizon. The processor converts received emission into equivalent Planck blackbody temperatures across the observations and correlates structure and vertical distribution of the temperatures to provide thermodynamic and refractivity profiles of interest.

A system for measuring temperature of one or more subjects within a scene including a reference object having an unknown emissivity, having an ambient temperature, the system comprising: a visible spectrum camera capable of acquiring images of the scene comprising (a) at least a Region of Interest (RoI) of each of the subjects, and (b) the reference object; a thermal image sensor capable of acquiring images of the scene comprising (a) at least the RoI of each of the subjects, and (b) the reference object; and a processing circuitry configured to: obtain (a) a visible spectrum image captured by the visible spectrum camera, and (b) a thermal image captured by the thermal image sensor, and (c) an indication of a scene ambient temperature within the scene; register the visible spectrum image and the thermal image onto a common coordinate system; identify (a) RoI pixels, on the common coordinate system, of the RoIs of the subjects within the visible spectrum image, (b) reference object pixels, on the common coordinate system, of the reference object within the visible spectrum image and (c) a parameter correlated to an emissivity of the reference object, based on the reference temperature and on the indication of the scene ambient temperature; determine (a) RoI temperatures by analyzing respective RoIs pixels on the thermal image, and (b) a reference temperature by analyzing the reference object pixels on the thermal image; and upon existence of a difference between the reference temperature and the scene ambient temperature, correct the RoI temperatures, based on the difference and utilizing the parameter, to compensate for the difference, giving rise to corrected RoI temperatures.

Systems and methods for dynamic radiometric thermal imaging compensation. The method includes analyzing a visible light image to determine an emissivity value for each of a plurality of visible light pixels making up the visible light image. The method includes associating each of the plurality of thermal pixels making up a thermal image corresponding to the visible light image with at least one of the plurality of visible light pixels making up the visible light image. The method includes generating a second thermal image by, for each of the plurality of thermal pixels making up the thermal image, determining a temperature value based on the thermal pixel value of the thermal pixel and the emissivity value of the at least one of the plurality of visible light pixels associated with the thermal pixel.