G01K11/125

TEMPERATURE MEASURING DEVICE AND TEMPERATURE MEASURING METHOD FOR PROVIDING LIGHT SPOT MARKS OF DIFFERENT COLORS
20230007961 · 2023-01-12 ·

A temperature measuring device and a temperature measuring method for providing light spot marks of different colors are provided. The temperature measuring device includes a temperature measuring main body, a signal-providing module, a temperature-sensing module, and a first and a second color projection module. The signal-providing module and the temperature-sensing module are disposed on the temperature measuring main body. The temperature-sensing module is configured for measuring a temperature of a target area of an object. The first color projection module is disposed on the temperature measuring main body, and configured for projecting a first color light beam onto the target area of the object by control of the signal-providing module. The second color projection module is disposed on the temperature measuring main body, and configured for projecting a second color light beam onto the target area of the object by control of the signal-providing module.

TEMPERATURE MEASURING DEVICE AND TEMPERATURE MEASURING METHOD FOR PROVIDING LIGHT SPOT MARKS OF DIFFERENT COLORS
20230007961 · 2023-01-12 ·

A temperature measuring device and a temperature measuring method for providing light spot marks of different colors are provided. The temperature measuring device includes a temperature measuring main body, a signal-providing module, a temperature-sensing module, and a first and a second color projection module. The signal-providing module and the temperature-sensing module are disposed on the temperature measuring main body. The temperature-sensing module is configured for measuring a temperature of a target area of an object. The first color projection module is disposed on the temperature measuring main body, and configured for projecting a first color light beam onto the target area of the object by control of the signal-providing module. The second color projection module is disposed on the temperature measuring main body, and configured for projecting a second color light beam onto the target area of the object by control of the signal-providing module.

OPTICAL SENSOR AND PHYSICAL QUANTITY MEASUREMENT DEVICE
20220357185 · 2022-11-10 ·

An optical sensor includes a tube-shaped base formed from a metal, an optical fiber member received inside the base, and a sensor head formed from monocrystalline alumina and bonded to the base to be optically connected with the optical fiber member. The sensor head is provided with a first cavity including a first reflection surface configured to reflect a part of light introduced through the optical fiber member and a second reflection surface provided facing the first reflection surface and configured to reflect a part of the light reflected by the first reflection surface. A first interference light produced by an interference between the light reflected by the first reflection surface and the light reflected by the second reflection surface is output from the first cavity.

OPTICAL SENSOR AND PHYSICAL QUANTITY MEASUREMENT DEVICE
20220357185 · 2022-11-10 ·

An optical sensor includes a tube-shaped base formed from a metal, an optical fiber member received inside the base, and a sensor head formed from monocrystalline alumina and bonded to the base to be optically connected with the optical fiber member. The sensor head is provided with a first cavity including a first reflection surface configured to reflect a part of light introduced through the optical fiber member and a second reflection surface provided facing the first reflection surface and configured to reflect a part of the light reflected by the first reflection surface. A first interference light produced by an interference between the light reflected by the first reflection surface and the light reflected by the second reflection surface is output from the first cavity.

USE OF A SPIN TRANSITION MATERIAL TO MEASURE AND/OR LIMIT THE TEMPERATURE OF ELECTRONIC/PHOTONIC COMPONENTS

The invention relates to the use of a spin transition material to measure and/or limit the temperature in an electronic and/or photonic component, to methods for thermometrically measuring and/or limiting the overheating of components, as well as to electronic or photonic components comprising a film composed of said spin transition material.

USE OF A SPIN TRANSITION MATERIAL TO MEASURE AND/OR LIMIT THE TEMPERATURE OF ELECTRONIC/PHOTONIC COMPONENTS

The invention relates to the use of a spin transition material to measure and/or limit the temperature in an electronic and/or photonic component, to methods for thermometrically measuring and/or limiting the overheating of components, as well as to electronic or photonic components comprising a film composed of said spin transition material.

APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE

A temperature measuring apparatus for measuring a temperature of a substrate is described. A light emitting source that emits light signals such as laser pulses are applied to the substrate. A detector on the other side of the light emitting source receives the reflected laser pulses. The detector further receives emission signals associated with temperature or energy density that is radiated from the surface of the substrate. The temperature measuring apparatus determines the temperature of the substrate during a thermal process using the received laser pulses and the emission signals. To improve the signal to noise ratio of the reflected laser pulses, a polarizer may be used to polarize the laser pulses to have a S polarization. The angle in which the polarized laser pulses are applied towards the substrate may also be controlled to enhance the signal to noise ratio at the detector's end.

APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE

A temperature measuring apparatus for measuring a temperature of a substrate is described. A light emitting source that emits light signals such as laser pulses are applied to the substrate. A detector on the other side of the light emitting source receives the reflected laser pulses. The detector further receives emission signals associated with temperature or energy density that is radiated from the surface of the substrate. The temperature measuring apparatus determines the temperature of the substrate during a thermal process using the received laser pulses and the emission signals. To improve the signal to noise ratio of the reflected laser pulses, a polarizer may be used to polarize the laser pulses to have a S polarization. The angle in which the polarized laser pulses are applied towards the substrate may also be controlled to enhance the signal to noise ratio at the detector's end.

Method and apparatus for measuring temperature
11662253 · 2023-05-30 · ·

Apparatuses and methods for measuring substrate temperature are provided. In one or more embodiments, an apparatus for estimating a temperature is provided and includes a plurality of electromagnetic radiation sources positioned to emit electromagnetic radiation toward a reflection plane, and a plurality of electromagnetic radiation detectors. Each electromagnetic radiation detector is positioned to sample the electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer positioned to receive electromagnetic radiation emitted by plurality of electromagnetic radiation sources and reflected from a substrate disposed at a reflection plane and electromagnetic radiation emitted by the substrate. The apparatus includes a processor configured to estimate a temperature of the substrate based on the electromagnetic radiation emitted by the substrate. Methods of estimating temperature are also provided.

Nanoscale Temperature Sensor
20170370783 · 2017-12-28 ·

A nanoscale temperature sensor is presented that is based on mechano-optical sensing. The temperature sensor features a nanoscale bilayer sensing member with a footprint of <100 nm. The sensing member is composed of two layers of materials with similar elastic modulus but different coefficients of thermal expansion. This difference in coefficients of thermal expansion causes the sensing member to mechanically deform upon temperature change. The deformation of the sensing member alters its optical properties, allowing the temperature measurement to be achieved by far field imaging with high throughput. Both the mechanical and optical properties of the sensing member are reversible thus allow stable and repeatable measurement.