A system includes a core temperature probe and a microwave cooking device. The core temperature probe includes a temperature sensor to determine a temperature information, a coaxial line including a lambda/4 line resonance element adjusted to a microwave frequency, and a signal transmission antenna connected to the temperature sensor via the coaxial line and adapted to emit the temperature information at a signal transmission frequency that differs from the microwave frequency. The system is hereby constructed to transmit a signal at the signal transmission frequency wirelessly between the signal transmission antenna of the core temperature probe and a signal transmission antenna of the microwave cooking appliance.

A sensor device (1) comprises a piezoelectric transducer (3) and a base member (2). The piezoelectric transducer includes a piezoelectric member with at least one excitation electrode (37, 38) connected to a first face thereof and having a thickness (h) between the first face and a second face. The piezoelectric transducer (3) is attached to a supporting face of the base member (2) with the second face of the piezoelectric transducer positioned adjacent the supporting face of the base member. The base member includes at least one acoustic wave reflecting tag (21) distant from the piezoelectric member.

As a temperature measurement apparatus using a surface acoustic wave of a piezoelectric substrate that performs temperature measurement wirelessly and without power supply, the temperature measurement apparatus accurately measures the temperature of the thermocouple tip end by analyzing the frequency characteristics of the surface acoustic wave propagating on the piezoelectric substrate and including temperature information of the piezoelectric substrate, and detecting change in propagation time of the surface acoustic wave of the piezoelectric substrate that is changed by the electromotive force of the thermocouple.

An acoustic wave sensor device, comprising an interdigitated transducer; a first reflection structure arranged on one side of the interdigitated transducer, and a second reflection structure arranged on another side of the interdigitated transducer; a first resonance cavity comprising a first upper surface and formed between the interdigitated transducer and the first reflection structure; a second resonance cavity comprising a second upper surface and formed between the interdigitated transducer and the second reflection structure; and wherein the second upper surface comprises a physical and/or chemical modification as compared to the first upper surface.

The present disclosure discloses a surface acoustic wave temperature sensor and a manufacturing method thereof. The surface acoustic wave temperature sensor includes a sensing module and an antenna module electrically connected to each other. The antenna module includes a first high-temperature-resistant substrate and a patterned antenna formed on a surface of the first high-temperature-resistant substrate, a recess is formed in a first surface of the first high-temperature-resistant substrate, and the sensing module is fixed in the recess. The sensing module and the antenna module of the surface acoustic wave temperature sensor provided by the present disclosure form a whole. Therefore, compared with the prior art, the volume is greatly reduced, and wireless passive temperature monitoring in a high-temperature and narrow space can be better implemented. Moreover, the sensing module can be integrated in the antenna module, and such a structure is more convenient for batch processing.

A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.

A system includes a core temperature probe and a microwave cooking device. The core temperature probe includes a temperature sensor to determine a temperature information, a coaxial line including a lambda/4 line resonance element adjusted to a microwave frequency, and a signal transmission antenna connected to the temperature sensor via the coaxial line and adapted to emit the temperature information at a signal transmission frequency that differs from the microwave frequency. The system is hereby constructed to transmit a signal at the signal transmission frequency wirelessly between the signal transmission antenna of the core temperature probe and a signal transmission antenna of the microwave cooking appliance.

Disclosed in the present disclosure are a surface-acoustic-wave temperature and pressure sensing device and a manufacturing method thereof. The surface-acoustic-wave temperature and pressure sensing device includes a first high-temperature-resistant substrate and a second high-temperature-resistant substrate bonded together, where a recess is formed in the second high-temperature-resistant substrate to form a sealed cavity between the first high-temperature-resistant substrate and the second high-temperature-resistant substrate; first surface-acoustic-wave temperature sensors and surface-acoustic-wave pressure sensors are formed on a first surface of the first high-temperature-resistant substrate located in the cavity, and second surface-acoustic-wave temperature sensors are formed on a second surface of the first high-temperature-resistant substrate opposite the first surface; and the first surface-acoustic-wave temperature sensors, the second surface-acoustic-wave temperature sensors, and the surface-acoustic-wave pressure sensors are electrically connected to one another.

Systems and methods for directly sensing, measuring, or monitoring the temperature of an electrical conductor (31) of a power cable (10), are provided. A surface acoustic wave (SAW) temperature sensor (20) is used that includes a substrate (20S) with a transducer (20T) disposed thereon. The transducer (20T) conducts conversion between an electromagnetic signal and a SAW signal that propagates on the substrate (20S). At least a portion of the substrate (20S) is disposed in thermal contact with the electrical conductor (31) such that the SAW signal varies with the temperature of the electrical conductor (31).

Provided is a surface acoustic wave device using a novel and steadily suppliable piezoelectric material that is resistant to a high-temperature environment and enables the surface acoustic wave device to use a 2 GHz to 2.5 GHz band or higher. The surface acoustic wave device includes: a piezoelectric substrate formed from a monocrystal of gehlenite (CAS: Ca2Al(AlSi)O7); and interdigital transducers formed on a surface acoustic wave propagation plane of the piezoelectric substrate.