A method for testing a temperature measuring instrument is presented, where the instrument includes at least one sensor that changes its electrical resistance, and/or an electrical voltage that it produces, in response to being exposed to a change in temperature, and where the instrument is configured to be coupled to an object of interest. The method includes changing the temperature of at least one sensor by an amount that is detectable given the measurement resolution of the at least one sensor, by driving an electrical manipulation current through this sensor; obtaining one or measurement values from at least one sensor; and evaluating a state of the measuring instrument, a state of one or more of its sensors, and/or a state of a coupling to an object of interest, from the one or more measurement values.

The present disclosure relates to a method for determining and/or monitoring the temperature of a medium by means of a thermometer having at least one temperature sensor, the method including: determining a measured value for the temperature of the medium by means of a temperature sensor; determining a heat flow, in particular heat dissipation, in the region of the temperature sensor; and determining a measured value deviation for the measured value for the temperature on the basis of a model for heat dissipation in the region of the temperature sensor.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

The present disclosure relates to an apparatus for determining and/or monitoring a process variable of a medium, comprising at least one sensor element arranged in a sensor head for determining and/or monitoring the process variable, wherein an internal volume of the sensor head is filled at least partially with a filler. The filler includes at least one fill material, for which at at least one predeterminable phase transformation temperature a phase change occurs, in which the material remains in the solid state, wherein the fill material is in a first phase state when a temperature of the fill material is less than the phase transformation temperature, and wherein the fill material is in a second phase state when the temperature of the fill material is greater than the phase transformation temperature.

Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.

The present invention relates to a testing method for the thermal contact between a temperature sensor (50) and a battery cell (10) of a battery module (30), wherein the method comprises the steps of measuring a temperature T.sub.1 of the temperature sensor (50) at a time point t.sub.1, heating the temperature sensor (50) for a defined time (t.sub.2−t.sub.1), measuring a temperature T.sub.2 of the temperature sensor (50) at a time point t.sub.2 and/or a temperature T.sub.3 of the temperature sensor (50) at a time point t.sub.3, and determining the thermal contact between the temperature sensor (50) and the battery cell (10) based on at least one of the temperature differences ΔT.sub.2,1=(T.sub.2−T.sub.1), ΔT.sub.3,1=(T.sub.3−T.sub.1) and/or ΔT.sub.3,2=(T.sub.3−T.sub.2). The invention further relates to a testing circuit (60) for a temperature sensor (50) of a battery module (30), comprising a thermistor (61) with a first node (67) connected to a first supply voltage (65) and a second node (68) connected to ground (69), a switch (63) interconnected between the first node (67) of the thermistor (61) and a second supply voltage (66), and an analog-to-digital converter (64) connected in parallel to the thermistor (61). The invention further relates to a cell supervision circuit (40) for a battery module (30), comprising a circuit carrier (45), a testing circuit (60) according to any one of the claims 1 to 10, and a temperature sensor (50) surface mounted to the circuit carrier (45) and comprising a measuring head (51) with a thermistor (61) configured to be brought into thermal contact with a battery cell (10) of the battery module (30).

A temperature sensing device for a temperature-based tamper detection system includes an integrated circuit (IC) and a logic circuit. The logic circuit sends an enable signal to the IC, causing it to measure the device temperature, and initiates a security timer. In response to not receiving the device temperature before the security timer expires, the logic circuit outputs a tamper event signal and an error code. The logic circuit can disable the enable signal in response to not receiving the device temperature before the timer expires. In some implementations, the logic circuit is a first logic circuit, and the IC includes an analog integrated circuit (AIC) and a second logic circuit. The second logic circuit receives the enable signal from the first logic circuit, causes the AIC to measure the device temperature, and outputs a ready signal and the device temperature to the first logic circuit.

An ear-wearable electronic device includes one or more processors configured to detect presence of first and second hearing devices in a charging case, and to initiate a self-check protocol by at least one of the first and second hearing devices. The self-check protocol comprises wirelessly coupling the first and second hearing devices, selectively activating at least one electronic component of the first hearing device, and assessing performance of the second hearing device using an output or a response of the at least one electronic component of the first hearing device. The self-check protocol also comprises selectively activating at least one electronic component of the second hearing device, assessing performance of the first hearing device using an output or a response of the at least one electronic component of the second device, and storing results of the performance assessment in a memory.

A diode voltage from a diode circuit can be combined with a proportional to absolute temperature (PTAT) voltage generated by a PTAT circuit to determine a temperature sensor voltage. This temperature sensor voltage may correspond to a temperature of a circuit or a localized temperature. By determining the temperature sensor voltage using a combination of a PTAT voltage and diode voltage, it is possible to remove or a PTAT circuit used to generate a bandgap voltage, which may shrink the temperature sensor and increase the accuracy of the temperature sensor circuit.

A method for installing a replacement electrical heat sensor in a heatable aircraft window laminate structure comprising the steps of: drilling a blind hole in the edge of the window laminate; routing a channel in the edge of the window laminate from the blind hole to a terminal block of an originally installed heat sensor; inserting the replacement heat sensor into the hole; filling the hole with a material to seal the hole and the heat sensor from contamination; heating the window laminate; photographing the window laminate using an infrared camera to determine uniformity of heat distribution; placing a heated plate against the exterior surface of the window laminate directly over the position of the replacement heat sensor; measuring an electrical resistance of the replacement heat sensor to confirm proper operation of the replacement heat sensor.