G01K17/08

MECHANICAL MOVEMENT AND PRESSURE FOR A THERMAL CONDUCTIVITY METER
20220365013 · 2022-11-17 ·

Apparatuses and methods for using the guarded heat flow meter technique are provided. The apparatuses use the guarded heat flow meter method to measure the thermal conductivity of solid materials in the temperature range of about ambient to 300° C. The material being tested is compressed between two plates with a controlled temperature difference. The thermal conductivity of the material is calculated by measuring the heat flux through a reference sample in series with the material under test. The apparatuses and methods comprise mechanical mechanisms for stack and guard movements and methods of stack compression and measurement for the testing.

MECHANICAL MOVEMENT AND PRESSURE FOR A THERMAL CONDUCTIVITY METER
20220365013 · 2022-11-17 ·

Apparatuses and methods for using the guarded heat flow meter technique are provided. The apparatuses use the guarded heat flow meter method to measure the thermal conductivity of solid materials in the temperature range of about ambient to 300° C. The material being tested is compressed between two plates with a controlled temperature difference. The thermal conductivity of the material is calculated by measuring the heat flux through a reference sample in series with the material under test. The apparatuses and methods comprise mechanical mechanisms for stack and guard movements and methods of stack compression and measurement for the testing.

SENSOR DEVICE FOR MEASURING A TEMPERATURE DIFFERENCE IN A COMPUTER CHIP SYSTEM
20220357219 · 2022-11-10 ·

A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.

SENSOR DEVICE FOR MEASURING A TEMPERATURE DIFFERENCE IN A COMPUTER CHIP SYSTEM
20220357219 · 2022-11-10 ·

A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.

Gradient sensor

A gradient sensing probe system, and method of using same, including a sensing segment which includes a plurality of sensors, a support structure, and an electrical interface having first and second faces. The system further includes a housing, a power source, and an electronics package including a controller and disposed within the housing. The sensing segment is configured to measure external gradients and to exchange data with the controller. The power source is connected energetically to provide power to the sensing segment and the electronics package, and is controlled by the controller.

Gradient sensor

A gradient sensing probe system, and method of using same, including a sensing segment which includes a plurality of sensors, a support structure, and an electrical interface having first and second faces. The system further includes a housing, a power source, and an electronics package including a controller and disposed within the housing. The sensing segment is configured to measure external gradients and to exchange data with the controller. The power source is connected energetically to provide power to the sensing segment and the electronics package, and is controlled by the controller.

Measurement Device
20230111956 · 2023-04-13 ·

A measurement device includes: a sensor having a temperature sensor and a heat flux sensor; a first thermal rectification member that is disposed on a side of the sensor opposite from a side of the sensor configured to be in contact with a surface of a skin of a living body which is a measurement surface of a measurement target, and that is composed of a material having a higher thermal conductivity than air; and a structural member that is placed to be in contact with the measurement surface and that is spaced from the sensor and encloses the sensor.

Measurement Device
20230111956 · 2023-04-13 ·

A measurement device includes: a sensor having a temperature sensor and a heat flux sensor; a first thermal rectification member that is disposed on a side of the sensor opposite from a side of the sensor configured to be in contact with a surface of a skin of a living body which is a measurement surface of a measurement target, and that is composed of a material having a higher thermal conductivity than air; and a structural member that is placed to be in contact with the measurement surface and that is spaced from the sensor and encloses the sensor.

METHOD AND SYSTEM FOR MONITORING ENERGY FLOW OF HVAC SYSTEM
20230071155 · 2023-03-09 ·

The invention relates to method (600) for operating an HVAC system, the method comprising: obtaining (602) a plurality of directly measured parameters from one or more data sources; determining (604) one or more indirectly measured parameter based on one or more of the plurality of directly measured parameters; and monitoring (606) energy flow of the HVAC system, based on the plurality of directly measured parameters and the one or more indirectly measured parameters, wherein the energy flow corresponds to heat transfer between the heat transfer medium and the air. The invention further relates to a an apparatus for operating an HVAC system which comprises means of monitoring an energy flow, based on a plurality of directly measured parameters and one or more indirectly measured parameters.

APPARATUS FOR DETECTING CHANGES IN A LOAD APPLIED THERE-TO

A load change detection apparatus is provided with a base member, an elastic member, a first plate, a fixing member and heat flow sensors. The elastic member deforms according to a changed load applied to the elastic member, received by the receiving member. The first plate supports a surface of the elastic member on a side of the base member. The fixing member fixes the lower plate and the elastic member to the base member. The heat flow sensors, provided between the base member and the lower plate, output signals according to heat flowing between the lower plate and the base member. The heat flows due to heat generated or heat absorbed when the elastic member changes the elasticity shape thereof. Stress occurring when the elastic member deforms, is shut off by the first plate, thus direct transmission of the stress to the heat flow sensors is avoided.