G01K2007/163

CONDUCTIVE FILM, METHOD FOR MANUFACTURING CONDUCTIVE FILM, AND TEMPERATURE SENSOR FILM

A conductive film (102) includes: a resin film base (50) having a hard coat layer (6) on one main surface of a resin film (5); an underlying layer (20) on a hard coat layer-formed surface of the resin film base; and a metal thin film (10) on the underlying layer. The underlying layer includes at least one layer of inorganic dielectric thin film. The hard coat layer contains first fine particles having an average primary particle diameter of 10 to 100 nm. In a cross section of the hard coat layer, the proportion of an area occupied by the first fine particles is preferably 10% or more.

ELECTROCONDUCTIVE FILM, METHOD FOR MANUFACTURING SAME, TEMPERATURE SENSOR FILM, AND METHOD FOR MANUFACTURING SAME

An electroconductive film (101) comprises a metal thin-film (10) on a first main surface of a flexible substrate (40) that includes a resin film (5). The thickness of the flexible substrate is 1 mm or less. The absolute value [H.sub.2−H.sub.1] of the difference between the heating dimensional change rate H.sub.1 of the electroconductive film and the heating dimensional change rate H.sub.2 of a film obtained by removing the metal thin-film from the electroconductive film is preferably 0.10% or less. There is a tendency that undulation of a temperature sensor film after patterning of the metal thin-film is further suppressed as the value of [H.sub.2−H.sub.1] decreases.

ELECTROCONDUCTIVE FILM AND TEMPERATURE SENSOR FILM

Provided is an electroconductive film having a metal thin-film on a resin film base; and a temperature sensor film which is obtained by patterning the metal thin-film on the resin film base. An electroconductive film (101) which is used for the production of a temperature sensor film comprises a metal thin-film (10) on one principal surface of a resin film base (50), with a chromium oxide thin-film (21) serving as an underlying layer interposed therebetween. A temperature sensor film is obtained by patterning the metal thin-film so as to form a thermometric resistor part and a lead part that is connected to the thermometric resistor part.

Sensor Element and Method for Producing a Sensor Element

In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

ELECTRONIC COMPONENT, LEAD PART CONNECTION STRUCTURE, AND LEAD PART CONNECTION METHOD
20230093829 · 2023-03-30 · ·

Provided are an electronic component, a lead part connection structure, and a lead part connection method which can reduce damage of a lead part and improve joint strength. In this lead part connection structure, a lead part (3) made of a conductor and a conductive wire (5) made of a plurality of core wires (52) are connected to each other through welding, wherein the lead part (3) and the conductive wire (5) are connected to each other through welding in a condition in which the lead part (3) is fitted into the plurality of core wires (52) of the conductive wire (5). In the conductive wire (5), the core wires (52) are not integrated with each other in advance through welding.

TEMPERATURE SENSOR FILM, CONDUCTIVE FILM AND METHOD FOR PRODUCING SAME

Provided is a temperature sensor film comprising a metal-thin film patterned on a resin film substrate, and having high temperature measurement accuracy. A conductive film (102) that is used for producing a temperature sensor film has a nickel thin film (10) on one principal surface of a resin film substrate (50). It is preferable that the interplanar spacing of nickel (111) plane in the nickel thin-film is less than 0.2040 nm. The temperature sensor film is obtained by patterning the nickel thin film to form a temperature-measuring resistance part and a lead part connected to the temperature-measuring resistance part.

Power connector with integrated power monitoring

An electronic power connector including a contact configured to electrically connect a power supply to a load. The electronic power connector further including a contact core configured to receive the contact, the contact core including a transformer winding wrapped around the contact core, the transformer winding configured to sense a current.

VEHICLE PANE WITH INTEGRATED TEMPERATURE SENSOR
20230073820 · 2023-03-09 ·

A vehicle pane with a temperature sensor, includes a substrate and a transparent, electrically conductive coating on a surface of the substrate, wherein a temperature measuring field that is electrically isolated from the surrounding electrically conductive coating by a separating line is formed in the electrically conductive coating, a measurement current path running between two electrical contact points is formed from a region of the electrically conductive coating in the temperature measuring field, the electrical contact points can be connected to a voltage source such that an electric current flows through the measurement current path, and the electrical contact points can be connected to an analysis unit that is suitable for measuring the current strength of the electric current, determining the electrical resistance of the measurement current path therefrom, and determining the temperature from the electrical resistance using calibration data.

Sensor Arrangement and Method for Producing a Sensor Arrangement
20230104239 · 2023-04-06 ·

In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE
20170359075 · 2017-12-14 · ·

An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.