G01K5/486

MEMS structure and method for detecting a change in a parameter

A MEMS structure including a latch, a first lever, and a second lever. The first lever is designed to move past the latch as a result of flexure in the event of a change in a parameter in a first direction, and to latch in place at the latch if a change in the parameter in a second direction different than the first direction subsequently takes place. The second lever is designed to move past the first lever as a result of flexure in the event of the change in the parameter in the second direction, and to latch in place at the first lever if a change in the parameter in the first direction takes place after the change in the parameter in the second direction.

TIME-TEMPERATURE NANOSENSORS FOR SUBSURFACE APPLICATIONS
20230167735 · 2023-06-01 · ·

A downhole composition includes a carrier fluid and at least one shape-changing nanoparticle. The shape-changing nanoparticle is configured to change shape upon exposure to elevated temperature for a period of time. A method of monitoring temperature in a reservoir is provided. The method includes introducing a temperature monitoring composition into the reservoir, the temperature monitoring composition including a carrier fluid and at least one shape-changing nanoparticle. Then, after a predetermined period, producing a produced fluid from the reservoir, collecting samples of the produced fluid, measuring an optical property of the shape-changing nanoparticle, and based on the measured property of the shape-changing nanoparticle, determining a temperature of at least a portion of the reservoir.

TEMPERATURE INDICATOR

A temperature indicator includes a micro-sensor having a sensing element with a first layer coupled to a second layer where the first and second layers have different coefficients of expansion. The sensing element is configured to move from a first position to a second position in response to exposure to a temperature event and has detection circuitry configured to change from a first state to a second state in response to movement of the sensing element to the second position. The detection circuitry is prevented from returning to the first state in response to changing to the second state. An RFID module is coupled to the detection circuitry and is configured to output a value indicating that the sensing element is in the second position. An activator element is configured to maintain the sensor element in the first position until removal of the activator element from the micro-sensor.

Time-temperature nanosensors for subsurface applications

A downhole composition includes a carrier fluid and at least one shape-changing nanoparticle. The shape-changing nanoparticle is configured to change shape upon exposure to elevated temperature for a period of time. A method of monitoring temperature in a reservoir is provided. The method includes introducing a temperature monitoring composition into the reservoir, the temperature monitoring composition including a carrier fluid and at least one shape-changing nanoparticle. Then, after a predetermined period, producing a produced fluid from the reservoir, collecting samples of the produced fluid, measuring an optical property of the shape-changing nanoparticle, and based on the measured property of the shape-changing nanoparticle, determining a temperature of at least a portion of the reservoir.

CHIP FOR GENE SEQUENCING AND GENE SEQUENCING METHOD

A chip for gene sequencing and a gene sequencing method are disclosed. The chip for gene sequencing includes: a body, including an accommodating chamber and a temperature testing element, wherein the temperature testing element is configured for testing a temperature variation amount in the accommodating chamber.

Sensing devices, sensors, and methods for monitoring environmental conditions
11011323 · 2021-05-18 · ·

Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.

Semiconductor workpiece temperature measurement system

An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.

MEMS STRUCTURE AND METHOD FOR DETECTING A CHANGE IN A PARAMETER
20190346314 · 2019-11-14 ·

A MEMS structure including a latch, a first lever, and a second lever. The first lever is designed to move past the latch as a result of flexure in the event of a change in a parameter in a first direction, and to latch in place at the latch if a change in the parameter in a second direction different than the first direction subsequently takes place. The second lever is designed to move past the first lever as a result of flexure in the event of the change in the parameter in the second direction, and to latch in place at the first lever if a change in the parameter in the first direction takes place after the change in the parameter in the second direction.

Semiconductor Workpiece Temperature Measurement System
20190170591 · 2019-06-06 ·

An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.

SENSING DEVICES, SENSORS, AND METHODS FOR MONITORING ENVIRONMENTAL CONDITIONS
20190172657 · 2019-06-06 ·

Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.