A separating membrane includes: a planar edge region for the joining of the separating membrane to a diaphragm seal body; a working region offset in an axial direction relative to the edge region; and a transition region between the edge region and the working region, wherein the transition region extends over a radial region of not more than one quarter of an outer radius of the transition region, wherein the working region has a substantially planar center and an embossed pattern or undulation pattern between the center and an outer edge of the working region, wherein from the rest position to a point of deflection with a dimensionless pressure equivalent, the separating membrane has a characteristic curve in which, for a coefficient of determination R2 of a linear regression of the characteristic curve, the following applies: (1−R2)<1%.

The present invention relates to microfluidic or millifluidic chips (1) comprising at least one pressure sensing unit (4) able to measure a fluid flow pressure. The present invention also relates to a method for a direct and contact-free measuring of a local pressure of a fluid circulating in a microfluidic circuit, using a microfluidic or millifluidic chips (1) according to the invention.

A sensor device includes a housing frame defining a first opening and a second opening; a sensing element having first and second sides is disposed within the housing frame and defines therein a first cavity at its first site and a second cavity at its second site, wherein the sensing element determines a differential pressure between the first and second sides; a first corrugated diaphragm configured to close the first opening to seal the first cavity, and a second corrugated diaphragm configured to close the second opening to seal the second cavity; and an inert hydraulic fluid disposed within the first and second cavities that fluidly couples an external pressure acting on the respective corrugated diaphragm to the respective side of the sensing element, wherein the first corrugated diaphragm and the second corrugated diaphragm is built by a conformal coating process using a substrate with structured surface.

A pressure measurement pod for use in blood circuits includes a pressure sensing pod defining a chamber and having a rigid wall portion and an integral flexible wall portion forming a flexible, moveable, fluid-impermeable diaphragm with a first major side thereof facing an interior of the chamber and a second major side opposite the first major side. The second major side faces outwardly away from the chamber, and the pod has ports on sides of the chamber. The internal surfaces of the chamber and ports are shaped such that any contour following the internal surfaces to the outside of one of the ports traces only surfaces characterized by positive or neutral draft angles such that invasive mold portions may be withdrawn through the ports thereby permitting the pressure measurement pod to be molded in a single shot molding process.

A material property sensor for a pressure transmitter comprises a sensing pattern immersed in a fill fluid. The pressure transmitter comprises a diaphragm configured for contact with a process fluid at an exterior surface of the diaphragm. The pressure transmitter further comprises a pressure sensor configured for sensing a pressure of the process fluid on the diaphragm. The pressure sensor and the diaphragm define a cavity within which the fill fluid is disposed such that the diaphragm of the pressure sensor is in contact with the fill fluid at an interior surface of the diaphragm. The sensing pattern is immersed in the fill fluid within the cavity and configured to measure an electrical property of the fill fluid at an initial time and at one or more subsequent times during operation of the pressure transmitter.

A method of monitoring microelectromechanical system (MEMS) pressure sensors arranged on a carrier includes: generating a first measurement value by a first MEMS pressure sensor arranged on the carrier; generating a second measurement value by a second MEMS pressure sensor arranged on the carrier; and determining, by an integrated circuit, whether the first measurement value of the first MEMS pressure sensor corresponds to the second measurement value of the second MEMS pressure sensor in accordance with a predefined criterion, wherein the integrated circuit is arranged on the carrier and is coupled to the first MEMS pressure sensor and the second MEMS pressure sensor.

A load sensing system for sensing a load on a structure can include an optical load sensing element configured to change an optical state based on a force applied thereto, an optical source operatively connected to the optical load sensing element and configured to input an input optical signal to the optical load element, and an optical detector configured to receive a returned optical signal from the optical load sensing element. The optical detector can be configured to detect one or more frequency peaks of the returned optical signal and to use the one or more frequency peaks of the returned optical signal to correlate to a load value of the load and output the load value indicative of the load.

The disclosure relates to a device for converting a pressure into an electric signal. The device has a first deformation body in the form of a first membrane, via which the pressure can be introduced into the device, and a second deformation body in the form of a second membrane, by means of the deflection of which the applied pressure can be converted into an electric signal. The device has a force transmitting means for transmitting pressure and/or tensile forces from the first deformation body to the second deformation body. Either the force transmitting means is designed as a separate part and the two membranes have a bore into which the force transmitting means is at least partly introduced and in which the force transmitting means is connected to the respective membrane, or the force transmitting means is integrally formed with one of the two membranes and the corresponding other membrane has a bore into which the force transmitting means is at least partly introduced and in which the force transmitting means is connected to said membrane.

A material property sensor for a pressure transmitter comprises a sensing pattern immersed in a fill fluid. The pressure transmitter comprises a diaphragm configured for contact with a process fluid at an exterior surface of the diaphragm. The pressure transmitter further comprises a pressure sensor configured for sensing a pressure of the process fluid on the diaphragm. The pressure sensor and the diaphragm define a cavity within which the fill fluid is disposed such that the diaphragm of the pressure sensor is in contact with the fill fluid at an interior surface of the diaphragm. The sensing pattern is immersed in the fill fluid within the cavity and configured to measure an electrical property of the fill fluid at an initial time and at one or more subsequent times during operation of the pressure transmitter.

Provided is an air sensor, coupled to an air inlet of an air-filled product that is filled with air to maintain a shape thereof, the air sensor including: a connector coupled to the air inlet and communicated with an interior of the air-filled product, thereby allowing air in the air-filled product to be introduced into an interior of the connector; a silicon sensor provided inside the connector, thereby being operated by air pressure of the air-filled product; an impact sensor configured to detect an impact caused by an operation of the silicon sensor; and a PCB connected to the impact sensor, thereby displaying the number of times according to a detection signal of the impact sensor.