A method for manufacturing a pressure detecting unit for a measuring device for measuring a pressure status value of a plant specimen. The method includes mounting a sensor unit for detecting the pressure status value at a carrier substrate, fastening a frame to the carrier substrate, the frame including a fastening surface, a contact surface oriented opposite the fastening surface and an inner surface defining an opening and extending between the fastening surface and the contact surface, the frame being situated at the carrier substrate in such a way that the fastening surface faces the carrier substrate and the inner surface surrounds the sensor unit, and filling the opening of the frame with a filling material for forming an elastic pressure coupling layer. A pressure detecting unit for a measuring device for measuring a pressure status value of a plant specimen is also described.

A method for producing a differential pressure sensor includes: a) Providing a sensor assembly; b) Providing a main body with a substantially rotationally symmetrical cavity for receiving the sensor assembly; c) Introducing the sensor assembly into the cavity of the main body; d) Welding the sensor assembly into the cavity of the main body by means of a resistance pulse welding method; e) Introducing, for example, by pressing in, a welding ring between the sensor assembly and the cavity of the main body in an opening region of the cavity; and f) Axial laser welding in the opening region of the cavity such that the main body is welded circumferentially to the sensor assembly by means of the welding ring.

In some embodiments, a sensor is provided. The sensor includes a microelectromechanical systems (MEMS) substrate disposed over an integrated chip (IC), where the IC defines a lower portion of a first cavity and a lower portion of a second cavity, and where the first cavity has a first operating pressure different than an operating pressure of the second cavity. A cap substrate is disposed over the MEMS substrate, where a first pair of sidewalls of the cap substrate partially define an upper portion of the first cavity, and a second pair of sidewalls of the cap substrate partially define an upper portion of the second cavity. A sensor area comprising a movable portion of the MEMS substrate and a dummy area comprising a fixed portion of the MEMS substrate are both disposed in the first cavity. A pressure enhancement structure is disposed in the dummy area.

A pressure sensor includes a housing with an opening, a pressure sensitive body inside the housing, a waterproof gel to seal the pressure sensitive body inside the housing, and cover portions on a surface of the gel. The cover portions are non-adhesive and do not couple to each other.

A pressure sensor having an anti-adhesion layer, and a method for manufacturing such a pressure sensor. In this context, the pressure sensor includes a pressure sensor element, which is accommodated and/or situated in a housing of the pressure sensor. In order to protect the pressure sensor element, at least one filling material is provided, which is introduced into the housing and covers the pressure sensor element at least partially. The surface of the at least one filling material is configured to have an antistatic effect.

Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is exposed; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a protection layer including a plurality of beads embedded within a top region of the polymeric gel.

A method of monitoring microelectromechanical system (MEMS) pressure sensors arranged on a carrier includes: generating a first measurement value by a first MEMS pressure sensor arranged on the carrier; generating a second measurement value by a second MEMS pressure sensor arranged on the carrier; and determining, by an integrated circuit, whether the first measurement value of the first MEMS pressure sensor corresponds to the second measurement value of the second MEMS pressure sensor in accordance with a predefined criterion, wherein the integrated circuit is arranged on the carrier and is coupled to the first MEMS pressure sensor and the second MEMS pressure sensor.

Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

A self-sustaining sensor is provided, being configured to detect a fill level, a limit level, or a pressure of a medium or to measure an interface of a mixture of media in a transport container, the sensor including: a closed housing configured to be submerged in the medium; and a sensor element arrangement including one or more sensor elements arranged in or on the housing, in which the sensor is configured to rest on a bottom of the container and/or to float on a separating layer of the mixture of media during measurement, without being fixed to the container. A self-sustaining fill level measurement system, limit level measurement system, or pressure measurement system is also provided. A method for detecting a fill level or a limit level or a pressure of a medium or for interface measurement of a mixture of media in a transport container is also provided.