The disclosure relates to a device for converting a pressure into an electric signal. The device has a first deformation body in the form of a first membrane, via which the pressure can be introduced into the device, and a second deformation body in the form of a second membrane, by means of the deflection of which the applied pressure can be converted into an electric signal. The device has a force transmitting means for transmitting pressure and/or tensile forces from the first deformation body to the second deformation body. Either the force transmitting means is designed as a separate part and the two membranes have a bore into which the force transmitting means is at least partly introduced and in which the force transmitting means is connected to the respective membrane, or the force transmitting means is integrally formed with one of the two membranes and the corresponding other membrane has a bore into which the force transmitting means is at least partly introduced and in which the force transmitting means is connected to said membrane.

The invention relates to a housing comprising a venting device (10) which is arranged on the housing (2) and which allows an ambient pressure to be supplied to the interior of the housing (2). The venting device (10) is made of a sleeve-like protective cap (11) with lateral openings (12) and a liquid-repellant membrane, and a cavity for receiving the membrane is formed in the interior of the venting device (10). The membrane is arranged such that an opening, which is provided for the pressure supply, in the wall of the housing (2) is covered. In order to prevent the so-called teapot effect and therefore allow a light dripping of a liquid on the venting device (10), the sleeve-like protective cap (11) has a narrow circumferential expansion (14) in the region of the lateral surface of the protective cap such that a defined dripping edge is formed.

Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The ceiling portion, the body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is configured to be in contact with the ceiling portion. The membrane is formed from a filtering fabric and is configured to substantially block one or more of liquids and contaminants from passing into the cavity.

A material property sensor for a pressure transmitter comprises a sensing pattern immersed in a fill fluid. The pressure transmitter comprises a diaphragm configured for contact with a process fluid at an exterior surface of the diaphragm. The pressure transmitter further comprises a pressure sensor configured for sensing a pressure of the process fluid on the diaphragm. The pressure sensor and the diaphragm define a cavity within which the fill fluid is disposed such that the diaphragm of the pressure sensor is in contact with the fill fluid at an interior surface of the diaphragm. The sensing pattern is immersed in the fill fluid within the cavity and configured to measure an electrical property of the fill fluid at an initial time and at one or more subsequent times during operation of the pressure transmitter.

A device for connecting one or more sensors to a pipe, may include a sealed capsule and a pipe connector. The sealed capsule may include the one or more sensors and a non-corrosive liquid. The pipe connector may be configured to fix the sealed capsule to the pipe. The one or more sensors may be configured to measure pressure or pressure transient from a first liquid via the non-corrosive liquid.

In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

An air sensor system including a pressure or airflow sensor, a filter housing that defines an air flow path to the air pressure sensor, and a filter in the air flow path. The filter includes a micro filter and a hydrophobic membrane. The hydrophobic membrane is downstream of the micro filter in the air flow path to the pressure or airflow sensor.

A transducer for determining a pressure of a hydrogen-containing fluid medium confined in a first space includes a pressure side end configured to be disposed facing the fluid medium. The transducer includes a housing, which defines a second space, and a measuring arrangement disposed in the second space. The pressure side end includes a diaphragm configured and disposed for hermetically separating the first space from the second space. The diaphragm includes a metallic material that is made of a high-alloy martensite.

A process fluid pressure measurement probe includes a pressure sensor formed of a single-crystal material and mounted to a first metallic process fluid barrier and disposed for direct contact with a process fluid. The pressure sensor has an electrical characteristic that varies with process fluid pressure. A feedthrough is formed of a single-crystal material and has a plurality of conductors extending from a first end to a second end. The feedthrough is mounted to a second metallic process fluid barrier and is spaced from, but electrically coupled to, the pressure sensor. The pressure sensor and the feedthrough are mounted such that the secondary metallic process fluid barrier is isolated from process fluid by the first metallic process fluid barrier.

A field device used in process and/or automation engineering for monitoring at least one chemical or physical process variable of a medium in a component carrying a medium at least partially and temporarily and comprising at least an electronic unit and a sensor unit. At least one portion of at least one component of the sensor unit is in contact with the medium at least temporarily. The at least one portion of the component in contact with the medium is provided with a chemically resistant multilayered coating consisting of at least two layers, wherein a first layer is made of a material consisting of a densely packed atomic arrangement which provides a protection against corrosion by said medium, and a second layer consisting of a chemically resistant plastic material is arranged around the first layer and protects the first layer against outer damage and corrosion.