An assembly for measuring the air flow in an air intake duct of an internal combustion engine. The assembly includes a housing with an inlet opening, an outlet opening, a channel with an inner wall defining a predetermined cross-sectional area and a closure member that is movably mounted in the channel between a closed and opened position. A first annular chamber is situated upstream from the closure member and a second annular chamber is placed downstream of the closure member. Each chamber has an inner chamber wall with a number of apertures that are in fluid communication with the channel. A first pressure sensor is connected to the first chamber for measuring a pressure in the first chamber, a second pressure sensor being connected to the first chamber and to the second chamber for measuring a difference in pressure in the first and second chamber.

An assembly for measuring the air flow in an air intake duct of an internal combustion engine. The assembly includes a housing with an inlet opening, an outlet opening, a channel with an inner wall defining a predetermined cross-sectional area and a closure member that is movably mounted in the channel between a closed and opened position. A first annular chamber is situated upstream from the closure member and a second annular chamber is placed downstream of the closure member. Each chamber has an inner chamber wall with a number of apertures that are in fluid communication with the channel. A first pressure sensor is connected to the first chamber for measuring a pressure in the first chamber, a second pressure sensor being connected to the first chamber and to the second chamber for measuring a difference in pressure in the first and second chamber.

In an embodiment a membrane includes a hydrophobic region having a plurality of hierarchically arranged micrometer-sized and submicrometer-sized units consisting of a membrane material, wherein a single micrometer-sized unit has a diameter of from 1 μm to 5 μm and a single submicrometer-sized unit has a diameter of <1 μm, and wherein the membrane is configured to be used in a pressure sensor system.

In an embodiment a membrane includes a hydrophobic region having a plurality of hierarchically arranged micrometer-sized and submicrometer-sized units consisting of a membrane material, wherein a single micrometer-sized unit has a diameter of from 1 μm to 5 μm and a single submicrometer-sized unit has a diameter of <1 μm, and wherein the membrane is configured to be used in a pressure sensor system.

A pressure sensor for measuring a pressure of a fluid medium in a measuring chamber is provided. The pressure sensor includes a sensor housing, a first pressure-sensor module for measuring at least one first pressure of the medium in a first measuring chamber, and a second pressure-sensor module for measuring at least one second pressure of the medium in a second measuring chamber. The first pressure-sensor module and the second pressure-sensor module are situated inside the sensor housing. In addition, the pressure sensor has at least one first pressure connection, which is designed for the connection to the first measuring chamber. Moreover, the pressure sensor has at least one second pressure connection, which is developed for the connection to the second measuring chamber. The first pressure connection differs from the second pressure connection.

A pressure sensor for measuring a pressure of a fluid medium in a measuring chamber is provided. The pressure sensor includes a sensor housing, a first pressure-sensor module for measuring at least one first pressure of the medium in a first measuring chamber, and a second pressure-sensor module for measuring at least one second pressure of the medium in a second measuring chamber. The first pressure-sensor module and the second pressure-sensor module are situated inside the sensor housing. In addition, the pressure sensor has at least one first pressure connection, which is designed for the connection to the first measuring chamber. Moreover, the pressure sensor has at least one second pressure connection, which is developed for the connection to the second measuring chamber. The first pressure connection differs from the second pressure connection.

A pressure transducer assembly that uses static pressure compensation to capture low-level dynamic pressures in high temperature environments. In one embodiment, a method comprises receiving, at a first tube, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; receiving, at a micro-filter, the pressure; filtering, by the micro-filter, at least a portion of the dynamic pressure component of the pressure; outputting, from the micro-filter, a filtered pressure; receiving, at a first surface of a first sensing element, the pressure; receiving, at a second surface of the first sensing element, the filtered pressure; measuring, by the first sensing element, a difference between the pressure and the filtered pressure, wherein the difference is associated with the dynamic pressure component of the pressure; and outputting, from the first sensing element, a first pressure signal associated with the dynamic pressure component of the pressure.

A pressure transducer assembly that uses static pressure compensation to capture low-level dynamic pressures in high temperature environments. In one embodiment, a method comprises receiving, at a first tube, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; receiving, at a micro-filter, the pressure; filtering, by the micro-filter, at least a portion of the dynamic pressure component of the pressure; outputting, from the micro-filter, a filtered pressure; receiving, at a first surface of a first sensing element, the pressure; receiving, at a second surface of the first sensing element, the filtered pressure; measuring, by the first sensing element, a difference between the pressure and the filtered pressure, wherein the difference is associated with the dynamic pressure component of the pressure; and outputting, from the first sensing element, a first pressure signal associated with the dynamic pressure component of the pressure.

The present invention relates to a differential pressure sensor. The differential pressure sensor includes: a housing including a body and a cover, the housing having a first chamber and a second chamber defined in the housing and separated from each other; a first pressure channel communicating with the first chamber; a second pressure channel communicating with the second chamber; a substrate on which an electronic component is mounted and in which a terminal is formed, the substrate including a first surface facing the first chamber and a second surface extending parallel to the first surface and facing the second chamber, the substrate configured to cover the second chamber; a sensor element installed on the first surface of the substrate so as to generate an electric signal corresponding to a pressure difference between the first chamber and the second chamber; a lead frame installed in the housing with one end thereof extending into the first chamber, the lead frame configured to transmit the electric signal of the sensor element to an external device; a conductive wire configured to connect the terminal of the substrate and the lead frame so as to transmit the electric signal of the sensor element to the lead frame; a first sealing member disposed in a region where the body and the cover make contact with each other, the first sealing member configured to seal the first chamber with respect to the outside; and a second sealing member disposed in a region where the substrate and the body make contact with each other, the second sealing member configured to seal the second chamber with respect to the first chamber.

A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.