G01L5/171

SYSTEM FOR MEASURING AND MANUFACTURING COMPRESSION GARMENTS
20170266052 · 2017-09-21 ·

A system for accurately measuring compression garments in laboratory and manufacturing environments provides measurements for industry-standard sizes and individually customized garments and can use the measurements to modify the programming of a manufacturing system to alter the compression parameters of subsequently manufactured garments. The system includes a support structure and a plurality of sensor units at intervals along the support structure with each sensor unit extended circumferentially around the support structure to define a three-dimensional simulated anatomical form circumferentially stretching the compression garment upon insertion of the assembly. Each sensor unit has a pressure sensor measuring the pressure exerted by the compression garment on the sensor unit after insertion.

SENSOR BODY HAVING A MEASURING ELEMENT AND METHOD FOR MANUFACTURING FOR A SENSOR BODY

A sensor body for receiving a pressurized fluid or for absorbing a force, having a membrane and at least one strain sensitive measuring element disposed on the membrane, comprising, a semiconductor substrate and at least one piezo resistive resistance track, wherein the resistance track is formed in the semiconductor substrate by means of doping. According to the invention, the measuring element is connected to the membrane by means of a lead-free glass solder and the measuring element is arranged, at least in sections, sunk into the glass solder. A measuring element, a pressure sensor, a force measuring device, a method for manufacturing a sensor body and the use of a measuring element is also provided.

SENSOR BODY HAVING A MEASURING ELEMENT AND METHOD FOR MANUFACTURING FOR A SENSOR BODY

A sensor body for receiving a pressurized fluid or for absorbing a force, having a membrane and at least one strain sensitive measuring element disposed on the membrane, comprising, a semiconductor substrate and at least one piezo resistive resistance track, wherein the resistance track is formed in the semiconductor substrate by means of doping. According to the invention, the measuring element is connected to the membrane by means of a lead-free glass solder and the measuring element is arranged, at least in sections, sunk into the glass solder. A measuring element, a pressure sensor, a force measuring device, a method for manufacturing a sensor body and the use of a measuring element is also provided.

Package identification through force sensing
11441958 · 2022-09-13 · ·

Systems, methods, techniques and apparatuses of package identification are disclosed. One exemplary embodiment is a method for package identification comprising performing a set of initial inspection operations on a package; determining a portion of a plurality of possible packages based on the set of initial inspection operations and a data structure including initial inspection characteristics for the plurality of possible packages; performing a set of package movement inspection operations by moving the package using a robot; determining a set of movement characteristics based on the package movement inspection operations; and identifying which one of the portion of the plurality of possible packages corresponds to the package using the set of movement characteristics.

Package identification through force sensing
11441958 · 2022-09-13 · ·

Systems, methods, techniques and apparatuses of package identification are disclosed. One exemplary embodiment is a method for package identification comprising performing a set of initial inspection operations on a package; determining a portion of a plurality of possible packages based on the set of initial inspection operations and a data structure including initial inspection characteristics for the plurality of possible packages; performing a set of package movement inspection operations by moving the package using a robot; determining a set of movement characteristics based on the package movement inspection operations; and identifying which one of the portion of the plurality of possible packages corresponds to the package using the set of movement characteristics.

TACTILE SENSOR, AND TACTILE STIMULATION SENSING METHOD USING THE SAME, AND ROBOT SKIN AND ROBOT COMPRISING THE SAME
20220297309 · 2022-09-22 ·

The present invention relates to a tactile sensor, a tactile stimulation sensing method using the same, and a robot skin and a robot comprising the same. Particularly, the present invention relates to a tactile sensor comprising an input layer for receiving an external tactile stimulus; a microphone member; and a medium layer disposed between the input layer and the microphone member, and including gas therein to transmit vibrations by the stimulus, a tactile stimulation sensing method using the same, and a robot skin and a robot comprising the same.

TACTILE SENSOR, AND TACTILE STIMULATION SENSING METHOD USING THE SAME, AND ROBOT SKIN AND ROBOT COMPRISING THE SAME
20220297309 · 2022-09-22 ·

The present invention relates to a tactile sensor, a tactile stimulation sensing method using the same, and a robot skin and a robot comprising the same. Particularly, the present invention relates to a tactile sensor comprising an input layer for receiving an external tactile stimulus; a microphone member; and a medium layer disposed between the input layer and the microphone member, and including gas therein to transmit vibrations by the stimulus, a tactile stimulation sensing method using the same, and a robot skin and a robot comprising the same.

SENSOR BODY HAVING A MEASURING ELEMENT AND METHOD FOR MANUFACTURING FOR A SENSOR BODY

A sensor body for receiving a pressurized fluid or for absorbing a force, having a membrane and at least one strain sensitive measuring element disposed on the membrane, comprising, a semiconductor substrate and at least one piezo resistive resistance track, wherein the resistance track is formed in the semiconductor substrate by means of doping. According to the invention, the measuring element is connected to the membrane by means of a lead-free glass solder and the measuring element is arranged, at least in sections, sunk into the glass solder. A measuring element, a pressure sensor, a force measuring device, a method for manufacturing a sensor body and the use of a measuring element is also provided.

SENSOR BODY HAVING A MEASURING ELEMENT AND METHOD FOR MANUFACTURING FOR A SENSOR BODY

A sensor body for receiving a pressurized fluid or for absorbing a force, having a membrane and at least one strain sensitive measuring element disposed on the membrane, comprising, a semiconductor substrate and at least one piezo resistive resistance track, wherein the resistance track is formed in the semiconductor substrate by means of doping. According to the invention, the measuring element is connected to the membrane by means of a lead-free glass solder and the measuring element is arranged, at least in sections, sunk into the glass solder. A measuring element, a pressure sensor, a force measuring device, a method for manufacturing a sensor body and the use of a measuring element is also provided.

Wheel torque sensor for highly automated driving vehicles

A method and apparatus for sensing wheel torque of a highly automated driving (HAD) vehicle includes a wheel hub configured to rotate around a rotation axis as the vehicle moves and a brake caliper, including a brake pad, configured to apply a caliper force to the wheel hub. A reaction carriage is interconnected with the brake caliper and is configured to have a reaction force applied to it when the brake caliper applies the caliper force to the wheel hub. The wheel torque sensor includes a hydraulic chamber having a hydraulic fluid and a pressure sensor, interconnected with the hydraulic chamber, that senses pressure applied to the hydraulic fluid in response to the reaction force.