G01L9/0092

Soft pressure sensor using multi-material 3D-printed microchannel molds and method for making the sensor

The present invention relates to a flexible pressure sensor using a multi-material 3D-printed microchannel mold, and a method for manufacturing the same. An object of the present invention is to provide a flexible pressure sensor using a multi-material 3D-printed microchannel mold, the flexible pressure sensor being formed by using a conductive liquid and an elastomer, having a microchannel formed therein, and having improved flexibility, sensitivity, and stability in comparison to the related art. Another object of the present invention is to provide a method for manufacturing a flexible pressure sensor using a multi-material 3D-printed microchannel mold, in which the flexible pressure sensor is manufactured by using the microchannel mold including microbumps, the microchannel mold being multi-material 3D-printed by using a sacrificial material and a hard material.

DETERMINING PRESSURE IN SUBTERRANEAN FORMATIONS
20220381136 · 2022-12-01 ·

A method for determining a pressure profile in a subterranean formation is described. The method includes drilling a wellbore in the subterranean formation; lowering a logging tool into the wellbore to measure resistivity values as a function of depth along the wellbore; identifying a plurality of porous zones from the wellbore based on petrophysical logs; converting the measured resistivity values to an amount of total dissolved solids for each of the plurality of identified porous zones; converting the amount of total dissolved solids to a pore fluid density; calculating a pressure based on a sum of the pore fluid densities derived along a length of the well; and generating a depth-based pressure profile.

Pressure sensor

The invention concerns a pressure sensor including means of sensing pressure and converting pressure into an electrical signal able to be transmitted by an electrical circuit to an control interface circuit of an indicator device, wherein said sensing and conversion means include: a closed volume and a liquid contained in the closed volume, said liquid being electrically conductive and capable of moving inside said closed volume, at least one sensing member arranged inside the closed volume in a given position in said volume, said sensing member including at least one pair of electrodes and cooperating with the liquid when said liquid moves in the closed volume, so that said electrical circuit is closed when the liquid passes said sensing member. The pressure sensor is intended to be integrated in a pressure measuring device, particularly a timepiece.

Microfluidic pressure sensor

A microfluidic pressure sensor may include a reference chamber, a sensed volume, a microfluidic channel connecting an interior of the reference chamber to an interior of the sensed volume, a volume of liquid contained and movable within the microfluidic channel while occluding the microfluidic channel and a sensor to output signals indicating positioning of the volume of liquid along the microfluidic channel. Positioning of the volume of liquid along microfluidic channel indicates a pressure of the sensed volume.

Wearable Acoustic Device with Through-Enclosure Pressure and Barometric Sensing

An interface pressure sensor includes a fluid pressure sensor disposed in a volume defined by a shear wall. The volume is enclosed, and the fluid pressure sensor is encapsulated by, an infill material. The infill material defines a sensing surface that, when pressed, can impart a force that is detectable by the fluid pressure sensor.

SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS
20220074803 · 2022-03-10 ·

In some implementations a semiconductor die comprises a semiconductor chip. The semiconductor chip comprises a piezoresistive pressure sensor element and at least one capacitive acceleration sensor element. The piezoresistive pressure sensor element is arranged to the side of the capacitive acceleration sensor element. In some implementations, a method for producing a semiconductor die includes applying an insulation layer to the semiconductor wafer. A section of the monocrystalline cover layer may be exposed by structuring the insulation layer. A semiconductor layer having a monocrystalline section and a polycrystalline section may be generated by deposition of a semiconductor material.

Sensor recording temperature and pressure
11081284 · 2021-08-03 · ·

Various embodiments include a capacitive pressure transducer for measuring the pressure of a medium adjacent to the transducer comprising: a measurement diaphragm including a first surface in contact with the medium and a second surface facing away from the medium; a measurement electrode integrated with the measurement diaphragm; a base body arranged opposite the second surface, the base body comprising a counter electrode forming a measurement capacitance with the measurement electrode; and an electrically insulating chamber bounded by the base body and the measurement diaphragm. The counter electrode is in contact with the electrically insulating chamber. At least one of the measurement electrode or the counter electrode comprises a meandering pattern layer in direct contact with the electrically insulating chamber.

MICROFLUIDIC PRESSURE SENSOR

A microfluidic pressure sensor may include a reference chamber, a sensed volume, a microfluidic channel connecting an interior of the reference chamber to an interior of the sensed volume, a volume of liquid contained and movable within the microfluidic channel while occluding the microfluidic channel and a sensor to output signals indicating positioning of the volume of liquid along the microfluidic channel. Positioning of the volume of liquid along microfluidic channel indicates a pressure of the sensed volume.

SOFT PRESSURE SENSOR USING MULTI-MATERIAL 3D-PRINTED MICROCHANNEL MOLDS AND METHOD FOR MAKING THE SENSOR
20210055179 · 2021-02-25 ·

The present invention relates to a flexible pressure sensor using a multi-material 3D-printed microchannel mold, and a method for manufacturing the same. An object of the present invention is to provide a flexible pressure sensor using a multi-material 3D-printed microchannel mold, the flexible pressure sensor being formed by using a conductive liquid and an elastomer, having a microchannel formed therein, and having improved flexibility, sensitivity, and stability in comparison to the related art. Another object of the present invention is to provide a method for manufacturing a flexible pressure sensor using a multi-material 3D-printed microchannel mold, in which the flexible pressure sensor is manufactured by using the microchannel mold including microbumps, the microchannel mold being multi-material 3D-printed by using a sacrificial material and a hard material.

Pressure sensor

A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.