A light source unit generates an optical signal out of a bend-insensitive (“BI”) optical fiber that is compliant with a desired encircled flux (“EF”). The unit includes a light source to generate an optical light signal and a conventional multimode optical fiber coupled to receive the optical light signal from the light source at a first end. A modal conditioner is arranged to condition the optical light signal propagating along different modes of the conventional multimode fiber. A first bend-insensitive (BI) multimode optical fiber has an input end, the input end of the first BI multimode optical fiber being coupled at a second end of the conventional multimode optical fiber to receive the conditioned optical light signal from the conventional multimode fiber. The output from the first BI multimode optical fiber outputs an optical signal having the desired EF.

A fiber optic test device is provided that includes a light source pigtailed with a first end of a non-bend insensitive multimode fiber (non-BIMMF). A second end of the non-BIMMF is fusion spliced to a first end of a reference grade bend insensitive multimode fiber (BIMMF). A reference grade optical fiber connector is attached to a second end of the BIMMF, which is coupled to a first end of a reference grade bulkhead adapter. The non-BIMMF is deformed so that a specific launch condition, such as encircled flux, is achieved at the first end of the BIMMF. A test reference cord, which contains a reference grade BIMMF having similar geometric properties as the BIMMF that is fusion spliced to the non-BIMMF, is attached to a second end of the bulkhead adapter. Modal transparency is achieved and the launch condition is maintained at the output of the test reference cord.

A photonic integrated circuit device includes a semiconductor substrate (e.g., wafer) having a chip region therein, which is bounded on at least one side thereof by a scribe line. The chip region includes an optical transmitter, an optical receiver and a test optical waveguide. This test optical waveguide is coupled to the optical transmitter and the optical receiver and overlaps the scribe line. During a substrate dicing operation, a portion of the test optical waveguide overlapping the scribe line is removed.

An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.

A bending applying device includes three mandrels and applies bending to an optical fiber by winding the optical fiber onto the mandrels. The mandrels are alternately arranged at predetermined intervals such that outer circumferences of adjacent mandrels in a longitudinal direction of the optical fiber face each other in a non-contact manner. A diameter of the optical fiber is D, a radius of the mandrel is r, an interval between the adjacent mandrels in the first direction is 2r + d, a direction orthogonal to the first direction is a second direction, an interval between the adjacent mandrels in the second direction is s, and an angle θ between the second direction and a common internal tangent of the adjacent mandrels is 0 degrees or more and 45 degrees or less, and the formed angle θ satisfies following formula.

[00001]$\sqrt{\left(d+D+4r\right)\left(d-D\right)+s^2}=2\left(r+\frac{D}{2}\right)\tan \theta +\frac{s}{\cos \theta }$

An integrated circuit comprises: at least one photonic layer that includes one or more optical waveguides; a first optical coupler that couples at least a first optical mode outside of the photonic layer to a first waveguide in the photonic layer; a photonic device that includes one or more ports in the photonic layer; a first multi-port optical coupler that includes three or more ports in the photonic layer, including a first port optically coupled to the first optical coupler, a second port optically coupled to a first port of the photonic device, and a third port optically coupled to a first optical reflector configured to send substantially all optical power emitted from the third port of the first multi-port optical coupler back to the third port of the first multi-port optical coupler.

There is provided herein a solution for measuring the optical power loss of duplex optical-fiber devices under test, and particularly those terminated with a duplex connector interface, which allows for a one-cord or one-cord equivalent testing method whichever the format of the duplex connector interface of the optical-fiber device under test, and this without disconnecting the optical fibers of the device under test from their duplex native connector interface. There is provided an optical-fiber expansion device to be used to interconnect and adapt a power meter instrument to a variety of duplex connectors. The proposed optical-fiber expansion device comprises a pair of optical fibers having a core diameter and a numerical aperture that are greater than those of the optical fiber in the DUT connector interface, so as to make it compatible with the one-cord testing method. Interchangeable optical-fiber expansion devices can be used to match the power meter interface on one side, to various duplex connector interfaces under test on the other side.

A multi-beam system includes a light source configured to emit light; a fiber bundle connected to the light source; and a camera configured to capture an image set including images corresponding to each fiber connected to the light source. The fiber bundle includes a central fiber having one end connected to the light source, and N layers of fibers surrounding the central fiber. The first layer of fibers includes M fibers, each having one end connected to the light source, and the Nth layer of fibers includes more than M fibers, but only M fibers in the Nth layer of fibers have one end connected the light source. A processor is configured to determine a centroid of each image in the image set to produce a centroid map and generate a fiber location map comprising fiber locations of all fibers in the fiber bundle based on the centroid map.

A method, system, and computer program product for determining a core-to-ferrule offset of a ferrule for a fiber optic connector. A reference ferrule is physically aligned with a core imager by positioning the reference ferrule so that edges of the reference ferrule in a plurality of profile images are aligned with fiducial markers in the images. The reference ferrule is incrementally rotated about its longitudinal center access, a core image captured at each rotational angle, and a reference core-to-ferrule offset determined based on the core images. A test ferrule is physically aligned with the core imager by positioning the test ferrule so that edges of the test ferule are aligned with the edges of the reference ferrule in a plurality of profile images. The core-to-ferrule offset of the test ferrule is then determined based on an offset between the test and reference cores in a composite core image.

A method and system for measuring signal loss in a fiber optic cable. The tail ends of reference and test fiber optic cables are illuminated with a diffuse light. The head end of each of the reference and test fiber optic cables are positioned in a measurement area. A core imager captures an image of the core of each head-end while it is in the measurement area. Reference and test radiant fluxes emitted from the reference and test head-ends are determined from the respective core images. The relative signal loss of the test fiber optic cable is then determined by comparing the test radiant flux to the reference radiant flux.