A system for inspecting thin glass includes: a housing including a body and a cover; a first shuttle which fixes an edge portion of the thin glass and reciprocates in a first axis direction; a first inspection part disposed on the body and which measures a position of a defect formed in the thin glass by taking a picture of the thin glass; a transport shuttle which separates the thin glass from the first shuttle, a second shuttle which separates the thin glass from the transport shuttle, fixes the thin glass, and reciprocates the upper surface of the body; and a second inspection part disposed on the body and spaced apart from the first inspection part and which inspects the position of the defect by taking an enlarged picture of the position of the defect. The first shuttle tensions and fixes the thin glass.

A method and an LWIR imaging system for detecting an amorphous and/or crystalline structure of phosphate and/or sulphate salts on the surface of a substrate or within a substrate are described. The method comprises the steps of i) providing an LWIR imaging system, the LWIR imaging system comprising a) an infrared light emitting source (A) that emits over the whole range of 8 to 14 micrometers, b) an LWIR detecting device (B) and c) a ToF distance sensor (C), ii) providing a substrate comprising an amorphous and/or crystalline structure of phosphate and/or sulphate salts on the surface of the substrate or within the substrate, ii) irradiating the provided substrate with the infrared light emitting source and iii) detecting, with the LWIR detecting device and using and/or based on the TOF distance sensor, the intensity of electromagnetic radiation scattered, emitted and/or reflected by the substrate and the amorphous and/or crystalline structure of phosphate and/or sulphate salts.

The purpose of the present invention is to increase accuracy of a specific test using an electronic microscope and improve work efficiency. Provided is a system that identifies test recipe information corresponding to an object to be tested on the basis of attribute information about a testing sample, and analyzes and evaluates the object to be tested contained in the testing sample by checking image data and element analysis data that are acquired by a measuring device in accordance with a control program for the test recipe information, against reference image data and reference element analysis data that are used as evaluation references for the object to be tested.

A rope tester to ascertain the condition of a wire rope in advance without increasing workload, Including a magnetization detector having a magnetizer for generating a magnetic force, and a detector for detecting a change in magnetism produced in a wire rope magnetized by the magnetic force generated by the magnetizer; a digital camera, which is provided a predetermined distance away from the magnetization detector along the traveling direction of the wire rope, for imaging the wire rope; and a controller, which is connected to the magnetization detector and to the digital camera, for detecting the location of a defect in the wire rope based on a change in magnetism detected by the magnetization detector, and outputting a drive signal that actuates the digital camera at a timing at which the defect location arrives at the location at which the digital camera is installed.

In learning processing performed before sample observation processing (steps S705 to S708), the sample observation device acquires a low-picture quality learning image under a first imaging condition for each defect position indicated by defect position information, determines an imaging count of a plurality of high-picture quality learning images associated with the low-picture quality learning image for each defect position and a plurality of imaging points based on a set value of the imaging count, acquires the plurality of high-picture quality learning images under a second imaging condition (step S702), learns a high-picture quality image estimation model using the low-picture quality learning image and the plurality of high-picture quality learning images (step S703), and adjusts a parameter related to the defect detection in the sample observation processing using the high-picture quality image estimation model (step S704).

Inspection data that corresponds to potential defects of an object may be received. A first set of locations of first potential defects can be identified. The first set of locations of the first potential defects can be imaged with a review tool to obtain a first set of review images. The first potential defects can be classified based on the first set of review images to obtain first classification results of the first potential defects. An instruction can be determined for the review tool based on the first classification results, the instruction being associated with detecting potential defects. Using the instruction, a second set of locations of second potential defects of the plurality of potential defects to be imaged with the review tool can be identified.

According to one embodiment of the present invention, A sample inspection device may provided, a total inspection module scanning a first area comprising a plurality of samples; a precision inspection module performing inspection on a sample determined as a suspected defective sample by the total inspection module in the first area; and a controller processing each data obtained from the total inspection module and the precision inspection module, and detecting a defective sample in the first area, wherein the precision inspection module may include an emitter emitting terahertz wave to the first area, a guide wire guiding an irradiation direction of the terahertz wave, and a vibration unit vibrating the guide wire.

An apparatus for inspecting containers includes a rotation device which is adapted to rotate the container about the axis of symmetry; a camera sensitive to said predetermined electromagnetic radiation and with the container located in the field of view thereof; a processing unit to control the rotation device to move the container at a first angular speed constant for a first time period; acquiring at least a first and a second series of images of a portion of the container in a rotation thereof through 360′; to identify defective areas having at least one characteristic different from the characteristics of adjacent areas, generating first and second maps of the defective areas; to compare the position of the defective areas of the maps; to establish that first impurities are present in the container or in the liquid contained in the container.

Methods and systems for selecting measurement locations on a wafer for subsequent detailed measurements employed to characterize the entire wafer are described herein. High throughput measurements are performed at a relatively large number of measurement sites on a wafer. The measurement signals are transformed to a new mathematical basis and reduced to a significantly smaller dimension in the new basis. A set of representative measurement sites is selected based on analyzing variation of the high throughput measurement signals. In some embodiments, the spectra are subdivided into a set of different groups. The spectra are grouped together to minimize variance within each group. Furthermore, a die location is selected that is representative of the variance exhibited by the die in each group. A spectrum of a measurement site and corresponding wafer location is selected to correspond most closely to the center point of each cluster.

A specimen inspection machine includes a case, a carrying device, an inspection device, a sensing device and a control device. The carrying device is disposed in the case. The inspection device is disposed on the carrying device. The inspection device has accommodating grooves. Each accommodating groove is used for accommodating an inspection sample. The inspection sample at least includes a specimen. The sensing device is disposed in the case on a side of the case opposite the carrying device. The sensing device senses the inspection device to generate first and second sensing signals. The control device is disposed in the case. The control device determines whether the inspection device is disposed in the correct position according to the first sensing signals, and determines whether inspection samples are placed in the accommodating grooves according to the second sensing signals to inspect the accommodating grooves placed with the inspection samples.