Various embodiments of systems and methods for calibrating wafer inspection system modules are disclosed herein. More specifically, the present disclosure provides various embodiments of systems and methods to calibrate the multiple spectral band values obtained from a substrate by a camera system included within a WIS module. In one embodiment, multiple spectral band values are red, green, and blue (RGB) values. As described in more detail below, the calibration methods disclosed herein may use a test wafer having a predetermined pattern of thickness changes or color changes to generate multiple spectral band offset values. The multiple spectral band offset values can be applied to the multiple spectral band values obtained from the substrate to generate calibrated RGB values, which compensate for spectral responsivity differences between camera systems included within a plurality of WIS modules.

The invention provides a system and method for characterising at least part of a material comprising: a source of incident X-rays (4, 28) configured to irradiate at least part of the material; one or more detectors (300,302,312,1701,1704,1600,1607,1608,1604) adapted to detect radiation emanating from within or passing through the material as a result of the irradiation by the incident radiation (1700) and thereby produce a detection signal (313); and one or more digital processors (304-311,2000-2009) configured to process the detection signal (313) to characterise at least part of the material; wherein the one or more detectors (300,302,312,1701, 1704,1600,1607,1608,1604) and one or more digital processors (304-311,2000-2009) are configured to characterise at least part of the material by performing energy resolved photon counting X-ray transmission spectroscopy analysis.

This disclosure provides a highly accurate NDIR gas sensor and a highly accurate optical device even using a simplified optical filter. The NDIR gas sensor and the optical device include: an optical filter having a substrate and a multilayer film on the substrate; and an infrared light emitting and receiving device; where the multilayer film has a structure in which a first layer and a second layer are alternately stacked; the active layer contains Al.sub.xIn.sub.1-xSb or InAs.sub.ySb.sub.1-y; and the optical filter includes a wavelength range having an average transmittance of 70% or more with a width of 50 nm or more in 2400-6000 nm, and has a maximum transmittance of 5% or more in 6000-8000 nm and an average transmittance of 2% or more and 60% or less in 6000-8000 nm.

A method and a measuring equipment of the degree of crystallinity of a polymer coating on a metallic substrate using a hyperspectral camera as well as representing or mapping the degree of crystallinity is provided. An equipment for online measurement of crystallinity of polymers, including at least one hyperspectral camera, at least one lighting source, a polymer layer deposited on a substrate and means to convey the substrate, the lighting source and the hyperspectral camera being set-up in specular reflection towards the polymer layer.

Methods and systems for setting up alignment of a specimen are provided. One system includes computer subsystem(s) configured for acquiring two-dimensional (2D) images generated from output of a detector of an output acquisition subsystem at template locations in corresponding areas of printed instances on a specimen. The computer subsystem(s) determine offsets in x and y directions between the template locations using the 2D images and determine an angle of the specimen with respect to the output acquisition subsystem based on the offsets. If the angle is greater than a predetermined value, the computer subsystem(s) rotate the specimen and repeat the steps described above. If the angle is less than the predetermined value, the computer subsystem(s) store one of the 2D images for alignment of the specimen in a process performed on a specimen. The 2D images may include multi-mode images, which may be fused prior to determining the offsets.

A material characterization system and method for characterizing a stream of material emanating from a material identification, exploration, extraction or processing activity, the system including a source of incident radiation configured to irradiate the stream of material in an irradiation region, one or more detectors adapted to detect radiation emanating from within or passing through the stream of material as a result of the irradiation by the incident radiation and thereby produce a detection signal, and one or more digital processors configured to process the detection signal to characterise the stream of material, wherein the source of incident radiation and the one or more detectors are adapted to be disposed relative to the stream of material so as to irradiate the stream of material and detect the radiation emanating from within or passing through the stream as the stream passes through the irradiation region.

An optical device comprises an optical filter having a substrate and a multilayer film having layers with different refractive indexes formed on at least one side of the substrate; and an infrared light emitting and receiving device having a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer. The multilayer film has alternatively stacked first second layers each having refractive indexes of 1.2 or more and 2.5 or less, and 3.2 or more and 4.2 or less, respectively, in a wavelength range of 2400 nm to 6000 nm. The optical filter includes a wavelength range having an average transmittance of 70% or more with a width of 50 nm or more in a wavelength range of 2400 nm to 6000 nm, and has a maximum transmittance of 5% or more in a wavelength range of 6000 nm to 8000 nm.

Methods and systems for setting up alignment of a specimen are provided. One system includes computer subsystem(s) configured for acquiring two-dimensional (2D) images generated from output of a detector of an output acquisition subsystem at template locations in corresponding areas of printed instances on a specimen. The computer subsystem(s) determine offsets in x and y directions between the template locations using the 2D images and determine an angle of the specimen with respect to the output acquisition subsystem based on the offsets. If the angle is greater than a predetermined value, the computer subsystem(s) rotate the specimen and repeat the steps described above. If the angle is less than the predetermined value, the computer subsystem(s) store one of the 2D images for alignment of the specimen in a process performed on a specimen. The 2D images may include multi-mode images, which may be fused prior to determining the offsets.

A material characterization system and method for characterizing a stream of material emanating from a material identification, exploration, extraction or processing activity, the system including a source of incident radiation configured to irradiate the stream of material in an irradiation region, one or more detectors adapted to detect radiation emanating from within or passing through the stream of material as a result of the irradiation by the incident radiation and thereby produce a detection signal, and one or more digital processors configured to process the detection signal to characterise the stream of material, wherein the source of incident radiation and the one or more detectors are adapted to be disposed relative to the stream of material so as to irradiate the stream of material and detect the radiation emanating from within or passing through the stream as the stream passes through the irradiation region.

Various embodiments of systems and methods for calibrating wafer inspection system modules are disclosed herein. More specifically, the present disclosure provides various embodiments of systems and methods to calibrate the multiple spectral band values obtained from a substrate by a camera system included within a WIS module. In one embodiment, multiple spectral band values are red, green, and blue (RGB) values. As described in more detail below, the calibration methods disclosed herein may use a test wafer having a predetermined pattern of thickness changes or color changes to generate multiple spectral band offset values. The multiple spectral band offset values can be applied to the multiple spectral band values obtained from the substrate to generate calibrated RGB values, which compensate for spectral responsivity differences between camera systems included within a plurality of WIS modules.