A detection method for a display panel motherboard and a display panel motherboard. The detection method for the display panel motherboard including a plurality of display panels arranged in a matrix includes: dividing the display panel motherboard into a plurality of detection regions, at least one detection region corresponding to at least a portion of each display panel in a same string of display panels; performing a defect detection on patterns in all the display panels in the at least one detection region.

The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the product so as to extend within the detection plane, the inspection system comprising a second projection device, the second projection device having at least one illuminating means (27), the illuminating means being capable of projecting diffuse light onto the product, light of the diffuse light reflected by the product in the detection plane being detectable by means of the line scan camera.

A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

A measurement target is captured using two types of illumination patterns set such that only color features of specular objects change, the two images that are obtained are compared, and objects are identified as being specular objects or diffuse objects depending on whether the color features change markedly. At this time, the emission intensity distribution of each illumination pattern is devised such that specular lobe components that are included in reflected light are canceled out.

A substrate detection device and a substrate direction method are disclosed in the embodiments for achieving a wide-range high-compatibility detection of leads in a peripheral circuit region of a liquid crystal display. The detection device comprises a converting unit configured to calculate a gray scale of a gray image of a circuit lead region of a substrate based on the gray image of the circuit lead region of the substrate, and to convert the gray image into an image of leads in the circuit lead region, based on a difference between the calculated gray scales of the leads and of the substrate in the circuit lead region; and a judging unit configured to judge a state of the leads in the circuit lead region based on the image of the leads in the circuit lead region.

Disclosed are apparatus and methods for optical planar metrology of electrical components utilizing cross-sectioning techniques. A disclosed apparatus includes at least one predefined geometric shape or array composed of a material and disposed on a surface of the circuit board in proximity to an electrical component under test. The shape or array creates an optically measureable unique feature for each cross sectional plane created during the performance of optical planar metrology regardless of depth or overall planarity. The geometry of the shape or array ensures a unique cross-sectional profile for every plane and the material of the shape or array (e.g., copper or a similar material having equivalent optical properties) allows for optical visibility and differentiation from surrounding materials.