The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Disclosed are a method and an apparatus for inspection of workpieces and products having curved and, in particular, spherical surfaces. The method is based on scanning inspected objects with a narrow probing beam of electromagnetic radiation and concurrently measuring the radiation scattered on the surface. The method and apparatus improve the detectability of features and imperfections on inspected surfaces by providing invariable parameters and conditions of scanning, robust mechanical stability of scanning systems, high positioning accuracy of the probing electromagnetic beam and efficient collection of the scattered radiation. The apparatus allows surface defect classification, determining defect dimensions and convenient automation of inspection.

A defective soldering point intensive extent analysis system for solder paste inspection and a method thereof are disclosed. After the circuit board is set with soldering pastes, the solder paste inspection can immediately detect a circuit board to generate a detection log, the information of defective soldering points in the detection log is analyzed to determine an aggregate of the defective soldering points set on the circuit board, so as to find a defective soldering point area, and generate and display defective soldering point alert information according to statistics of the defective soldering point area, thereby achieving the technical effect of conveniently analyzing the defective soldering points on the circuit board for accurate repair.

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.

The invention relates to a candling apparatus for the rapid discrimination, removal and relocation of non-live avian eggs. The invention further relates to methods of use of the candling apparatus for the candling, removal and relocation of avian eggs.

Disclosed are a method, an apparatus, and a system for inspecting a ball grid array-type semiconductor chip package. A first embodiment of the present invention provides an apparatus for inspecting a semiconductor chip package, the apparatus comprising: a first image acquisition unit for acquiring a reference image using a three-dimensional image of a semiconductor chip serving as a reference, the reference image being obtained by removing a region of interest from the three-dimensional image; a second image acquisition unit for acquiring a two-dimensional image of a semiconductor chip to be inspected; and an image processing unit for deriving an image of a region of interest of the semiconductor chip to be inspected, from the difference between the reference image and the two-dimensional image.

The present invention relates to a method and apparatus for inspecting, as they pass, eggs placed in containers. According to the invention, during the movement of these containers (1) along a conveyor line, the following steps are carried out: triggering a data acquisition cycle on each passage of a downstream end of a container (1) through a first position, which is determined by a first position sensor (6) placed along said conveyor line, upstream and downstream positions being considered with reference to the direction of movement of the containers; then for a data acquisition cycle of a container (1), detecting the passage of said downstream end of said container (1) through at least a second position determined by a second position sensor (7-8) placed along said conveyor line, a signal triggering thermal image acquisition being sent to a thermal camera (5) each time said downstream end of said container (1) is detected at at least a second position in order to trigger capture of one or more thermal images by said thermal camera (5) of the portion of the container (1) then placed in its field of view, said second position sensors (7-8) being arranged with respect to one other to ensure an inspection of all of the eggs of the container (1) considered by said thermal camera (5) when a plurality of second sensors are employed.

Furthermore, the data acquisition cycle of said container comprises performing, in a third position separate from said first and second positions, a step of candling the eggs placed in said container, in which step a light flux is emitted in the direction of at least one egg to be candled and the light flux passed through each corresponding egg is then analysed depending on the level of light flux absorbed by the egg, and said data thus acquired on the eggs of a container (1) are associated with a unique identifier of this container (1).

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

A system for recognising the stage of fertile eggs from an ovoscopy step and sorting same, and a method for operating the submodules of the system and modules for applying substances and hatching represents an inventive solution in the field of poultry farming, in particular in the sector of poultry breeding, and more specifically in the step of application of vaccines or nutrients or a vaccine-nutrient complex into fertile eggs by intra-ovum injection, and also in the hatching step, on the basis of a module for sorting eggs in the matrix (4), in particular blind matrix (Mz1) of fertile eggs, and of an egg stage sensing module (M41), wherein the data obtained are processed by an egg sorting module (m42), using an application software (d21) which first generates a virtual matrix (Mz2) of the incubation tray, then a matrix (Mz3) that mirrors approved eggs, these data being then processed to feed the substance preparation submodule (m43) and the device set-up module (m44), in order to optimise the operation of the substance application module (m2) and hatching module (m3), respectively, a sorted egg data base submodule (m45) being further defined to feed the module for analysing the quality of the matrices (egg-laying hens) used to develop avian species.