G01N2201/063

Structure of optical sensor having light-emitting element and plurality of light-receiving elements

A housing includes a first opening and a second opening, and encloses a light-emitting element, a first light receiving unit, and a second light receiving unit. The first opening is provided in a first light guide path arranged between the light-emitting element and a first irradiated region of the target surface, and is arranged so that light output from the light-emitting element travels toward the first irradiated region. The second opening is provided in a second light guide path arranged between the first irradiated region and the first light receiving unit, and is arranged so that diffused reflection light from the toner image passes through when the toner image passes the first irradiated region.

DEVICE FOR CHEMILUMINESCENCE ANALYSIS
20230221259 · 2023-07-13 ·

A device for chemiluminescence analysis includes: a reaction chamber; a first inlet opening for introducing a sample gas into the reaction chamber via a first supply line; a second inlet opening for introducing a reaction gas into the reaction chamber via a second supply line; an outlet opening for discharging a mixture of the sample gas and the reaction gas out of the reaction chamber via an outlet line; a mixer unit in which the sample gas and the reaction gas are mixed; and a sensor unit for detecting chemiluminescent radiation in the reaction chamber, wherein the mixer unit is arranged in a first end region of the reaction chamber, and the sensor unit is arranged in a second end region of the reaction chamber opposite the first end region. An elemental analyzer including the device is also disclosed.

FLEXIBLE DISPLAY INSPECTION SYSTEM
20230015878 · 2023-01-19 ·

A display inspection system for inspecting a light beam emitted from a panel with pixels positioned at several focal planes is provided. The display inspection system includes a focus tunable lens adjustable in a focal distance for focusing at the panel, a first sensing unit for receiving the light beam, a reduced aberration optical system arranged between the focus tunable lens and the first sensing unit for focusing at the first sensing unit, and one or more optical elements placed within a back focal length of the reduced aberration optical system. The reduced aberration optical system comprises a first serial cascade lens group of a first aplanatic lens and a first doublet lens for correcting an optical aberration. The first aplanatic lens and the first doublet lens are co-configured that the back focal length is extended in a manner that the light beam is incident to the first sensing unit.

Optical nanostructure rejecter for an integrated device and related methods

Apparatus and methods relating to photonic bandgap optical nanostructures are described. Such optical nanostructures may exhibit prohibited photonic bandgaps or allowed photonic bands, and may be used to reject (e.g., block or attenuate) radiation at a first wavelength while allowing transmission of radiation at a second wavelength. Examples of photonic bandgap optical nanostructures includes periodic and quasi-periodic structures, with periodicity or quasi-periodicity in one, two, or three dimensions and structural variations in at least two dimensions. Such photonic bandgap optical nanostructures may be formed in integrated devices that include photodiodes and CMOS circuitry arranged to analyze radiation received by the photodiodes.

Die bonding apparatus and manufacturing method for semiconductor device

A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

Image sensor system

An optical sensor system may include a light source. The optical sensor system may include a concentrator component proximate to the light source and configured to concentrate light from the light source with respect to a measurement target. The optical sensor system may include a collection component that includes an array of at least two components configured to receive light reflected or transmitted from the measurement target. The optical sensor system may include may a sensor. The optical sensor system may include a filter provided between the collection component and the sensor.

Optical imaging system using lateral illumination for digital assays
11635387 · 2023-04-25 · ·

A compact optical imaging system including a single filter and a light source that provides lateral illumination for bead detection in digital assays. The light source is configured to emit light toward the detection vessel. The single filter is positioned to receive light reflected from a sample in the detection vessel, that originated from the light source, and receive an output from a sample in the detection vessel. A detector is configured to receive a portion of the reflected light and a portion of the output that passes through the single filter.

IMAGE SENSOR SYSTEM

An optical sensor system may include a light source. The optical sensor system may include a concentrator component proximate to the light source and configured to concentrate light from the light source with respect to a measurement target. The optical sensor system may include a collection component that includes an array of at least two components configured to receive light reflected or transmitted from the measurement target. The optical sensor system may include may a sensor. The optical sensor system may include a filter provided between the collection component and the sensor.

OPTICAL INSPECTION USING CONTROLLED ILLUMINATION AND COLLECTION POLARIZATION
20230117345 · 2023-04-20 · ·

An optical inspection system that may include an illumination optics configured to generate an illumination light beam and to illuminate a sample with the illumination light beam; at least one collection optics configured to collect light from the sample; at least one detector configured to detect at least one detected light beam outputted from the at least one collection optics; multiple polarizers that are configured to (a) set a polarization of the illumination light beam by selectively introducing, under a control of the control unit, at least one illumination optics polarization change, and (b) set a polarization of the at least one detected light beam by selectively introducing, under a control of the control unit, at least one collection optics polarization change. The multiple polarizers may include one or more illumination half-wave plates, one or more quarter-wave plates, and one or more inhomogeneous polarizers.

SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES

In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.