The present disclosure relates to a method and an associated process tool. The method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. The electromagnetic radiation is scanned along a vertical axis. An intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. A position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.

There are provided a control device of an image reading apparatus, an operation method and an operation program thereof, and an image detection system capable of quickly and easily outputting an image having an appropriate density for analysis from an image reading apparatus. An image receiving unit receives a pre-image output in pre-scanning performed before main scanning for outputting a main image for analysis in an image reading apparatus. A region information receiving unit receives information of a region in the pre-image designated by a user. A calculation unit calculates an appropriate voltage value that is a voltage value of the photomultiplier at which a density of the region becomes an appropriate density for analysis. A scanning conditions setting unit sets the appropriate voltage value as temporary scanning conditions of main scanning.

There are provided a control device of an image reading apparatus, an operation method and an operation program thereof, and an image detection system capable of quickly and easily outputting an image having an appropriate density for analysis from an image reading apparatus. An image receiving unit receives a pre-image output in pre-scanning performed before main scanning for outputting a main image for analysis in an image reading apparatus. A region information receiving unit receives information of a region in the pre-image designated by a user. A calculation unit calculates an appropriate voltage value that is a voltage value of the photomultiplier at which a density of the region becomes an appropriate density for analysis. A scanning conditions setting unit sets the appropriate voltage value as temporary scanning conditions of main scanning.

Apparatuses and methods for implementing scanning trajectories for ROI tomography are disclosed herein. An example method includes determining a first focus object distance based on a circumradius of a sample, the sample including a region of interest, determining a second focus object distance based on a radius of a smallest cylinder that contains the region of interest, determining a plurality of viewing angles from a plurality of possible viewing angles in response to the first focus object distance, where each viewing angle of the plurality of viewing angles has an associated focus object distance measured from the region of interest, and where the associated focus object distance of each of the plurality of viewing angles is less than the first focus object distance and greater than the second focus object distance, and scanning the region of interest using at least the plurality of viewing angles.

A semiconductor device inspection device includes a semiconductor device stage, a sound wave generator, a laser emitter, a photoreceiver, and a processing circuit. The sound wave generator is configured to generate a sound wave having a natural frequency of a bonding wire included in a semiconductor device placed on the semiconductor device stage. The laser emitter is configured to direct laser toward the bonding wire while the sound wave generator generates the sound wave. The photoreceiver is configured to receive the laser reflected by the bonding wire and output a signal corresponding to the received laser. The processing circuit is configured to detect a bonding failure of the bonding wire based on the signal output by the photoreceiver.

A semiconductor device inspection device includes a semiconductor device stage, a sound wave generator, a laser emitter, a photoreceiver, and a processing circuit. The sound wave generator is configured to generate a sound wave having a natural frequency of a bonding wire included in a semiconductor device placed on the semiconductor device stage. The laser emitter is configured to direct laser toward the bonding wire while the sound wave generator generates the sound wave. The photoreceiver is configured to receive the laser reflected by the bonding wire and output a signal corresponding to the received laser. The processing circuit is configured to detect a bonding failure of the bonding wire based on the signal output by the photoreceiver.

An optical scanning system adapted to scan a sample on a chip is provided. The optical scanning system includes at least one optical scanning head, at least one scanning light source, a light receiving device and a processor. Each of at least one optical scanning head includes a focusing light source, a first optical guiding structure, and a control unit. The first optical guiding structure is configured to guide the focusing light emitted from the focusing light source to travel to the sample, and the first optical guiding structure is configured to guide the at least one scanning light emitted from the at least one scanning light source to the sample to generate a secondary light. The control unit is configured to control the first optical guiding structure to keep the focusing light and at least one scanning light focusing on a surface of the chip. The light receiving device receives the secondary light and generates a scanning electronic signal. The processor is electrically coupled to the light receiving device to dispose the scanning electronic signal.

A sample comprising a first substance and a second substance is modified by breaking down molecular bonds of the second substance of the sample to form a modified sample having altered surface enhanced luminescence (SEL) characteristics to reduce overlapping of SEL characteristics of the first substance in the second substance. Surface enhanced luminescence data resulting from excitation of the modified sample is collected. Characteristics of the first substance based upon the collected surface enhanced luminescence data are identified.

Apparatuses and methods for implementing scanning trajectories for ROI tomography are disclosed herein. An example method includes determining a first focus object distance based on a circumradius of a sample, the sample including a region of interest, determining a second focus object distance based on a radius of a smallest cylinder that contains the region of interest, determining a plurality of viewing angles from a plurality of possible viewing angles in response to the first focus object distance, where each viewing angle of the plurality of viewing angles has an associated focus object distance measured from the region of interest, and where the associated focus object distance of each of the plurality of viewing angles is less than the first focus object distance and greater than the second focus object distance, and scanning the region of interest using at least the plurality of viewing angles.

This invention concerns spectroscopy apparatus comprising a light source arranged to generate a light profile on a sample, a photodetector having at least one photodetector element for detecting characteristic light generated from interaction of the sample with light from the light source, a support for supporting the sample, the support movable relative to the light profile, and a processing unit. The processing unit is arranged to associate a spectral value recorded by the photodetector element at a particular time with a point on the sample predicted to have generated the characteristic light recorded by the photodetector element at the particular time based on. relative motion anticipated to have occurred between the support and the light profile.