G01N2223/104

Method for detecting fluorinated chemicals in liquid
11002691 · 2021-05-11 ·

An ion beam analysis method to quantitatively measure the presence of fluorinated compounds in aqueous samples. The method is a quick, cost effective, nondestructive and quantitative, screen for the presence of fluorinated compounds in solution. The present invention includes a novel method of using an ion beam analysis method (such as PIGE) in air (ex vacuo) to unambiguously easily, quickly, accurately, precisely and cost effectively identify the presence of fluorinated compounds (such as PFASs) that have been extracted from aqueous solutions. The present invention may be used with a wide variety of aqueous solutions, including environmental groundwater samples, with little processing.

COUNTER COUNTERFEIT AND EMBEDDED BARCODE TECHNOLOGY
20250231126 · 2025-07-17 ·

In one or more amendments, an apparatus has an ion source and a sensor. The ion source can send a pulse or a pulse chain of ions to a target to cause the target to emit photons. The sensor can detect photons emitted from the target. The pulse or pulse chain of ions have a 10-500 ns pulse width and a current density between 1-10,000 A/cm.sup.2.

METHOD FOR DETECTING FLUORINATED CHEMICALS IN LIQUID
20180266971 · 2018-09-20 ·

An ion beam analysis method to quantitatively measure the presence of fluorinated compounds in aqueous samples. The method is a quick, cost effective, nondestructive and quantitative, screen for the presence of fluorinated compounds in solution. The present invention includes a novel method of using an ion beam analysis method (such as PIGE) in air (ex vacuo) to unambiguously easily, quickly, accurately, precisely and cost effectively identify the presence of fluorinated compounds (such as PFASs) that have been extracted from aqueous solutions. The present invention may be used with a wide variety of aqueous solutions, including environmental groundwater samples, with little processing.

RADIATION-MEASUREMENT-INSTRUMENT SUPPORT DEVICE, RADIATION MEASUREMENT APPARATUS, AND RADIATION MEASUREMENT METHOD

According to one embodiment, a radiation-measurement-instrument support device comprising: a cylindrical casing configured to house at least one phantom and a radiation measurement instrument and formed in a cylindrical shape; a base configured to rotatably support the cylindrical casing in a circumferential direction in a state where a cylindrical axis of the cylindrical casing is directed in a horizontal direction and fix the cylindrical casing at an arbitrary rotation angle in the circumferential direction; and an angle display configured to display the rotation angle.

PARTICLE-INDUCED X-RAY EMISSION USING LIGHT AND HEAVY PARTICLE BEAMS

A method of Particle-Induced X-Ray Emission (PIXE) analysis comprises: (a) delivering a first ion beam from a first ion source and comprising ions having a first composition onto an area of a sample, wherein the kinetic energy of the ions is not greater than 50 kilo-electron-Volts (keV); (b) simultaneously with the delivering of the first ion beam onto the sample area, delivering a second ion beam from a second ion source onto the sample area, the second ion beam comprising ions having a second composition, wherein the kinetic energy of the ions of the second ion beam is not greater than 50 keV; and (c) detecting X-rays that are emitted from the sample area in response to the simultaneous delivery of the first and second ion beams thereto.

3D VOLUME INSPECTION METHOD AND METHOD OF CONFIGURING OF A 3D VOLUME INSPECTION METHOD

A method of 3D-inspection of a semiconductor object inside of an inspection volume of a wafer or wafer sample comprises a 3D data processing and a step for acquiring a plurality of two-dimensional images. The acquiring step comprises a monitoring step for determining whether a two-dimensional image is in conformity with a desired property of the 3D data processing. The disclosure further comprises a method of configuring the method of 3D-inspection and a system configured to execute the method of 3D inspection as well as the method of configuring the method of 3D-inspection.