A sample inspection system and a corresponding method for inspecting a sample is provided. The sample inspection system includes a beam former, a beam modulator an energy resolving detector and a collimator. The beam former is adapted to receive an electromagnetic radiation from an electromagnetic source to generate a primary beam of electromagnetic radiation. The beam modulator is provided at a distance from the beam former to define a sample chamber. The collimator is provided between the beam modulator and the energy resolving detector. The collimator has a plurality of channels adapted to receive diffracted or scattered radiation. Upon incidence of the primary beam onto the beam modulator, the beam modulator provides a reference beam of diffracted or scattered radiation. The energy resolving detector is arranged to detect the reference beam.

A method of analysing granular material in a slurry, the method comprising: compacting the granular material in the slurry to form one or more pucks; irradiating said pucks with X-Ray radiation and detecting X-ray energy transmitted through said one or more irradiated pucks; irradiating a reference material with X-Ray radiation, said reference material having known material characteristics and detecting X-ray energy transmitted through said reference material; comparing X-ray energy transmission through said one or more pucks with the reference material to compute, using a processing unit, one or more particle characteristics of the granular material in the one or more pucks.

An X-ray inspection apparatus suppresses anomalies in inspection results caused by the X-ray inspection apparatus being used while an unsuitable setting is in effect. The X-ray inspection apparatus is provided with an inspection unit, a setting unit, a storage unit, an assessment unit, and a notification unit. The inspection unit inspects an irradiated article using detection data obtained by detecting X-rays. The setting unit sets a setting value used in inspection of the article by the inspection unit. The storage unit stores a detection value based on the detection data. The assessment unit assesses, on the basis of the detection value stored in the storage unit, whether or not the setting value set by the setting unit is suitable. When the assessment unit has assessed that the setting value is not suitable, the notification unit issues a notification to indicate that the setting value is not suitable.

A sample inspection system and a corresponding method for inspecting a sample is provided. The sample inspection system includes a beam former, a beam modulator an energy resolving detector and a collimator. The beam former is adapted to receive an electromagnetic radiation from an electromagnetic source to generate a primary beam of electromagnetic radiation. The beam modulator is provided at a distance from the beam former to define a sample chamber. The collimator is provided between the beam modulator and the energy resolving detector. The collimator has a plurality of channels adapted to receive diffracted or scattered radiation. Upon incidence of the primary beam onto the beam modulator, the beam modulator provides a reference beam of diffracted or scattered radiation. The energy resolving detector is arranged to detect the reference beam.

A defect inspection device is provided with an illumination optical system that irradiates light or an electron beam onto a sample, a detector that detects a signal obtained from the sample through the irradiation of the light or electron beam, a defect detection unit that detects a defect candidate on the sample through the comparison of a signal output by the detector and a prescribed threshold, and a display unit that displays a setting screen for setting the threshold. The setting screen is a two-dimensional distribution map that represents the distribution of the defect candidates in a three dimensional feature space having three features as the axes thereof and includes the axes of the three features and the threshold, which is represented in one dimension.

The purpose of the present invention is to provide a pattern measurement device for quantitatively evaluating a pattern formed using a directed self-assembly (DSA) method with high accuracy. The present invention is a pattern measurement device for measuring distances between patterns formed in a sample, wherein the centroids of a plurality of patterns included in an image are determined; the inter-centroid distances, and the like, of the plurality of centroids are determined; and on the basis of the inter-centroid distances, and the like, of the plurality of centroids, a pattern meeting a specific condition is distinguished from patterns different from the pattern meeting the specific condition or information is calculated about the number of the patterns meeting the specific condition, the size of an area including the patterns meeting the specific condition, and the number of imaginary lines between the patterns meeting the specific condition.

The invention relates to an industrial X-ray workpiece measuring system comprising an X-ray source (4), which is arranged in an X-ray protective housing (2) and has an X-ray focal spot (3), workpiece carrier means, which are arranged in the X-ray protective housing, for accommodating a non-medical workpiece (5) to be examined, and X-ray detector means (10a, 10b, 10c) which are provided on and/or in the X-ray protective housing, are designed to detect an X-ray beam from the X-ray source, which X-ray beam penetrates the workpiece held on the workpiece carrier means, and downstream of which X-ray detector means electronic evaluating means can be connected.

Methods and systems for characterizing dimensions and material properties of semiconductor devices by full beam x-ray scatterometry are described herein. A full beam x-ray scatterometry measurement involves illuminating a sample with an X-ray beam and detecting the intensities of the resulting zero diffraction order and higher diffraction orders simultaneously for one or more angles of incidence relative to the sample. The simultaneous measurement of the direct beam and the scattered orders enables high throughput measurements with improved accuracy. The full beam x-ray scatterometry system includes one or more photon counting detectors with high dynamic range and thick, highly absorptive crystal substrates that absorb the direct beam with minimal parasitic backscattering. In other aspects, model based measurements are performed based on the zero diffraction order beam, and measurement performance of the full beam x-ray scatterometry system is estimated and controlled based on properties of the measured zero order beam.

A method of qualifying physical components using computed tomography (CT) includes obtaining qualified CT data from a CT scanner for at least one qualified physical component. Qualification data is generated based on the qualified CT data, where the qualification data defines a qualification envelope. Candidate CT data is obtained from the CT scanner for a candidate physical component. Comparison data is then generated based on the candidate CT data and the qualification data, where the comparison data indicates whether the candidate CT data is within the qualification envelope defined by the qualification data. An acceptance signal is generated if the comparison data meets acceptance criteria

Optical geometry calibration devices, systems, and related methods for x-ray imaging are disclosed. An optical-based geometry calibration device is configured to interface with a two-dimensional (2D) imaging device to perform three-dimensional (3D) imaging. The optical-based geometry calibration device includes one or more optical cameras fixed to either an x-ray source or an x-ray detector, one or more markers fixed to the x-ray detector or the x-ray source, with each of the one or more optical cameras being configured to capture at least one photographic image of one or more corresponding optical markers when each x-ray image of the object is captured, and an image processing system configured to compute positions of the x-ray source relative to the x-ray detector for each 2D projection image based on the at least one photographic image of the one or more markers