A system and method of inspecting a plurality of objects using a computed tomography (CT) system is provided. The method includes acquiring an image of a fixture used for holding the plurality of objects with the CT system. A first electronic model of the fixture is generated. The objects are placed in the fixture. An image of the fixture and the objects is acquired with the CT system. A second electronic model of the fixture and the objects is generated. A third electronic model of the objects is defined based at least in part on subtracting the first electronic model from the second electronic model. Dimensions of the objects from the third electronic model are compared with a computer aided design (CAD) model. A report is output based at least in part on the comparison of the objects from the third electronic model with the CAD model.

A system and method of inspecting a plurality of objects using a computed tomography (CT) system is provided. The method includes acquiring an image of a fixture used for holding the plurality of objects with the CT system. A first electronic model of the fixture is generated. The objects are placed in the fixture. An image of the fixture and the objects is acquired with the CT system. A second electronic model of the fixture and the objects is generated. A third electronic model of the objects is defined based at least in part on subtracting the first electronic model from the second electronic model. Dimensions of the objects from the third electronic model are compared with a computer aided design (CAD) model. A report is output based at least in part on the comparison of the objects from the third electronic model with the CAD model.

A method for compensating for substrate variation in measurement of material quantity of a material positioned on a substrate is described. The method includes receiving a detected X-ray signal for a measurement of the material at a position on a surface of the substrate; and determining a material quantity based on the received X-ray measurement signal and a pre-determined set of compensation parameters for the substrate, the set of compensation parameters varying according to the position on the surface of the substrate.

A method for compensating for substrate variation in measurement of material quantity of a material positioned on a substrate is described. The method includes receiving a detected X-ray signal for a measurement of the material at a position on a surface of the substrate; and determining a material quantity based on the received X-ray measurement signal and a pre-determined set of compensation parameters for the substrate, the set of compensation parameters varying according to the position on the surface of the substrate.