A computer-implemented method of automated X-ray inspection during the production of printed circuit board, PCB, assemblies. The method includes capturing an X-ray image of a PCB assembly, determining a first error indicator based on image processing of the captured X-ray image, determining, in case the first error indicator indicates the PCB assembly as faulty, a second error indicator based on the captured X-ray image using a trained adaptive algorithm, and outputting the second error indicator as a result of the inspection.

Described is an anti-vibration fixture comprising a radiolucent enclosure and a vibration-dampening material attached to an inside face of the radiolucent enclosure. The vibration-dampening material is configured to receive a component for nondestructive testing by computed tomography (CT) scanning. The anti-vibration fixture further comprises a plurality of fasteners attached to opposing faces of the radiolucent enclosure.

Described is an anti-vibration fixture comprising a radiolucent enclosure and a vibration-dampening material attached to an inside face of the radiolucent enclosure. The vibration-dampening material is configured to receive a component for nondestructive testing by computed tomography (CT) scanning. The anti-vibration fixture further comprises a plurality of fasteners attached to opposing faces of the radiolucent enclosure.

In an inspection device having a storage unit and an exposure dose calculation unit, the exposure dose calculation unit executes a first step for calculating the dose when an image is acquired by irradiating radiation from a radiation generator based on the reference dose stored in the storage unit, a second step for calculating the dose when the relative position between the radiation generator and an inspection object is changed, a third step for calculating the total value of the dose irradiated to the inspection object, and a fourth step for outputting the total value.

There are disclosed a method of producing an XRF readable mark, the XRF readable mark and a component comprising thereof. The method comprises providing an XRF marking composition with specific relative concentrations of one or more chemical elements and fabricating a multilayer structure of the XRF readable mark. The relative concentrations are selected such that in response to irradiation of the XRF marking composition by XRF exciting radiation, the XRF marking composition emits an XRF signal indicative of a predetermined XRF signature. Fabricating the multilayer structure comprises implementing an attenuation layer with at least one element exhibiting high absorbance for an XRF exciting radiation and/or an XRF background; and implementing a marking layer comprising said XRF marking composition.

A correction amount specifying apparatus comprises circuitry for storing diffraction data including a combination of the diffraction angle of the irradiation X-rays with respect to the sample rotation angle and the sample surface height, the diffraction data being acquired by irradiating X-rays to a standard sample that is an aggregate of isotropic and stress free crystal particles, determining a first correspondence relationship based on the diffraction data, and specifying a correction amount of the sample surface height with respect to a desired sample rotation angle and a desired diffraction angle based on the first correspondence relationship.

Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.

An X-ray fluorescence analyzer includes: a sample stage having a mounting surface on which a sample on which a sample is mounted is mounted; an X-ray source configured to irradiate the sample with primary X-rays and disposed immediately above an irradiation position of the sample; a detector configured to detect fluorescent X-rays emitted from the sample irradiated with the primary X-rays; and a shielding container configured to accommodate the sample stage, the X-ray source, and the detector and includes: a sample chamber configured to accommodate the sample stage; and a door provided at a top of the sample chamber and configured to open and close at least a front half of the sample chamber, wherein the X-ray source and the detector are disposed at a rear half of the sample chamber.

A sample holder for holding a sample during an X-ray imaging process includes a sample placement surface on which the sample is placed for positioning the sample in a depth direction of the sample holder. The sample holder also includes a first alignment portion for aligning the sample in a width direction of the sample holder, and a second alignment portion for aligning the sample in a height direction of the sample holder.

A measurement system is provided, including a measurement machine and a computer. The measurement machine is configured to measure a thickness T1 of a to-be-tested circuit board and a drilling depth D1 of the to-be-tested circuit board. The computer calculates a length S1 of a residual conductive portion in a back drilled hole of the to-be-tested circuit board according to a thickness T of a reference circuit board, a drilling depth D of the reference circuit board, a length S of a residual conductive portion in a back drilled hole of the reference circuit board, the thickness T1 of the to-be-tested circuit board and the drilling depth D1 of the to-be-tested circuit board.