A gas sensor (100) extending in an axial direction AX including: a gas sensor element (120) which detects the concentration of a specific gas in a gas under measurement; a tubular metallic shell (110) having a polygonal tool engagement portion (110B) surrounding the gas sensor element (120); a tubular outer tube (103) which extends rearward from the metallic shell (110), surrounds the gas sensor element (120), and has an opening (103E) at a rear end thereof; a sealing member (191) which seals the opening (103E); and a tubular heat dissipating member (104) which surrounds the outer tube (103) and reduces the amount of heat transferred from the forward end side of the gas sensor (100) through the outer tube (103) to the sealing member (191). The maximum diameter D1 of the heat dissipating member (104) is equal to or less than the opposite side dimension D2 of the tool engagement portion (110B).

A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

Apparatuses and methods for using the guarded heat flow meter technique are provided. The apparatuses use the guarded heat flow meter method to measure the thermal conductivity of solid materials in the temperature range of about ambient to 300° C. The material being tested is compressed between two plates with a controlled temperature difference. The thermal conductivity of the material is calculated by measuring the heat flux through a reference sample in series with the material under test. The apparatuses and methods comprise mechanical mechanisms for stack and guard movements and methods of stack compression and measurement for the testing.

Food processing monitoring systems and method thereof are provided. A method includes obtaining first temperature data from a first temperature sensor at an inlet of a food processing machine; obtaining second temperature data from a second temperature sensor at an outlet of the food processing machine; obtaining current data from a current sensor that is configured to measure current of a motor of the food processing machine; determining presence of food product at the inlet based on a peak current, of the current data at a time the motor starts, being greater than a first current threshold; and logging a temperature of the first temperature data based on the peak current being greater than the first current threshold.

A sensor is disclosed. The sensor according to an embodiment of the present invention may include a substrate; a first electrode pattern disposed on one side of the substrate to form a layer; a second electrode pattern disposed on the one side of the substrate to form a layer and separated from the first electrode pattern; a sensing layer located on the one side of the substrate and covering the first electrode pattern and the second electrode pattern and containing a semiconductor; a protective layer located on the one side of the substrate and covering at least a part of the sensing layer, and containing a material different from that of the sensing layer; a first electrode pad disposed on the one side of the substrate to form a layer and electrically connected to the first electrode pattern; a second electrode pad disposed on the one side of the substrate and electrically connected to the second electrode pattern; and a housing accommodating the substrate and including a filter spaced apart from the substrate, wherein the substrate includes an opening formed adjacent to an outer boundary of the first and second electrode patterns.

The disclosure concerns a sensor device for determining the thermal capacity of a natural gas. The sensor device comprises a substrate, a recess or opening arranged in the substrate, a first heating component and a first sensing component. The first heating component comprises a first heating structure and a temperature sensor and the first sensing component comprises a temperature sensor. The sensor device is configured to measure the thermal conductivity of the natural gas at a first measuring temperature and at a second measuring temperature. The sensor device is configured to determine a first, in particular a constant, and a second, in particular a linear temperature coefficient of a temperature dependency function of the thermal conductivity and to determine the thermal capacity of the natural gas based on a fitting function. The fitting function is dependent on the first and the second temperature coefficient.

Tools, processes, and systems for in-situ fluid characterization based on a thermal response of a fluid are provided. The thermal response of a downhole fluid may be measured using a downhole thermal response tool and compared with thermal responses associated with known fluids. The properties of the downhole fluid, such as heat capacity, diffusivity, and thermal conductivity, may be determined by matching the thermal response of the downhole fluid with a thermal response of a known fluid and using the properties associated with the known fluid. The composition of the downhole fluid may be determined by matching the viscosity of the downhole fluid to the viscosity of known fluid. A downhole thermal response tool for cased wellbores or wellbore sections and a downhole thermal response tool for openhole wellbores or wellbore sections are provided.

An apparatus for determining thermograms of blood plasma or serum includes two or more reaction vessels that each comprise a temperature sensing coil and a heating coil that is coaxial with and exterior to, or interleaved with, the temperature sensing coil. The apparatus also includes a heat conductive body having two or more cavities formed therein for receiving the reaction vessels. A corresponding method includes activating the heating coils of the reaction vessels and collecting temperature data for the reaction vessels with the temperature sensing coils.

A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.

A method and apparatus for the direct measurement of specific heat at constant pressure (Cp). A control fluid of a known amount is supplied to a near adiabatic test chamber having a volume. A collapsible bladder within the test chamber is inflated with an incompressible fluid, changing the volume of the test chamber. The change in pressure and temperature of the control fluid relative to the change in volume of the test chamber is measured. The steps are repeated with a sample fluid. The isentropic enthalpy and specific heat at constant pressure of the sample fluid is determined.