An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

An environmental testing device includes a heat insulation chamber that includes a test chamber and is formed using a heat insulation panel that is electrically conductible. The heat insulation chamber includes a chamber body having an entrance and a door that opens and closes the entrance. A heat insulation panel forming the chamber body includes an outer panel and an inner panel. A radiation-absorbent material is disposed between the outer panel and the inner panel. The heat insulation panel forming the chamber body and a heat insulation panel forming the door are connected to each other in an electrically conductible manner.

An environmental testing device includes a heat insulation chamber that includes a test chamber and is formed using a heat insulation panel that is electrically conductible. The heat insulation chamber includes a chamber body having an entrance and a door that opens and closes the entrance. A heat insulation panel forming the chamber body includes an outer panel and an inner panel. A radiation-absorbent material is disposed between the outer panel and the inner panel. The heat insulation panel forming the chamber body and a heat insulation panel forming the door are connected to each other in an electrically conductible manner.

A method to measure the transient thermal diffusivity performance of a heat dissipation module by selecting two measurement points on the surface of the heat dissipation module, and locating the two measurement points at the same side of the thermal center point but different distances, and measuring the temperature of the two measurement points separately and using first equation which is the analytical solution of the energy equation. After calculating the first equation, second and third equations are used to find M. The distance X1 between M and the first measurement point and temperature T1 at a moment of transient state are also inserted into the first equation to obtain the value of the thermal diffusivity coefficient α, which represents the transient thermal diffusivity performance for the heat dissipation module.

A method to measure the transient thermal diffusivity performance of a heat dissipation module by selecting two measurement points on the surface of the heat dissipation module, and locating the two measurement points at the same side of the thermal center point but different distances, and measuring the temperature of the two measurement points separately and using first equation which is the analytical solution of the energy equation. After calculating the first equation, second and third equations are used to find M. The distance X1 between M and the first measurement point and temperature T1 at a moment of transient state are also inserted into the first equation to obtain the value of the thermal diffusivity coefficient α, which represents the transient thermal diffusivity performance for the heat dissipation module.

A process fluid temperature measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. A temperature sensor assembly is disposed within the thermowell and includes a first temperature sensitive element and a second temperature sensitive element. The first temperature sensitive element is disposed within the thermowell adjacent a distal end of the thermowell. The second temperature sensitive element is spaced apart from the first temperature sensitive element along a spacer having a known thermal conductivity. Transmitter circuitry is coupled to the first and second temperature sensitive elements and is configured to perform a heat flux calculation to provide a process fluid temperature output.

A process fluid temperature measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. A temperature sensor assembly is disposed within the thermowell and includes a first temperature sensitive element and a second temperature sensitive element. The first temperature sensitive element is disposed within the thermowell adjacent a distal end of the thermowell. The second temperature sensitive element is spaced apart from the first temperature sensitive element along a spacer having a known thermal conductivity. Transmitter circuitry is coupled to the first and second temperature sensitive elements and is configured to perform a heat flux calculation to provide a process fluid temperature output.

A system for determining one or more properties of one or more gases. The system comprises sensors configured to measure thermal conductivity and exothermic responses of a sample at multiple temperatures. Sensor responses to exposure to a gas sample at two or more temperatures are compensated and analyzed by a subsystem. The subsystem is configured to determine a thermal conductivity of the gas sample at each of the two or more temperatures and determine at least one component of the gas sample based at least in part on the thermal conductivity value of the sample at each of the two or more temperatures. Related systems and methods of determining one or more properties of a sample are also disclosed.

A system for determining one or more properties of one or more gases. The system comprises sensors configured to measure thermal conductivity and exothermic responses of a sample at multiple temperatures. Sensor responses to exposure to a gas sample at two or more temperatures are compensated and analyzed by a subsystem. The subsystem is configured to determine a thermal conductivity of the gas sample at each of the two or more temperatures and determine at least one component of the gas sample based at least in part on the thermal conductivity value of the sample at each of the two or more temperatures. Related systems and methods of determining one or more properties of a sample are also disclosed.